This product is an example of a customized product tailored to your specifications. We will customize it according to your intended use.
This product is a parallel plate type plasma treatment device. It allows switching between two plasma modes, DP (Direct Plasma) mode and RIE (Reactive Ion Etching) mode, using only the controls on the panel. It can be used for various process applications, such as improving adhesion and sealing in die attach during assembly processes like BGA.
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basic information
【Features】 ○ Easy plasma mode switching ○ High-speed tracking capability ○ Diverse customization options ○ Resolution of future convergence issues ● We also manufacture equipment tailored to customer specifications. ● For other functions and details, please contact us.
Price information
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Delivery Time
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Applications/Examples of results
【Applications】 ○ Implementation processes in the fields of BGA and CSP ○ Improvement of underfill properties through substrate surface modification using O2 plasma ○ Enhancement of wire bonding properties by removing bonding inhibitors with Ar plasma ● For other functions and details, please contact us.
Company information
Esclafte Co., Ltd. is a company where experienced expert engineers shape our customers' requests and contribute to the progress and development of society through the supply of excellent products.
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