Flatten the wafer surface and remove irregularities with ion beam
This wafer trimming equipment contributes to precision machining because it can flatten the unevenness of the wafer surface to σ=1.0nm or less by irradiating a φ4 inch or φ6 inch wafer with converged ion beam.
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basic information
[Applications] SAW devices/BAW devices for 5G high-frequency filters, optical devices for optical communications, etc. (We are also conducting trimming experiments for applications other than those mentioned above, and we will verify whether or not SST-M01T can be used.) For more details, please download and view the catalog.
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Applications/Examples of results
[Applications and Examples] SAW devices and BAW devices for 5G high-frequency filters, optical devices for optical communication, etc. (We will also conduct trimming experiments for items other than the above and verify their compatibility.)
Detailed information
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SST-M01T Wafer Trimming Device
Company information
Showa Vacuum Co., Ltd. manufactures and sells vacuum technology application devices (vacuum equipment) such as vacuum deposition devices and sputtering devices, primarily focused on equipment that forms thin films on specific substrates in a vacuum.
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