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  6. Plasma cleaning device "POEM" (plasma cleaner)

Plasma cleaning device "POEM" (plasma cleaner)

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last updated:Aug 20, 2024

神港精機 東京支店
神港精機 東京支店
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Multi-functional plasma cleaning device. Sample testing currently accepted. Suitable for cleaning and hydrophilization, improving solder wettability, and optimal for pre-treatment before mounting.

Simplifying and reducing the cost of semiconductor manufacturing equipment chambers for application in plasma cleaning. Achieving unprecedented surface treatment through plasma mode switching mechanisms (RIE, DP) and multi-gas (Ar, N2, O2, H2) processes. Substrate cleaning (removal of oxides, organic materials, and fine foreign substances). Hydrophilic treatment (pre-treatment for plating, improving solder wettability). Hydrophobic treatment (pre-treatment before wet processes). Proven results in reflow pre-treatment with significant improvements in solder wettability. Extensive track record in mass production lines for high-end products (high-density mounting substrates, flexible substrates, power device modules). Inline and sheet-type options are available in the standard lineup to match substrate and line configurations.

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P7_POEM.jpg

Plasma cleaning device "POEM" (plasma cleaner)

P7_POEM.jpg
P7_POEM.jpg
  • Related Link - https://www.shinko-seiki.com/products/181/
  • Special site - Product/service details - https://pr.mono.ipros.com/shinko-seiki/product/

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basic information

A vacuum plasma device equipped with an electrode switching mechanism and multiple gas systems in a compact housing, offering significant effects. The lineup ranges from a small type for φ230 processing to a large type compatible with 500mm square (φ600mm). The automatic transport mechanism is individually designed to match substrate dimensions, production line configuration, and production volume, supporting line automation and high throughput. With extensive experience in individual process development through cleaning, hydrophilic treatment, ashing, light etching, hydrophobic treatment, and sample testing.

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Applications/Examples of results

Printed circuit board cleaning pre-treatment before soldering Power device module soldering pre-treatment Lead frame cleaning Resin surface treatment (hydrophilization)

catalog(7)

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Batch-type Vacuum Soldering Equipment Catalog

Batch-type Vacuum Soldering Equipment Catalog

PRODUCT
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Plasma Etching Equipment Catalog

Plasma Etching Equipment Catalog

PRODUCT
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Plasma Etching Device "EXAM" Brochure

Plasma Etching Device "EXAM" Brochure

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Polyimide cure device

Polyimide cure device

PRODUCT
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Mass production plasma cleaning device

Mass production plasma cleaning device

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Side electrode ion plating device

Side electrode ion plating device

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Hydrogen atmosphere conveyor furnace

Hydrogen atmosphere conveyor furnace

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News about this product(1)

We will be exhibiting at the 34th NePCON Japan - Electronics Development and Implementation Exhibition - from January 15 to 17, 2020.

  • Seminar・Event

Shinko Precision Co., Ltd. will be exhibiting at the 34th Nepcon Japan - Electronics Development and Implementation Exhibition - held at Tokyo Big Sight. We will showcase the actual machine of our renewed vacuum reflow device. You will be able to experience the upgraded equipment live. Additionally, we plan to display panels for our ICP etching equipment compatible with next-generation devices such as SiC and GaN, as well as a heat treatment device compatible with reducing atmosphere for next-generation bonding materials. We sincerely look forward to your visit. 【Exhibited Products】 ■ Plasma Cleaning Device "POEM" (Plasma Cleaner) ■ Inline Vacuum Soldering Device ■ Batch Vacuum Soldering Device (Fluxless Reflow Vacuum Reflow)

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神港精機

神港精機 東京支店

Industrial Machinery

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Shinko Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.

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