We will exhibit at the 4th Smart Factory Expo.

Streamline the control panel! Achieve "miniaturization" and "cost reduction" through simplified wiring!

Murrelektronik's 'CUBE67' allows for bus changes without system modifications. By consolidating wiring within the control panel, it enables miniaturization and cost reduction. Additionally, the installation of devices is independent of the control and field bus, allowing for customization of control devices without changing I/O peripherals. 【Features】 - Cost reduction of I/O modules - Reduction of wiring labor - Space-saving *For more details, please download the catalog or contact us.

• Other electronic parts
• Other machine elements
• Control Panel

An optimal interface for sending various data from control panels to a computer.

The MODLINK MSDD series from Murrelektronik is a front panel interface that is optimal for sending various data from control panels to computers. It offers a lineup of inserts for power supplies, D-sub, RJ45, USB, and other international standards. Inserts for domestic AC 100V power supplies are also available. A flat blind plate is provided, allowing customers to freely attach connectors and switches. Customization on the customer side is also possible. When closed, it achieves a waterproof protection rating of IP65.

• Other electronic parts
• Other Connectors
• Board materials

Are you satisfied with the current wiring method? Free distribution of "Cost Comparison Based on Wiring Concepts" is available now!

The connection work of control panels and cables, which becomes a significant burden in machine wiring. In the selection of conventional wiring materials, the focus has been primarily on minimizing material procurement costs, often overlooking the total costs that include associated wiring work expenses, maintenance costs, and other hidden costs. Therefore, we will thoroughly compare the costs of the traditional wiring method using terminal blocks and terminal boxes with the "waterproof cable connectors and space-saving boxes" proposed by Mur Electronics, referred to as the 'space-saving solution.' We will also compare the costs when using the "IP67 waterproof remote I/O station," which can easily connect to major field buses with a single bus node. Please read on to see how the total costs change based on the differences in wiring concepts. [Content] We classify the wiring configuration concepts of machine wiring into seven categories and thoroughly compare how each configuration changes based on the following perspectives: - Advantages - Disadvantages - Suitable industries - Material costs - Labor costs - Technical level Additionally, examples of configurations using safety circuits, which have recently gained attention, are also included. *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

• Other electronic parts
• Other machine elements
• Control Panel

We are releasing a method to quickly and reliably advance IoT implementation! Significantly reduce wiring labor and downtime, among other factors.

Our company offers products from Mur Electonics that enable the smooth implementation of IoT. We are currently presenting a "Technical Document" that clearly introduces various solutions to address IoT challenges such as "wiring, programming, and connectivity"! (You can view it from "Download") 【Featured Technologies】 ■ "Active Wiring Reduction System" Converts existing fieldbus into a local bus optimized for wiring reduction. Wiring work can be reduced by up to 95%. ■ "DIGA (Self-Diagnosis Gateway)" Visualizes diagnostic information of remote I/O without the need for programming. Significantly reduces machine downtime. ■ "IODD on Board" By incorporating IODD into the device information file of the IO-Link master, bulk configuration of multiple IO-Link devices can be achieved on the IO-Link master. <Exhibiting at the Industrial Open Network Exhibition 2017> We will showcase various solutions! Dates: August 24, 2017 (Tokyo, Ota Ward Industrial Plaza PiO) August 29, 2017 (Osaka, Grand Cube Osaka) Time: 10:00 AM - 6:00 PM

• Wiring materials
• Other machine elements
• connector

Covering all types of equipment such as machinery, machine tools, and various systems! A wide lineup available!

Our company handles LAPP's "cables" that have obtained or comply with various national standards such as CE, UL, and VDE, suitable for use in all countries. We offer a wide range of products, including the "Oilflex Series," used in various fields such as machinery, machine tools, and various systems, as well as the "Unitronic Series," which transmits large amounts of data quickly and reliably, among many others!

• cable

Cable glands with protection level IP68, certified by various national standards such as CE, UL, and VDE!

