Simultaneous processing of two wafers for high throughput. Contributes to reducing wafer transfer costs.
The SPE-2136A is a plasma cleaner device capable of residue removal, surface modification, and ashing treatment for wafers ranging from φ4 to φ6 inches. It comes with an automatic transport mechanism, which helps prevent wafer breakage and reduces labor costs and working time associated with wafer transfer. The process chamber can handle two wafers simultaneously, achieving high throughput. 【Features】 ■ Compact design measuring 1400(W) × 3000(D) × 1900(H) mm ■ Distribution within the wafer is ±5% or less ■ Compatible with ultra-thin piezoelectric wafers such as SAW devices ■ Ar plasma cleaning is also available as an option *For more details, please refer to the documentation. Feel free to contact us with any inquiries.
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【Examples of Use】 - Removal of resist from various wafer electronic components - Surface modification before post-process plating - Removal of organic contamination - Surface modification of resin materials 【Main Specifications】 ◎ Processing Method: Batch system with automatic transport ◎ Exhaust Pump: Dry pump ◎ Dimensions: 1400(W)×3000(D)×1900(H)mm ◎ Weight: 1000kg ◎ Power Capacity: AC200V(3φ)/15kVA(44) ◎ Vacuum Chamber Size (Processing Room): φ440×195(H)mm *For more details, please refer to the materials. Feel free to contact us with any inquiries.
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Showa Vacuum Co., Ltd. manufactures and sells vacuum technology application devices (vacuum equipment) such as vacuum deposition devices and sputtering devices, primarily focused on equipment that forms thin films on specific substrates in a vacuum.