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  3. 信越ポリマー
  4. Notice of Participation in the 8th High-Performance Plastics Exhibition
SEMINAR_EVENT
  • Oct 31, 2019
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Oct 31, 2019

Notice of Participation in the 8th High-Performance Plastics Exhibition

信越ポリマー 信越ポリマー
Shin-Etsu Polymer will be exhibiting at the 8th Advanced Functional Plastics Exhibition held at Makuhari Messe. As a resin processing manufacturer, Shin-Etsu Polymer is committed to the application and development of foundational technologies such as "materials and formulations," "design," "processing processes," and "evaluation and analysis" for various resins including silicone. We respond to our customers' diverse needs across a wide range of fields, from automotive and information technology to semiconductors and construction. We will be showcasing our technologies that apply and integrate foundational technologies widely. We sincerely look forward to your visit.
Date and time Wednesday, Dec 04, 2019 ~ Friday, Dec 06, 2019
10:00 AM ~ 06:00 PM
The last day will be until 17:00.
Capital Venue: Makuhari Messe Booth Number: Hall 5, 26-25
Entry fee Free If you do not have an invitation ticket, it will cost 5000 yen per person.
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From automobiles to construction-related needs! Shin-Etsu Polymer meets diverse demands.

The comprehensive strength of the Shin-Etsu Group, its technological capabilities as a resin processing manufacturer, and its ability to respond to global needs. We meet our customers' diverse needs with these three strengths!

Shin-Etsu Polymer was established in 1960 as a PVC processing manufacturer and has been working to apply its foundational technologies in "materials and formulations," "design," "processing processes," and "evaluation and analysis" for various resins, including silicone. Currently, as a resin processing manufacturer, we respond to diverse customer needs across a wide range of fields, from automotive and information devices to semiconductors and construction materials. 【Business Industries (Partial)】 ■ Automotive ■ Information Devices ■ Semiconductors and Electronic Components ■ Construction Materials, etc. *For more details, please download the PDF or contact us.

  • Other polymer materials
  • paint

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Self-fusing silicone rubber tape "Polymulti Tape"

Simple maintenance with just wrapping! Three types with different widths and lengths are available!

The "Polymer Multi Tape" is a self-fusing silicone rubber tape that bonds and integrates silicone materials by stretching and wrapping them together. Easy maintenance by simply wrapping it around. We offer a lineup of products in different widths and lengths to suit various sites and applications. It can be used for many purposes such as water leak repairs, rust prevention, insulation covering, bundling, and anti-slip applications. 【Features】 ■ The tape fuses and integrates with itself when stretched and wrapped. ■ No adhesives or plasticizers are used, so it does not leave any sticky residue when removed. ■ Translucent, making it easy to check the internal application. ■ Excellent weather resistance silicone rubber. *For more details, please refer to the PDF document or feel free to contact us.

  • Other consumables

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Silicone Adhesive Sheet "Polymer Ace UG"

Leakage and corrosion prevention measures, easy installation and long lifespan! We meet the demands of infrastructure maintenance.

"Polymerace UG" is a silicone adhesive sheet made from silicone as the raw material. Simply clean the repair surface and apply it, and the installation is complete. It reacts to temperature and moisture in the air, curing and bonding. It can be easily processed on-site without special tools or power, and it excels in water resistance, heat resistance, cold resistance, and weather resistance, while also being flame-retardant. It adheres to FRP, metals (iron and SUS), glass, and wood. 【Features】 ■ The material is transparent, allowing for substrate verification ■ Can be applied in layers ■ Conforms to curved surfaces ■ Follows the unevenness of concrete surfaces *For more details, please refer to the PDF document or feel free to contact us.