The LAPP cable gland (cable clamp) SKINTOP series is used worldwide as a revolutionary cable gland with a unique cable holding structure (patented) and easy installation through quick installation. We offer a variety of types made of polyamide and metal to suit different applications. The metal options also include those for EMC protection. Additionally, a wide range of accessories and specialized tools are available. For areas where oil resistance is required, please consider LAPP's oil-resistant cables (such as Oilflex Classic 440P and Oilflex Robust 200). The catalog available for download here is an excerpt. For detailed inquiries or requests regarding wiring-related items such as cables and cable glands, please contact Kamex. Among the SKINTOP series, the highly versatile series is also available for purchase in our online shop. http://shop.kmecs.com/shopdetail/003001000005/order/

• Other electronic parts
• Wiring materials
• Other cable related products

Metal skin top

The LAPP cable gland, SKINTOP MS-M series, is a brass M-thread cable gland used worldwide. Some sizes of the MS-M series are available for purchase in our online shop.

• Other electronic parts
• Wiring materials
• Other cable related products

Nitto Kohki will be exhibiting at the "Data Center EXPO" held at Makuhari Messe Hall 1 from Wednesday, October 23 to Friday, October 25. [Booth Number: A6-23] At this exhibition, we will showcase the "Compact Zero Spill Coupler," which is specifically designed for data centers, including supercomputers. We will also present the "Blind Mate Type," a fitting exclusively for server cooling piping, as a reference exhibit.

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely invite you to visit us during this busy time. 【 Exhibition Name 】 Automotive Technology Exhibition 2025 YOKOHAMA https://aee.expo-info.jsae.or.jp/ja/yokohama/ (An "online exhibition" will also be held during and around the event period) 【 Dates 】 May 21 (Wednesday) - 23 (Friday), 2024 10:00 AM - 6:00 PM *On the final day, 9:00 AM - 4:00 PM (Online exhibition: May 14 (Wednesday) - June 4 (Wednesday)) 【 Venue 】 Pacifico Yokohama (1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa Prefecture) Our booth number: "Concourse 505"

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to attend this event. 【 Exhibition Name 】 27th INTERPHEX Week Tokyo https://www.interphex.jp/tokyo/ja-jp.html 【 Dates 】 July 9 (Wednesday) - 11 (Friday), 2025 10:00 AM - 5:00 PM 【 Venue 】 Tokyo Big Sight (3-11-1 Ariake, Koto-ku, Tokyo 135-0063)

[Lecturer] Taku Ito, Partner, Mori Hamada & Matsumoto Foreign Law Joint Enterprise Yoshifumi Nagakubo, Senior Associate [Key Lecture Content] As we move towards a carbon-neutral society, the large-scale introduction of renewable energy sources is progressing, making the enhancement of market design that balances stable electricity supply and economic efficiency an urgent issue. In this context, the "simultaneous market," which integrates the trading of electricity (kWh) and adjustment capacity (ΔkW), is being discussed as a core component of future electricity systems, and serious considerations for its implementation are underway. In this lecture, a lawyer who has led discussions at the forefront of national system design will explain in an easy-to-understand manner the background and necessity of the simultaneous market, as well as the overall picture of its complex mechanisms, based on practical experience. Furthermore, the lecture will clearly outline the latest developments in current discussions, realistic challenges for implementation, and prospects for future electricity business in Japan, incorporating perspectives and insights as a system designer and practitioner.

[Instructor] Hirokazu Shibata, President and CEO of ZAZU Design Co., Ltd. [Key Lecture Content] As the importance of heat dissipation design increases in daily operations, it is necessary to study a range of books on thermal engineering to learn the overall picture of heat dissipation design. However, books on thermal engineering typically start with the basics of heat transfer and cover topics such as temperature boundary layers and dimensionless numbers related to heat transfer, making it quite difficult for beginners to grasp the overall picture in a short period. This seminar is aimed at engineers who will begin thermal design in the future, focusing on various heat dissipation devices as specific subjects. The goal is to understand the basics of thermal design while learning about the characteristics and usage of these heat dissipation devices. After attending this seminar, participants are expected to acquire knowledge equivalent to that gained from studying a range of thermal engineering books. [Lecture Topics] 1. Current Status and Challenges of Thermal Design 2. How "Thermal Resistance" Determines Heat Dissipation Pathways 3. Fundamental Laws Governing Heat Transfer 4. Air Cooling through Heat Transfer 5. Heat Diffusion through Thermal Conduction 6. Heat Transfer via Two-Phase Flow of Gas and Liquid 7. Q&A Session