Supports automated mass production lines. Inline type, sheet type, and various types with flexible hardware configurations, all with a proven track record of high effectiveness of vacuum plasma in mass production lines.
Expanding a chamber configuration with a proven track record in advanced thin film devices for cleaning applications. Achieving high cleaning effectiveness across various substrates. Flexible hardware configuration and high process capability tailored to the substrate and production volume. Supporting cleaning, descumming, ashing, hydrophilic treatment, hydrophobic film treatment, and various other applications. A large plasma device with extensive experience from substrate mounting to material surface treatment.
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basic information
Proven results in cleaning and hydrophilization of various substrates using parallel plate high-frequency vacuum plasma. Compatible with mass production lines for printed circuit boards, power device modules, lead frames, resin films, and flexible printed circuit boards. Unique design of transport mechanisms and pre- and post-cleaning mechanisms, achieving optimal hardware configuration tailored to substrates and production volume, including inline transport of printed circuit boards and heat sinks, as well as sheet transport of flexible printed circuit boards. Achieves high throughput and high yield.
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Applications/Examples of results
Cleaning before substrate mounting, soldering, and reflow Cleaning before power device module mounting Cleaning and hydrophilization of flexible printed circuit boards Cleaning and hydrophilization of resin films and resin substrates Hydrophilization and surface treatment of resin molded products
Line up（1）
| Model number | overview |
|---|---|
| Plasma Cleaning Device "POEM" | A standard plasma cleaning device with a wealth of proven results Ideal for cleaning before substrate mounting and reflow |
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Company information
Shinko Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.
