We will be exhibiting at the 34th NePCON Japan - Electronics Development and Implementation Exhibition - from January 15 to 17, 2020.

Multi-functional plasma cleaning device. Sample testing currently accepted. Suitable for cleaning and hydrophilization, improving solder wettability, and optimal for pre-treatment before mounting.

Simplifying and reducing the cost of semiconductor manufacturing equipment chambers for application in plasma cleaning. Achieving unprecedented surface treatment through plasma mode switching mechanisms (RIE, DP) and multi-gas (Ar, N2, O2, H2) processes. Substrate cleaning (removal of oxides, organic materials, and fine foreign substances). Hydrophilic treatment (pre-treatment for plating, improving solder wettability). Hydrophobic treatment (pre-treatment before wet processes). Proven results in reflow pre-treatment with significant improvements in solder wettability. Extensive track record in mass production lines for high-end products (high-density mounting substrates, flexible substrates, power device modules). Inline and sheet-type options are available in the standard lineup to match substrate and line configurations.

• Other mounting machines

Achieving fluxless, voidless reflow from power modules to wafer bumps. New model launched for upgraded quality! *Currently supporting sample testing.

Batch-type vacuum soldering equipment that achieves high-reliability soldering. High-speed and uniform soldering in a low-oxygen atmosphere through vacuum evacuation. Achieves a high level of void-free soldering through combinations of vacuum, atmospheric pressure, and various atmospheres (reduction, inert). A basic model of the standard process for high-reliability power modules for automotive applications. A new model has been introduced to increase processing capacity and performance. The new model has been installed at the factory. Actively responding to equipment tours and sample tests. Conducting void-free, flux-free soldering tests, including plasma cleaning for pre-treatment. ★ We will exhibit at NEPCON Japan 2020! * For more details, please refer to the PDF document or feel free to contact us.

• Reflow Equipment
• Soldering Equipment
• Electric furnace

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to attend this event. 【 Exhibition Name 】 27th INTERPHEX Week Tokyo https://www.interphex.jp/tokyo/ja-jp.html 【 Dates 】 July 9 (Wednesday) - 11 (Friday), 2025 10:00 AM - 5:00 PM 【 Venue 】 Tokyo Big Sight (3-11-1 Ariake, Koto-ku, Tokyo 135-0063)

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely invite you to visit us during this busy time. 【 Exhibition Name 】 Automotive Technology Exhibition 2025 YOKOHAMA https://aee.expo-info.jsae.or.jp/ja/yokohama/ (An "online exhibition" will also be held during and around the event period) 【 Dates 】 May 21 (Wednesday) - 23 (Friday), 2024 10:00 AM - 6:00 PM *On the final day, 9:00 AM - 4:00 PM (Online exhibition: May 14 (Wednesday) - June 4 (Wednesday)) 【 Venue 】 Pacifico Yokohama (1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa Prefecture) Our booth number: "Concourse 505"

Nitto Kohki will be exhibiting at the "Data Center EXPO" held at Makuhari Messe Hall 1 from Wednesday, October 23 to Friday, October 25. [Booth Number: A6-23] At this exhibition, we will showcase the "Compact Zero Spill Coupler," which is specifically designed for data centers, including supercomputers. We will also present the "Blind Mate Type," a fitting exclusively for server cooling piping, as a reference exhibit.

[Speaker] Kenji Kikuchi, Executive Fellow, MDB Business Division, Japan Management Association Research Institute [Lecture Topics] 1. Important latest research trends to consider for the future 2. Latest business information gathering methods for future insights 3. Case studies on information gathering - perspectives on information collection and utilization 4. "Future insights" perspectives that leaders and personnel responsible for expanding existing businesses, new businesses, new product development, and exploring new applications should know 5. Introduction of the latest business information sources to pay attention to in the AI era for "future insights" 6. Q&A / Business card exchange

[Speaker] NTT ME Corporation Director of Social Infrastructure Design Department, Mr. Osamu Sasaki [Key Lecture Content] Starting from the challenges faced through the maintenance and operation of the vast communication infrastructure owned by NTT East Japan, such as aging equipment, a shortage of workforce, and the intensification of disasters, we will organize the structural issues that the entire social infrastructure sector, including roads and water supply and sewage systems, faces. Based on this, we will present ideas for realizing sustainable social infrastructure, including the transition to smart maintenance and preventive maintenance utilizing accumulated data. Furthermore, we will introduce the direction of initiatives considered by NTT East Japan, future prospects, and remaining challenges. [Lecture Items] 1. Past initiatives and challenges at NTT East Japan 2. Challenges faced by the social infrastructure sector 3. Towards the realization of sustainable social infrastructure 4. Direction of initiatives considered by NTT East Japan 5. Future initiatives and challenges 6. Q&A / Business card exchange