Multi-functional plasma cleaning device. Sample testing currently accepted. Suitable for cleaning and hydrophilization, improving solder wettability, and optimal for pre-treatment before mounting.
Simplifying and reducing the cost of semiconductor manufacturing equipment chambers for application in plasma cleaning. Achieving unprecedented surface treatment through plasma mode switching mechanisms (RIE, DP) and multi-gas (Ar, N2, O2, H2) processes. Substrate cleaning (removal of oxides, organic materials, and fine foreign substances). Hydrophilic treatment (pre-treatment for plating, improving solder wettability). Hydrophobic treatment (pre-treatment before wet processes). Proven results in reflow pre-treatment with significant improvements in solder wettability. Extensive track record in mass production lines for high-end products (high-density mounting substrates, flexible substrates, power device modules). Inline and sheet-type options are available in the standard lineup to match substrate and line configurations.
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basic information
A vacuum plasma device equipped with an electrode switching mechanism and multiple gas systems in a compact housing, offering significant effects. The lineup ranges from a small type for φ230 processing to a large type compatible with 500mm square (φ600mm). The automatic transport mechanism is individually designed to match substrate dimensions, production line configuration, and production volume, supporting line automation and high throughput. With extensive experience in individual process development through cleaning, hydrophilic treatment, ashing, light etching, hydrophobic treatment, and sample testing.
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Applications/Examples of results
Printed circuit board cleaning pre-treatment before soldering Power device module soldering pre-treatment Lead frame cleaning Resin surface treatment (hydrophilization)
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Company information
Shinkou Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.