We will exhibit at the 4th Smart Factory Expo.

Streamline the control panel! Achieve "miniaturization" and "cost reduction" through simplified wiring!

Murrelektronik's 'CUBE67' allows for bus changes without system modifications. By consolidating wiring within the control panel, it enables miniaturization and cost reduction. Additionally, the installation of devices is independent of the control and field bus, allowing for customization of control devices without changing I/O peripherals. 【Features】 - Cost reduction of I/O modules - Reduction of wiring labor - Space-saving *For more details, please download the catalog or contact us.

• Other electronic parts
• Other machine elements
• Control Panel

An optimal interface for sending various data from control panels to a computer.

The MODLINK MSDD series from Murrelektronik is a front panel interface that is optimal for sending various data from control panels to computers. It offers a lineup of inserts for power supplies, D-sub, RJ45, USB, and other international standards. Inserts for domestic AC 100V power supplies are also available. A flat blind plate is provided, allowing customers to freely attach connectors and switches. Customization on the customer side is also possible. When closed, it achieves a waterproof protection rating of IP65.

• Other electronic parts
• Other Connectors
• Board materials

Are you satisfied with the current wiring method? Free distribution of "Cost Comparison Based on Wiring Concepts" is available now!

The connection work of control panels and cables, which becomes a significant burden in machine wiring. In the selection of conventional wiring materials, the focus has been primarily on minimizing material procurement costs, often overlooking the total costs that include associated wiring work expenses, maintenance costs, and other hidden costs. Therefore, we will thoroughly compare the costs of the traditional wiring method using terminal blocks and terminal boxes with the "waterproof cable connectors and space-saving boxes" proposed by Mur Electronics, referred to as the 'space-saving solution.' We will also compare the costs when using the "IP67 waterproof remote I/O station," which can easily connect to major field buses with a single bus node. Please read on to see how the total costs change based on the differences in wiring concepts. [Content] We classify the wiring configuration concepts of machine wiring into seven categories and thoroughly compare how each configuration changes based on the following perspectives: - Advantages - Disadvantages - Suitable industries - Material costs - Labor costs - Technical level Additionally, examples of configurations using safety circuits, which have recently gained attention, are also included. *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

• Other electronic parts
• Other machine elements
• Control Panel

We are releasing a method to quickly and reliably advance IoT implementation! Significantly reduce wiring labor and downtime, among other factors.

Our company offers products from Mur Electonics that enable the smooth implementation of IoT. We are currently presenting a "Technical Document" that clearly introduces various solutions to address IoT challenges such as "wiring, programming, and connectivity"! (You can view it from "Download") 【Featured Technologies】 ■ "Active Wiring Reduction System" Converts existing fieldbus into a local bus optimized for wiring reduction. Wiring work can be reduced by up to 95%. ■ "DIGA (Self-Diagnosis Gateway)" Visualizes diagnostic information of remote I/O without the need for programming. Significantly reduces machine downtime. ■ "IODD on Board" By incorporating IODD into the device information file of the IO-Link master, bulk configuration of multiple IO-Link devices can be achieved on the IO-Link master. <Exhibiting at the Industrial Open Network Exhibition 2017> We will showcase various solutions! Dates: August 24, 2017 (Tokyo, Ota Ward Industrial Plaza PiO) August 29, 2017 (Osaka, Grand Cube Osaka) Time: 10:00 AM - 6:00 PM

• Wiring materials
• Other machine elements
• connector

Covering all types of equipment such as machinery, machine tools, and various systems! A wide lineup available!

Our company handles LAPP's "cables" that have obtained or comply with various national standards such as CE, UL, and VDE, suitable for use in all countries. We offer a wide range of products, including the "Oilflex Series," used in various fields such as machinery, machine tools, and various systems, as well as the "Unitronic Series," which transmits large amounts of data quickly and reliably, among many others!

• cable

Cable glands with protection level IP68, certified by various national standards such as CE, UL, and VDE!

The LAPP cable gland (cable clamp) SKINTOP series is used worldwide as a revolutionary cable gland with a unique cable holding structure (patented) and easy installation through quick installation. We offer a variety of types made of polyamide and metal to suit different applications. The metal options also include those for EMC protection. Additionally, a wide range of accessories and specialized tools are available. For areas where oil resistance is required, please consider LAPP's oil-resistant cables (such as Oilflex Classic 440P and Oilflex Robust 200). The catalog available for download here is an excerpt. For detailed inquiries or requests regarding wiring-related items such as cables and cable glands, please contact Kamex. Among the SKINTOP series, the highly versatile series is also available for purchase in our online shop. http://shop.kmecs.com/shopdetail/003001000005/order/

• Other electronic parts
• Wiring materials
• Other cable related products

Metal skin top

The LAPP cable gland, SKINTOP MS-M series, is a brass M-thread cable gland used worldwide. Some sizes of the MS-M series are available for purchase in our online shop.

