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  1. Home
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  3. Manufacturing and processing machinery
  4. Semiconductor Manufacturing Equipment
  5. Ashing device
  6. Hydrogen Plasma Cleaning Device (Ion Cleaning Type)

Hydrogen Plasma Cleaning Device (Ion Cleaning Type)

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last updated:Nov 25, 2021

神港精機 東京支店
神港精機 東京支店
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H2 (Surface cleaning of various substrates using the reducing power of hydrogen plasma. Improved hydrophilicity and wettability due to the removal of surface oxide layers. A new surface cleaning technology using dry, room temperature treatment.)

A new type of multi-purpose plasma cleaning device with a proven track record has arrived. In addition to the conventional surface cleaning function using plasma, it now features a reduction cleaning function using hydrogen plasma. The ability to remove surface oxide layers has significantly improved, and the hydrophilicity of substrates after cleaning has greatly increased. It also supports conventional plasma cleaning as before. Furthermore, with new cleaning functions such as combined cleaning with traditional Ar plasma cleaning and two-step cleaning with O2 (oxygen) cleaning, the cleaning targets and effectiveness have been greatly enhanced compared to general plasma cleaning. This new plasma cleaning device can accommodate everything from small-scale to full-scale production lines.

    Ashing devicePlasma surface treatment equipmentOther surface treatment equipment
福菱セミコン プラズマクリーニング装置3.jpg

Hydrogen Plasma Cleaning Device (Ion Cleaning Type)

福菱セミコン プラズマクリーニング装置3.jpg
福菱セミコン プラズマクリーニング装置3.jpg
  • Special site - Product/service details - https://pr.mono.ipros.com/shinko-seiki/product/

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basic information

Plasma cleaning equipment for implementation substrates "POEM" and the hardware of mass production plasma cleaning equipment have been applied, and the cleaning gas and process recipes have been upgraded. Achieving purpose-specific cleaning processes with a wealth of recipes. In addition to high-reduction cleaning using hydrogen gas alone, MIX cleaning with physical cleaning/reduction cleaning using a mixed gas of Ar + H2. STEP cleaning with surface reduction cleaning (removal of surface oxide layers) using H2 plasma cleaning after organic matter removal by O2 cleaning. Balancing the physical cleaning effect of plasma ions and the reduction capability of hydrogen. A new dry cleaning device with effects not seen before.

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Applications/Examples of results

Implementation substrate cleaning Glass substrate cleaning for photomasks, etc. Surface modification and cleaning of resin films

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Company information

神港精機

神港精機 東京支店

Industrial Machinery

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Shinkou Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.

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The related categories of Ashing device

  • Manufacturing and processing machinery
  • Semiconductor Manufacturing Equipment
  • Ashing device
  • Scientific and Physics Equipment
  • Surface Treatment Equipment
  • Plasma surface treatment equipment
  • Other surface treatment equipment
          

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