[Seminar on 7/19] Automotive Technology Exhibition 2019 Nagoya

You can analyze and measure the durability and strength of materials yourself! Automatic MSE testing! Automatically acquires characteristics and distributions in the depth direction from the material surface.

The device consists of a "physical etching (particle erosion) section" and an "erosion shape measurement section." By precisely eroding the sample surface and continuously acquiring depth measurements, it is possible to evaluate strength comparisons, strength cross-sectional distributions, thickness and strength of each layer, and in-plane strength distributions. This allows for the acquisition of a large amount of information in a short time on material surfaces that have been difficult to measure until now. It enables the quantification of subtle differences, such as comparing film strengths from different deposition processes or visualizing degradation levels at various depths, which can help determine the direction of development within the company. Additionally, the particle erosion method can be tested on objects that are not flat, including curved or complex shapes. Actual parts can be tested as they are.

• Other measurement, recording and measuring instruments
• Testing Equipment and Devices
• Strength Testing Equipment

A new method for precisely measuring the surface strength of thin films and materials through commissioned analysis and testing. This innovative strength testing method utilizes impact energy, which is not present in conventional tests.

The testing method is a new mechanical property (strength) testing technique that can measure the strength of material surfaces with nanometer-level resolution. It has two innovative features: one is the ability to obtain a "continuous strength distribution from the surface to the interior," and the other is the "visualization of the dual characteristics of materials, such as being hard and brittle." It allows for the easy acquisition of strength distribution in thin films, coatings, and surface treatments, which can be useful for material evaluation and design quality assurance. [Purpose of Development] The MSE test is a technology developed to measure the precise mechanical properties (strength domain) of material surfaces, originating from a collaboration between industry and academia with Fukui University. [Technology] It measures strength by using the phenomenon of precisely eroding (fracturing) the test specimen with a large number of micro-particles. As a result, it enables strength measurement at various depths while eroding from the surface, creating a new effect of obtaining a continuous strength distribution from the surface to the interior. *For more details, please download the catalog or contact us!

• Testing Equipment and Devices
• Strength Testing Equipment
• Contract measurement

A precision grinding device that even beginners can easily use! Difficult high-precision pre-processing can be done by anyone! Ultra-low angle diagonal grinding and relief grinding that make deep grinding possible!

"PERET" is a polishing device for pre-analysis treatment during sample preparation, developed from MSE technology, aimed at observation and analysis. Our new product "PERET" addresses the following concerns: "I want to perform polishing more precisely and see cross-sections at a 1μ scale." "I want to conduct advanced analysis with the microscope I have." It is designed to solve the problems faced by customers in research and development departments and product analysis. With angled polishing, it enables depth-direction observation and analysis using SEM or XPS over a wide area from a single polished surface. Additionally, relief polishing allows for precise observation and analysis of defects and material distribution within a large area of the polished surface. 【Features】 ■ Does not cause chemical alteration that occurs from nm-level removal ■ Relief polishing, angled polishing, and polishing without resin alteration ■ High-resolution polishing at 10nm increments ■ Polishing that brings cross-sections to the surface *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment

The particle visualization technology developed under our brand "ViEST" has a very high level of detection sensitivity, capable of visualizing the suspended or adhered states of micro and nano-sized particles in real time. We are engaged in the sale of visualization systems and contract services for evaluation (investigating particles and airflow in production processes, inside and outside manufacturing equipment, evaluating the performance of cleaning products, proposing yield improvement measures, etc.) both domestically and internationally. In manufacturing environments, invisible fine foreign substances, dust generation, particle adhesion due to static electricity, and airflow disturbances can cause quality defects and reduced yield. Our company clarifies these contamination factors through visualization technology and provides consistent support from identifying the source of the problem to considering and confirming improvement measures. Do you have any of the following concerns? - Unable to identify the cause of foreign matter contamination - Want to check airflow and cleanliness in clean rooms - Want to understand dust generation from manufacturing equipment and transport systems - Want to reduce particle adhesion to films and substrates - Want to improve contamination that leads to reduced yield

In this seminar, we will focus on the challenges of sensitivity reduction and separation performance in GC/MS analysis, and introduce the latest technologies and practical know-how that can help solve these issues. This time, we will also have a presentation from LECO Japan, who will discuss the benefits and applications of high-resolution and high-separation analysis with real examples. Additionally, Restek will introduce column technologies effective for improving sensitivity in trace analysis. Restek: We will explain the inert performance of the RMX GC column, which is effective for improving sensitivity in trace analysis, and the column technology that suppresses adsorption loss in low concentration areas, along with actual measurement data. LECO: We will present the latest application examples of comprehensive detection of trace components using high-sensitivity GC-TOFMS and RMX columns, including environmental, aroma, and material analysis. This content is recommended for anyone involved in multi-component analysis using GC/MS, whether for target or non-target analysis, as well as those who are just starting out. We will provide clear explanations suitable for beginners in GC/MS, so please join us.

[Speaker] Hidetaka Ishibashi, Director of IoT Planning Department, KDDI Corporation [Key Lecture Content] Against the backdrop of declining birth rates, an aging population, and labor shortages, the nature of mobility is reaching a significant turning point. KDDI has established a "Mobility Control Center" to integratively support new mobility solutions such as autonomous vehicles, drones, and robots, based on the knowledge and infrastructure cultivated through the operation of connected cars. In this lecture, we will focus on the communication and monitoring functions that are essential for the social implementation of each mobility solution, discussing the challenges and efforts towards their resolution, as well as the future vision that KDDI aims for. [Lecture Items] 1. Efforts and history of connected cars 2. Development and initiatives for new mobility 3. Importance of remote monitoring in a mobility society 4. Challenges in communication and monitoring and efforts towards solutions 5. Future vision of the mobility society that KDDI aims for 6. Q&A

[Speaker] Ayako Tejima, Chief Researcher, and Yi Zhang, Senior Researcher ICT Research and Consulting Department, Information and Communications Research Institute, Inc. [Key Lecture Content] The rapid increase in power consumption of data centers due to the proliferation of generative AI has become a critical issue that affects the sustainable growth of AI businesses. In this lecture, we will explain the photonic-electronic convergence technology, which is being implemented in society as a trump card to break through this "power wall." While analyzing the research and development trends of global players, primarily major semiconductor companies in the United States, and market trends, we will present the trends of NTT's IOWN, the winning strategies of Japanese companies with strengths in materials, implementation, and equipment, as well as future business opportunities and challenges toward social implementation from a business perspective. [Lecture Items] 1. Why photonic-electronic convergence now? 2. What is photonic-electronic convergence? 3. Global market trends 4. Japan and the initiatives of Japanese companies 5. Future outlook 6. Challenges 7. Q&A / Business card exchange

In the ever-evolving aerospace industry, the keywords are "environmental resistance," "high performance," and "lightweight" for equipment. This seminar has been planned as an opportunity to provide various topics, from explanations of difficult-to-machine materials such as titanium and Inconel to the latest trends in the space business. We hope you will watch and find hints for the next stage.