昭和真空 Product Lineup

This wafer trimming equipment contributes to precision machining because it can flatten the unevenness of the wafer surface to σ=1.0nm or less by irradiating a φ4 inch or φ6 inch wafer with converged ion beam.

• Other machine tools

The newly developed injection molding machine-linked high-speed sputtering and polymerization system, SPP-SERIES, enables automatic film formation of metal films and protective films on resin substrates used in automotive and decorative parts. It is capable of fully automatic vacuum film formation (sputtering and polymerization) on injection molded substrates. 【Target Products】 ◆ Automotive headlamp reflectors ◆ Mirrors ◆ Metal decorative films *For more details, please contact us or download the PDF to view.

• Vacuum Equipment
• Sputtering Equipment

The newly developed injection molding machine-linked high-speed sputtering and polymerization system, SPP-SERIES, enables automatic film formation of metal films and protective films on resin substrates used in automotive and decorative parts. It is capable of fully automatic vacuum film formation (sputtering and polymerization) on injection-molded substrates. 【Features】 ○ Fully automatic ○ Cycle time: 80 sec (Al: 100nm + SiOx: 20nm) ○ High adhesion → High adhesion can be achieved even without an undercoat For more details, please contact us or download the catalog.

• Vacuum Equipment
• Sputtering Equipment

The optical thin film deposition device "SGC-S1700 Series" is a standard machine dedicated to AR coating that incorporates the technology of Sapio 1300 while enhancing cost performance. It offers a variety of specification options, including RF ion sources, optical monitors, and inverted pallets. 【Features】 - High-level fusion of mass production performance and work efficiency - Installation space is only 20% larger than the 1300 class - Product yield is more than double For more details, please contact us or download the catalog.

• Evaporation Equipment

Showa Vacuum has fully revamped its bestselling device, the SPH-2500, which boasts approximately 15 years of proven performance. The load-lock type sputtering device "SPH-2500-II" inherits the features of the previous model while incorporating the latest technology, achieving performance that surpasses the conventional model in every aspect. 【Features】 ○ Dimensions: W1200×D2500×H1440, maintaining the same footprint while significantly reducing height ○ By improving the cathode, target usage efficiency has been greatly increased to 44% ○ Adopting a rack and pinion system eliminates transport issues caused by roller slippage For more details, please contact us or download the catalog.

• Sputtering Equipment

It enables stable discharge over a wide range and can be used for various applications, from improving adhesion from non-shift films of optical filters to resin substrates. Our unique approach allows for reliable ignition and stable discharge performance. 【Features】 ○ High-output ion source with beam current of 1500mA / beam voltage of 1500V / ion current density of over 100μA/cm² ○ Achieves uniformity of ion current density distribution within ±10% (measured with the 1300 and 1550 devices) at high power → Measurement results from Sapio-1300, limited to specified conditions by Showa Vacuum Co., Ltd. ○ Adoption of an auto-matcher for the neutralizer to ensure reliable ignition performance and stabilization ○ The use of a newly developed collector electrode (patent pending) enables high output with an emission current of 2500mA → Prevents particle generation due to charge-up For more details, please contact us or download the catalog.

• Ion implantation equipment

The high vacuum annealing device "SAF-52T-II" is developed for the purpose of removing internal stress distortions that occur during the processing of quartz oscillators and for thermal treatment to stabilize electrode films. It features a heating shelf measuring W460×D350×H35mm with a total of 10 independent processing chambers, capable of holding up to 60 standard trays measuring 170×134mm. 【Features】 ○ Equipped with two independently operable processing chambers ○ Enhances production efficiency and reduces cycle time ○ Efficient cycle time and labor-saving through full automation For more details, please contact us or download the catalog.

• Annealing furnace

The inline frequency adjustment device "SFE-X2012" separates the processing chamber from the extraction chamber and is equipped with ion sources for both high and low frequencies, enabling efficient operation with minimal idle time. It is equipped with two IGF-201 type 100mm beam ion sources, which were also used in the SFE-B03. Each ion source can process up to 24 units simultaneously, for a total of 48 units. The device adopts the high precision, high stability, and high reproducibility transport mechanism proven in the SFE-B03. Frequency adjustment for small workpieces (2.0×1.6, 1.6×1.2), which was previously difficult in inline processes, can now be stably mass-produced. Each unit allows for the disassembly of individual devices, designed with maintenance in mind. 【Device Performance】 ○ Tact Time: 0.3 sec/pc or less * For workpieces over 18MHz and more than 24 units in a row ○ Adjustment Accuracy: ±1.5 ppm or less ○ Processing Capacity: Up to 24 rows (p4.0) × 32 columns ○ Production Volume: Over 12,000 pcs/hour For more details, please contact us or download the catalog.

• Other semiconductor manufacturing equipment

The ion plating device "SIP-1600" is a machine for depositing metal films onto resin substrates. It is capable of depositing two types of materials in the same batch. It comes with two internal jigs and carts, providing high productivity. The ion plating mechanism allows for smooth film deposition. 【Features】 ○ Depending on the size of the workpiece, either a 6-axis or 8-axis self-rotation jig can be installed. ○ The resistance heating evaporation source is equipped with switchable electrodes (2 sets). ○ An ion plating mechanism is included. ○ Two jig carts are standard equipment. ○ The installation of a refrigeration unit has improved the exhaust speed for H2O. For more details, please contact us or download the catalog.

• Other semiconductor manufacturing equipment

The road lock-type frequency adjustment device "SFE-B03-II" has achieved space-saving, high precision, and low cost, with a takt time of 0.4 s/pcs or less. (※In the case of SMD 3.2 × 2.5, 24 MHz, H1000 ppm/s, L50 ppm/s) Equipped with a new ion gun (beam width: 100 mm), it can process 24 to 32 units simultaneously as standard. The high-precision, high-stability, and high-reproducibility transport mechanism allows for stable production of micro-works measuring 2.0 × 1.6 or less. It features an FL mode (load capacity automatic calculation mode). The maintenance of the ion gun body and contact mechanism has significantly improved. By adopting a two-chamber load lock system, the processing chamber is always maintained in a vacuum, so the takt time does not depend on the time for vacuum evacuation and atmospheric release. With the installation of an overdrive mechanism loader/unloader as an optional unit, continuous operation has become possible. 【Features】 ○ Compact design ○ High precision ○ Low cost ○ High stability ○ High reproducibility For more details, please contact us or download the catalog.

• Other semiconductor manufacturing equipment