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  3. TileFlow Japan データセンターファシリティ営業部
  4. I am participating in Interop Tokyo 2020 online.
SEMINAR_EVENT
  • May 28, 2020
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May 28, 2020

I am participating in Interop Tokyo 2020 online.

TileFlow Japan TileFlow Japan データセンターファシリティ営業部
Event Overview Name: Interop Tokyo 2020 Dates: Interop Online From April 13, 2020 (Monday) to June 30, 2020 (Tuesday) Exhibition (Cancelled due to COVID-19 measures) transitioned to Online The scheduled dates were from April 13 (Monday) to April 15 (Wednesday), 2020, but the in-person event was cancelled and transitioned to WEB Online until June 30. Organizer: Interop Tokyo Executive Committee Management: - Internet Association Japan - NanoOpt Media Inc. Cooperation: WIDE Project Concurrent Events: Connected Media Tokyo 2020 Digital Signage Japan 2020 Location Business Japan 2020 APPS JAPAN 2020
Date and time Monday, Apr 13, 2020 ~ Tuesday, Jun 30, 2020
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Entry fee Free
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Related product

TileFlow.jpg

Thermal management simulation system for TileFlow data centers

Data center thermal management simulation software available for operational managers to use in daily tasks with DCIM integration.

TileFlow is a thermal airflow analysis software specifically designed for data centers. It accurately responds to the increasing demands for energy efficiency year after year with advanced algorithms developed by S.V. Patankar. On-site personnel can handle equipment additions and layout changes themselves. Results can be visualized quickly and easily. For data center operations managers, it has a proven track record as a highly efficient operational software, particularly in the United States and among major data centers. We are available for a demo presentation, so please feel free to request it. It is also possible to conduct this via a web conference. We can provide experiential training upon request through our company website. InteRop Tokyo 2017 Special Award in the Management & Monitoring category

  • Thermo-fluid analysis
  • Other core systems

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PFPF.jpg

PlenaForm Systems Flame Retardant Sheet

User-friendly multi-purpose 27U scalable blanking panel for 19-inch racks and universal multi-purpose baffle system (shielding panel) flame retardant.

High flame-retardant sheet Flame-retardant standard UL94 V-0, compliant with RoHS directive. The material is a non-conductive, inert polypropylene compound. The official name for the 19-inch blank panel is PlenaFill. The shielding panel used for underfloor applications is PlenaForm. The vertical space shielding panel for wide racks is PlenaVertical. Each is sold in box units made of the same material. Pricing and other details will be provided by the distributor. Reference standard prices (revised August 2026, prices effective after August 1): The standard price for PlenaFill is 1 box of 270U (installation rivets not included) at ¥266,000. The price for PlenaForm is open. The price for PlenaVertical is 1 box of 540U (installation rivets not included) at ¥214,800. The price for S99PlenaVertical is 1 box of 540U (installation rivets not included) at ¥134,400. These products are being utilized by major data centers, including those in the United States. They are recommended for purchase and effectiveness by the U.S. Department of Energy. For detailed explanations and sample requests, please feel free to contact us.

  • Server Rack

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01.jpg

Smart Air Conditioning Control System for Data Centers

A solution that achieves optimal air conditioning environments and energy savings through automatic measurement and control using learning functions.

Link the indoor wireless temperature sensor module with the air conditioning unit, selecting the target air conditioning unit based on the fluctuations in each sensor's measurement values for automatic control. Through optimal control, a reduction in air conditioning power consumption of up to 30% is achieved.

  • Other air conditioning equipment
  • Server monitoring and network management tools
  • Other server related

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TileFlow-Brochure AFThroTile1.jpg

Data center thermal management simulation system

Achievement No. 1: Thermal Analysis Simulation System for Data Centers - A simulation system that enables energy-saving predictions directly usable by DC operations managers.

TileFlow is a thermal airflow analysis software specifically designed for data centers. It accurately responds to the increasing demands for energy efficiency year after year with the advanced algorithm (Exponential Method) developed by S.V. Patankar. On-site personnel can handle equipment additions and layout changes themselves. Results can be visualized quickly and easily. As a user-friendly software for operations managers, it is the number one software with a proven track record among major data centers, especially in the United States. It can integrate with various DCIM software to visualize the current state and conduct future considerations. Awarded the Special Prize in the Management & Monitoring category at InteRop Tokyo 2017 and was a finalist in the Demonstration category at InteRop Tokyo 2016.

  • Other information systems

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Related catalog(7)

Heat Mitigation Simulation TileFlow

Heat Mitigation Simulation TileFlow

PRODUCT
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PlenaForm Systems Flame Retardant Sheet

PlenaForm Systems Flame Retardant Sheet

PRODUCT
  • E-book viewing
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PlenaVertical High Flame Retardant Sheet

PlenaVertical High Flame Retardant Sheet

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Wide Rack Vertical Space Filler Panel Installation Guide

Wide Rack Vertical Space Filler Panel Installation Guide

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TileFlow Case Study

TileFlow Case Study

TECHNICAL
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Smart Air Conditioning Control System for Data Centers

Smart Air Conditioning Control System for Data Centers

TECHNICAL
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Company Overview

Company Overview

COMPANY
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Distributors

TileFlow Japan
software
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TileFlow Japan データセンターファシリティ営業部
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[Notice of Exhibition Participation by Fukuda Co., Ltd.] TOKYO PACK 2026 Tokyo International Packaging Exhibition

  • NEW
  • SEMINAR_EVENT

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

Oct 09, 2026

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We will be exhibiting at the PIAB Manufacturing Fair 2026 [Booth Number: AS-43].