  • Adhesive tape
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信越ポリマー
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[Notice of Exhibition Participation by Fukuda Co., Ltd.] TOKYO PACK 2026 Tokyo International Packaging Exhibition

  • NEW
  • SEMINAR_EVENT

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

Oct 08, 2026

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Creating an environment that thrives even in extreme heat: Introducing the results of closed-type greenhouse demonstrations and summer cooling methods - Exhibiting at the 14th Agricultural WEEK (commonly known as J-AGRI)

  • NEW
  • SEMINAR_EVENT

Yazaki Energy System will be exhibiting at the "14th Agricultural WEEK (commonly known as J-AGRI)" held at Makuhari Messe. In response to challenges surrounding agriculture, such as record heat and soaring energy prices, our company proposes an agricultural system that utilizes surplus solar heat and waste heat from factories during the summer to support stable cultivation throughout the year, from winter heating to summer cooling. ■ Exhibition Details (Booth Number: 25-47) <Closed-type Agricultural House> Results from the second season and initiatives for the third season <Localized Cooling in Solar-Powered Agricultural Houses> Mechanism of substrate cooling, comparison of energy consumption with spatial cooling, growth conditions this summer <Cooling and Heating with Solar Heat> Examples of crown heating and house cooling, utilization of surplus heat in summer <Cooling of Crops and Workers with Well Water> Exhibition of a prototype well water cooler and proposals for the use of cooling jackets When you visit, please be sure to stop by our booth.

Oct 06, 2026

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Information on Autumn/Winter Internships for the Class of 2028

  • NEW
  • SEMINAR_EVENT

We would like to inform you about the autumn and winter internship opportunities for the 2028 graduates. 1. Open Company Dates: October 23, 2026 (Friday), November 11, 2026 (Wednesday), December 10, 2026 (Thursday), January 21, 2027 (Thursday) Time: 13:30 - 15:30 Location: Online (Microsoft Teams) 2. 1-Day Job Experience Dates: November 17, 2026 (Tuesday), December 16, 2026 (Wednesday) January 15, 2027 (Friday), January 27, 2027 (Wednesday), February 4, 2027 (Thursday), February 10, 2027 (Wednesday), February 18, 2027 (Thursday) Time: 10:00 - 17:30 (tentative) Location: Takaya Corporation Headquarters (661-1 Ibara-cho, Ibara City, Okayama Prefecture)

Oct 06, 2026

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Notice of Participation in FOOD Expo 2026 (November 11-13, 2026)

  • NEW
  • SEMINAR_EVENT

Notice of participation in the "FOOD Expo 2026." 【Date and Time】  November 11 (Wednesday) - 13 (Friday), 2026  Opening hours: 10:00 AM - 5:00 PM 【Venue】  Tokyo Big Sight  East Hall 2, Booth Number B-36 【Exhibits】  Cardboard insulated boxes  Craft cooler cubes  Vacuum insulated panel  Pallet cubes

Oct 06, 2026

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[Seminar] From Generative AI to Physical AI: The Cutting Edge of Market and Industry Structure and Technology Development

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  • SEMINAR_EVENT

[Lecture Topics] 1. Co-creation Strategy to Deliver AI to the Field - Business Development and Joint Ventures in the Era of Generative AI and Physical AI Mr. Haruto Suzuki, Industrial and Regional Research Department, Development Bank of Japan 1. The Mechanism of Generative AI and Its Current Utilization by Companies 2. Expansion of the Generative AI Market and AI Infrastructure 3. Transition from Generative AI to Physical AI 4. Bottlenecks in Social Implementation and Solutions through Joint Ventures 5. Formation of an Implementation Ecosystem through Policy and Finance 6. Q&A / Business Card Exchange 2. Needs, Development Trends, Future Possibilities, and Challenges of Physical AI Mr. Kazushi Asama, Senior Researcher, Next-Generation Robot Research Organization, Waseda University / Emeritus Professor, University of Tokyo 1. What Physical AI Means 2. Needs for Physical AI and the Technological Trends of Generative AI Behind It 3. Development Trends of Physical AI 4. Future Possibilities and Challenges of Physical AI 5. Q&A / Business Card Exchange

Oct 06, 2026

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