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  1. Home
  2. Industrial Electrical Equipment
  3. アドバンテック
  4. 【Product Introduction Webinar on July 6 (Monday) from 13:30 to 14:00】Introduction of the palm-sized motherboard AIMB-U233 and Mini-ITX AIMB-233 compatible with Intel's 8th generation ultra-low power Core i (Whiskey Lake-U).
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  • Jun 22, 2020
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Jun 22, 2020

【Product Introduction Webinar on July 6 (Monday) from 13:30 to 14:00】Introduction of the palm-sized motherboard AIMB-U233 and Mini-ITX AIMB-233 compatible with Intel's 8th generation ultra-low power Core i (Whiskey Lake-U).

アドバンテック アドバンテック
At Advantech, we will hold a webinar introducing selected embedded products from our approximately 3,000 product offerings. On July 6, we will focus on industrial motherboards. The AIMB-U233 is a compact palm-sized product equipped with an AI-enhanced Whiskey Lake CORE-i CPU, designed for self-service applications and industrial automation. It features dual LAN and dual HDMI, legacy and USB 3.1 Gen2 I/O, multiple M.2 connectors for high-speed NVMe storage, and can accommodate an i7 CPU platform in sizes up to 112x137mm. Date: July 6 (Monday) Time: 13:30 - 14:00 Topic: Introduction of the palm-top sized motherboard AIMB-U233 and Mini-ITX AIMB-233 compatible with Intel's 8th generation ultra-low power Core i (Whiskey Lake-U) ○ Product Introduction Series Quick overview, new product introduction online seminar https://register.gotowebinar.com/rt/8465717673035304975
Date and time Monday, Jul 06, 2020
01:30 PM ~ 02:00 PM
Capital
Entry fee Free
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DP ++ / DP ++ / DP / HDMI, AMD Merlin Falcon quad-core Mini-ITX motherboard with 6x COM and dual LAN 【Main Features of This Product】 ◆ Supports AMD Merlin Falcon / Brown Falcon / Prairie Falcon processors ◆ 2×260-pin SO-DIMM, supports up to 16GB DDR4 2133 SDRAM ◆ Triple display support via DP / eDP / LVDS + DVI-D + HDMI ◆ Supports 1x PCIe×8 and mini-PCIe expansion slots ◆ 6x COM, 4x USB 2.0, 4x USB 3.0 ◆ Supports SUSIAccess and embedded software API

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Mini-ITX Motherboard [AIMB-276]

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7th and 6th generation Intel Core i7 / i5 / i3 LGA 1151 Mini-ITX

H110, DP / DVI / VGA, 8 COM, 4 USB3.0, 6 USB2.0, dual GbE LAN, PCIe x 16, mini PCIe, M.2, DDR4, ATX input compatible with 7th and 6th generation Intel Core i7 / i5 / i3 LGA 1151 Mini-ITX ● Supports 7th and 6th generation Intel Core i processors (LGA 1151) with Intel H110 chipset ● 2 x 260-pin SO-DIMM, up to 32GB DDR4 2133 MHz SDRAM ● PCIe x 16 (Gen 3), 1 F/S mini PCIe, 1 M.2 2242, 4 USB 3.0, 6 USB2.0, and 2 SATA III supported ● Dual display support for DP / DVI / VGA / LVDS (optional) ● TPM 1.2 / 2.0 support (optional)

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[Notice of Exhibition Participation by Fukuda Co., Ltd.] TOKYO PACK 2026 Tokyo International Packaging Exhibition

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  • SEMINAR_EVENT

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

Oct 08, 2026

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Creating an environment that thrives even in extreme heat: Introducing the results of closed-type greenhouse demonstrations and summer cooling methods - Exhibiting at the 14th Agricultural WEEK (commonly known as J-AGRI)

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Yazaki Energy System will be exhibiting at the "14th Agricultural WEEK (commonly known as J-AGRI)" held at Makuhari Messe. In response to challenges surrounding agriculture, such as record heat and soaring energy prices, our company proposes an agricultural system that utilizes surplus solar heat and waste heat from factories during the summer to support stable cultivation throughout the year, from winter heating to summer cooling. ■ Exhibition Details (Booth Number: 25-47) <Closed-type Agricultural House> Results from the second season and initiatives for the third season <Localized Cooling in Solar-Powered Agricultural Houses> Mechanism of substrate cooling, comparison of energy consumption with spatial cooling, growth conditions this summer <Cooling and Heating with Solar Heat> Examples of crown heating and house cooling, utilization of surplus heat in summer <Cooling of Crops and Workers with Well Water> Exhibition of a prototype well water cooler and proposals for the use of cooling jackets When you visit, please be sure to stop by our booth.

Oct 06, 2026

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Information on Autumn/Winter Internships for the Class of 2028

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We would like to inform you about the autumn and winter internship opportunities for the 2028 graduates. 1. Open Company Dates: October 23, 2026 (Friday), November 11, 2026 (Wednesday), December 10, 2026 (Thursday), January 21, 2027 (Thursday) Time: 13:30 - 15:30 Location: Online (Microsoft Teams) 2. 1-Day Job Experience Dates: November 17, 2026 (Tuesday), December 16, 2026 (Wednesday) January 15, 2027 (Friday), January 27, 2027 (Wednesday), February 4, 2027 (Thursday), February 10, 2027 (Wednesday), February 18, 2027 (Thursday) Time: 10:00 - 17:30 (tentative) Location: Takaya Corporation Headquarters (661-1 Ibara-cho, Ibara City, Okayama Prefecture)

Oct 06, 2026

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Notice of Participation in FOOD Expo 2026 (November 11-13, 2026)

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Notice of participation in the "FOOD Expo 2026." 【Date and Time】  November 11 (Wednesday) - 13 (Friday), 2026  Opening hours: 10:00 AM - 5:00 PM 【Venue】  Tokyo Big Sight  East Hall 2, Booth Number B-36 【Exhibits】  Cardboard insulated boxes  Craft cooler cubes  Vacuum insulated panel  Pallet cubes

Oct 06, 2026

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[Seminar] From Generative AI to Physical AI: The Cutting Edge of Market and Industry Structure and Technology Development

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[Lecture Topics] 1. Co-creation Strategy to Deliver AI to the Field - Business Development and Joint Ventures in the Era of Generative AI and Physical AI Mr. Haruto Suzuki, Industrial and Regional Research Department, Development Bank of Japan 1. The Mechanism of Generative AI and Its Current Utilization by Companies 2. Expansion of the Generative AI Market and AI Infrastructure 3. Transition from Generative AI to Physical AI 4. Bottlenecks in Social Implementation and Solutions through Joint Ventures 5. Formation of an Implementation Ecosystem through Policy and Finance 6. Q&A / Business Card Exchange 2. Needs, Development Trends, Future Possibilities, and Challenges of Physical AI Mr. Kazushi Asama, Senior Researcher, Next-Generation Robot Research Organization, Waseda University / Emeritus Professor, University of Tokyo 1. What Physical AI Means 2. Needs for Physical AI and the Technological Trends of Generative AI Behind It 3. Development Trends of Physical AI 4. Future Possibilities and Challenges of Physical AI 5. Q&A / Business Card Exchange

Oct 06, 2026

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  • 技術・製品展示会 新技術創出交流会2026 入場無料 来場登録受付中 開催日時10月22日木・23日金 会場東京たま未来メッセ
  • 排気熱風なく気温-4.1℃の冷風を 工事不要で暑さ対策 店舗・工場の安全対策に! 気化式スポットクーラー Pure Drive
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