A plasma cleaning device with extensive experience in removing DLC films from aspherical lenses. An essential dry film removal device for the repair of high-value-added molds.
Upgraded and customized the highly experienced plasma cleaning device "POEM" for DLC film removal. Improved the energy of ions during processing compared to conventional types, enabling the removal of dense DLC films. Proven results not only in the standard O2 cleaning process but also in the multi-gas process for the removal of various customized DLC films, including Si-containing DLC. Naturally, it also supports the removal of molding residues and oxidation layers on mold surfaces, as well as cleaning before plating. Provides proven processes for cleaning and surface treatment before and after mold specifications.
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basic information
A plasma cleaning device that achieves uniform plasma on a 250mm square processing stage. Improved ion energy compared to the conventional model "POEM." It removes DLC with stronger ion impact and O2 ions. It realizes a clean process that does not require substrate damage or waste liquid treatment through a dry process. It has a proven track record in creating fine processing molds while accommodating the removal of various DLC films through a multi-gas process accumulated in plasma etching. The plasma cleaning device is capable of not only DLC but also organic film etching and fine etching of quartz.
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Applications/Examples of results
DLC removal from aspheric lenses Cleaning and surface treatment of optical disc stampers Cleaning of molds for resin molding
Line up（1）
| Model number | overview |
|---|---|
| Plasma Cleaning Device "POEM" | A best-selling plasma cleaning device with a wealth of experience in pre-treatment of mounted substrates and surface treatment of resins. |
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Company information
Shinko Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.