  • NEW
  • SEMINAR_EVENT

We will showcase our new product "BLFF," a palletizing foam gripper that weighs only 1.9 kg and measures 350mm×250mm, ideal for bulk picking. We will also introduce various products that cater to different work applications, including durable suction cups and solutions for bag handling. Additionally, we are implementing energy-saving proposals by replacing ejectors to reduce compressed air consumption, which has become a challenge in many industries. If you have any issues with adhesion or transport, please feel free to consult with us at the venue. ■ Lightweight Foam Gripper for Collaborative Robots "CVGC Series" Despite weighing only 1.9 kg, this gripper has a theoretical lifting force of 100 kg, maximizing the payload capacity of collaborative robots. ■ Gripper for Films This gripper is designed to transport thin films gently, minimizing marks left on the surface. By utilizing 3D printing, we can accommodate highly flexible shape designs tailored to specific workpieces and applications. ■ Energy Saving Comparison Panel "Why does a single ejector consume less compressed air compared to a multi-stage ejector?" You can actually verify the differences in compressed air consumption through a comparative display using a flow meter and actual equipment.

Oct 09, 2026

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Starting from November 18 (Wednesday): Announcement of participation in Smart Factory JAPAN! Booth number "F-20"

  • NEW
  • SEMINAR_EVENT

We will be exhibiting at Smart Factory JAPAN, held at Tokyo Big Sight from November 18 (Wednesday) to November 20 (Friday), 2026. We will introduce the 'Dr. Process Navi Series', 'Dr. Mold Cloud', and AI solutions that integrate with both products! <Introducing the latest solutions that innovate productivity in manufacturing sites!> ● 'Dr. Process Navi' Series ● 'Dr. Mold Cloud' ● 'AI Solutions' For more details, please check the related products. ■■ Smart Factory JAPAN 2026 Overview ■■ Dates: November 18 (Wednesday), 19 (Thursday), 20 (Friday), 2026 Opening Hours: 10:00 AM - 5:00 PM Venue: Tokyo Big Sight, East Hall 1-3 Our Booth Number: F-20 Registration: Nikkan Kogyo Shimbun 6 Exhibition Joint Site When visiting, please register in advance from your My Page and bring a printed admission ticket. Business meeting requests are also possible, so please make use of this opportunity.

Oct 09, 2026

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Announcement of participation in the "Monozukuri World Fukuoka Design and Manufacturing Solutions Exhibition": December 2nd - @ Marine Messe Fukuoka

  • NEW
  • SEMINAR_EVENT

We will be exhibiting at the Monozukuri World Fukuoka Design and Manufacturing Solutions Exhibition, held at Marine Messe Fukuoka from December 2 (Wednesday) to December 4 (Friday), 2026. We will introduce the 'Dr. Process Navi Series', 'Dr. Mold Cloud', and AI solutions that help improve efficiency and reform in manufacturing sites! <Introducing the latest solutions that innovate productivity in manufacturing sites!> ● 'Dr. Process Navi' Series ● 'Dr. Mold Cloud' ● 'AI Solutions' For more details, please check the related products. ■■ Overview of the 4th Monozukuri World Fukuoka Design and Manufacturing Solutions Exhibition ■■ Dates: December 4 (Wednesday), 5 (Thursday), 6 (Friday), 2026 Opening hours: 10:00 AM to 5:00 PM Venue: Marine Messe Fukuoka Our booth number: 14-18 When visiting, please register in advance through the dedicated page and bring your printed visitor badge.

Oct 09, 2026

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We will be exhibiting at "CEATEC 2026" from October 13 to 16 | Awarded the "Innovation Award" at CEATEC AWARD 2026 (iCrystal)

  • NEW
  • SEMINAR_EVENT

We will be exhibiting at "CEATEC 2026," which will be held at Makuhari Messe from October 13 to 16. We provide information technology and process informatics (PI) that optimize "how to create" by utilizing physical simulations, AI, and machine learning in process development. We look forward to your visit to our booth. 【Seminar Information】 "Process Informatics for Exploring Optimal Manufacturing Conditions" Date and Time: October 16, 2026 (Friday) 12:45 - 13:00 Venue: Makuhari Messe Exhibition Hall 4 P Stage Speaker: CEO Takaishi Please check the link below for details on our exhibition.

Oct 08, 2026

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  • 脱炭素×高出力×軽量 天吊式・人感センサ付 速暖式工場用暖房機
  • 技術・製品展示会 新技術創出交流会2026 入場無料 来場登録受付中 開催日時10月22日木・23日金 会場東京たま未来メッセ
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