• Other electronic parts
• Wiring materials
• Other cable related products

The goal is not to introduce AI. We will explain "standardization of manufacturing processes" to eliminate dependency and maximize the effectiveness of AI! While the spread of generative AI is progressing, there is an increasing number of manufacturing companies that say, "We don't know where to apply AI due to the black box nature of the site," and "Despite implementation, productivity hasn't increased." The cause lies not in the performance of AI, but in the "lack of business organization and standardization before implementation." In this webinar, we will clearly explain business improvement methods (BPMS) and how to properly organize business processes to avoid wasting AI investments, using case studies. [Recommended for those who:] - Are struggling to engage the field due to resistance like "busy" or "it's fine as it is." - Want to eliminate differences in rules between factories and locations, as well as dependency and black box issues with veteran employees. - Are being asked to "utilize AI" but don't know where to start due to disorganized business processes. [Here is the application form] https://www.earthlink.co.jp/seminar/10840/ *Pre-registration required (free) *We will give a "partial excerpt of the presentation materials" to those who respond to the survey after viewing.

[Speaker] Ms. Sayako Sumomo, Director, International Equipment Division, Equipment Policy Department, Acquisition, Technology & Logistics Agency [Key Lecture Content] As the security environment surrounding our country changes at an accelerating pace, the government is promoting defense equipment transfers as an important policy measure to create a desirable security environment for our nation. Promoting defense equipment transfers not only enhances regional deterrence and response capabilities for peace and stability in the Indo-Pacific region but also contributes to strengthening our country's defense production and technological base through market expansion and supply chain cooperation. Furthermore, the development of the defense industry and other industries with dual-use technologies can lead to growth in the Japanese economy. In this lecture, I will explain recent trends in defense equipment transfers, taking into account the recent revisions to the equipment transfer system. [Lecture Topics] 1. Japan's Defense Policy 2. Significance and System of Equipment Transfers 3. Recent Trends in Equipment Transfers 4. Government Initiatives 5. Q&A / Business Card Exchange

[Speaker] Hiroki Hara, Country Lead, Cloud & Service Provider Segment, Schneider Electric Holdings Co., Ltd. [Key Lecture Content] In the era of AI, it is essential to redesign not just the equipment but the very way energy is utilized in data centers. This presentation will organize the approach to power architecture aimed at enhancing competitiveness, taking into account global trends and the constraints of the Japanese market. Additionally, through Schneider Electric's comprehensive portfolio, which includes cooling and operations, we will provide perspectives for selecting optimal options in Japan's increasingly complex power environment, as well as hints for future implementations. [Lecture Items] 1. Introduction to Schneider Electric 2. Global megatrends and the external environment surrounding the data center industry 3. Architecture of data center power infrastructure - Design philosophy necessary for safely delivering electricity 4. Schneider's portfolio connecting power and cooling, design, construction, and operation 5. Unique challenges of the Japanese market and options for optimal solutions 6. Q&A / Business card exchange

[Speaker] Yuya Sato, Director, Innovation Management Co., Ltd. [Lecture Topics] 1. Main challenges in the field of research and development 2. Overview of research and development management 3. How to utilize "roadmaps" for formulating persuasive mid- to long-term strategies 4. How to utilize "technology portfolios" to achieve convincing resource allocation 5. "Gate management" to improve the success rate of highly innovative research and development themes 6. Integrated research and development management process 7. Q&A

Our TL Division will be exhibiting at the "Surface Treatment Processing Technology Exhibition 2026" to be held on June 26 (Friday) at the Osaka Industry Creation Center. We invite you to visit our booth to see our products and technologies. We sincerely look forward to your attendance. ■ Exhibition Name Surface Treatment Processing Technology Exhibition 2026 ■ Date June 26, 2026 (Friday) ■ Venue Osaka Industry Creation Center, 3F Market Plaza / 4F Event Hall ■ Exhibited Technology We will introduce optimal solutions for surface modification composites and ultra-hard coating removal by adding a new coating to Y-Coat, which leads the mold market. New Coating: Y-Coat Type UL Product Introduction Page