【Product Introduction Webinar on July 31 (Friday) from 13:30 to 14:00】Introduction of the Extended Temperature Compatible Industrial Wireless Modules EWM & AIW Series.

Intel Movidius Myriad X VPU onboard

- Intel Movidius Myriad X VPU onboard - Ultra-compact, low power consumption - Hardware acceleration for general DNN (Deep Neural Network) - Scalable for multi-video stream edge inference - 10 times the performance compared to the previous generation - Perfect support with Intel OpenVINO toolkit

• Embedded Board Computers

4x PCIe equipped with Intel Movidius Myriad X VPU Edge AI acceleration module

- 4x/8x Intel Movidius Myriad X VPU onboard - General DNN (Deep Neural Network) hardware acceleration - Scalable for multi-video stream edge inference - 10 times the performance compared to the previous generation - Intel OpenVINO toolkit for inference performance optimization - Edge AI Suite with GUI for rapid evaluation

• Embedded Board Computers

Edge AI module equipped with one m.2 Intel Movidius Myriad X VPU.

- Intel Movidius Myriad X VPU onboard - Ultra-compact, low power consumption - Hardware acceleration for general DNN (Deep Neural Network) - Scalable for multi-video stream edge inference - 10 times the performance compared to the previous generation - Perfect support with Intel OpenVINO toolkit

• Embedded Board Computers

Intel Movidius VPU | 1080p 120fps encoding and decoding | 12~24V | OpenVINO support

Equipped with 2 x Intel Movidius Myriad X VPUs on an Intel Core i5 platform, it meets the needs of high-performance computing for applications such as up to 1080p video encoding and decoding, traffic monitoring, license plate and vehicle type recognition, and object recognition with multi-channel processing. 【Key Features of This Product】 ■ Intel Core i5-6442EQ QC SoC ■ 2x Intel Movidius Myriad X VPU MA2485 built-in ■ Supports Intel OpenVINO toolkit ■ Best-in-class graphics capabilities, supporting up to 1080p/240fps video encoding and decoding ■ Isolated 12-24VDC wide-range power input ■ Expandable diverse communication options, e.g., WLAN, WWAN ■ Vibration and shock resistant certified by MIL-STD-810G (rugged) ■ Certifications for general standards, CE, FCC, CB, UL, CCC, and BSMI ■ Built-in development kit Edge AI Suite

• Image Processing Equipment
• Industrial PCs
• Embedded Board Computers

DIN rail compatible | Versatile industrial edge AI computer focused on practicality

The AIR-101 is equipped with an Intel Atom E3940 Quad Core processor and 2 x Intel Movidius Myriad X VPUs, featuring a DIN rail design and a wide power input range (12V to 28V), making it ideal for applications such as AGVs and factory automation. 【Features】 ■ Equipped with Intel Atom E3940 Quad Core processor ■ Includes 2 x Intel Movidius Myriad X VPUs ■ Supports Intel OpenVINO toolkit ■ Built-in 1x SATA slim 64G SSD ■ Built-in 1x 204-pin SO-DIMM DDR3L 8GB memory ■ DIN rail AI system with I/O ports ■ M.2 2230 (for Wi-Fi or optional VEGA-320 module) ■ Built-in development kit Edge AI Suite with pre-trained AI models

• Industrial PCs

"Accurate facial recognition with AI, an astonishing 99.7%" Features high precision recognition rate. 4K ultra-high-definition digital signage player.

Equipped with an Intel Atom x7-E3950 CPU and 1 x Intel Movidius Myriad X VPU, this product supports multi-4K displays and features facial recognition, making it suitable for interactive kiosks and whiteboards in the retail industry. 【Key Features of This Product】 ■ Equipped with Intel Atom x7-E3950 processor ■ Equipped with Intel Movidius Myriad X VPU MA2485 x1 ■ nVidia GeForce GT 1030 ■ 4 x HDMI 4K resolution ■ GUI development kit Edge AI Suite for rapid evaluation ■ Low power, fanless signage player

• Industrial PCs
• Embedded Board Computers

Powerful edge AI inference system equipped with Intel Xeon E3 and 6th/7th generation Core i series.

A server-grade computer with multiple I/O options, compatible with Intel Xeon E3 / 6th/7th generation Core i series processors and PCIe x16 slots, capable of high-performance graphics cards, enabling fast AI inference and on-premise training for applications such as robotic AOI optical inspection systems. 【Key Features of This Product】 ■ Equipped with Intel Xeon / 6th & 7th Gen. Core i3/i5/i7 processors ■ Dual display: VGA + HDMI ■ Supports up to 32 GB of DDR4 SO-DIMM memory ■ 850W power supply bundled output ■ Drive bay options for two 2.5-inch hard drives ■ Supports high-output GPU cards with up to 260W PCIe x16

• Image Processing Equipment
• Industrial PCs

M.2 2230 (A-E key) WIFI card

- 2T2R 2 antenna connectors - Operating temperature: -40 to +85°C - M.2 2230 A-E key card PCIe interface - IEEE 802.11 a/b/g/n/ac (2.4 GHz / 5 GHz) standards and BT4.1

• Embedded Board Computers

Advantech USB Bus 802.11 ac / a / b / g / n Mini PCIe Card

- Operating temperature: -20 to +70°C - 1Tx / 1Rx, maximum data rate of 433 Mbps - Half-size miniPCIe card interface with USB signal - IEEE 802.11 ac / a / b / g / n (2.4GHz + 5GHz) standards

• Memory

802.11 ac / a / b / g / n + Bluetooth 4.0 half-size mini PCIe card

- IEEE 802.11ac / a / b / g / n WiFi with Bluetooth 4.0 standard - Bluetooth equipped 1Tx / 1Rx - Maximum data rate of 433.3 Mbps - Complete BT 4.0 and BT 3.0 + High Speed system - Operating temperature: 0 to +70℃

• Embedded Board Computers

WIFI card, peripheral device module (storage, wifi)

- IEEE 802.11a/b/g/n/ac (2.4GHz/5GHz) standard and BT4.1 standard combo module - M.2 2230 A-E key card PCIe interface - Operating temperature: -20 to 65℃ - 2 antenna connectors

• Industrial PCs

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

[Lecture Topics] 1. Trends and Business Opportunities in Japan's Expanding Energy Storage Industry Koichiro Danno, Principal and Head of Social and Policy Design Unit, Research and Consulting Division, Japan Research Institute, Inc. 1. Background Necessitating Energy Storage Business 2. Behind the Meter (BTM) Business and In Front of the Meter (IFM) Business 3. Trends in Japan's Energy Policy Related to Energy Storage 4. Current Revenue Models in Japan 5. Verification of Profitability in Energy Storage Business 6. Summary 7. Q&A 2. Expansion of Grid-Scale Energy Storage Business in Europe and Japan and Future Prospects Takayuki Ogawa, Executive Officer, Deputy Head of Business Strategy Division, Japan Kogyo Energy Solutions, Inc. and Executive Director, Nippon Koei Energy Europe B.V. 1. Overview of the Company and Introduction to Energy Business 2. Efforts in Energy Storage Business in Europe 3. Efforts in Energy Storage Business in Japan 4. Role and Importance of Aggregators 5. Challenges and Future Prospects of Grid-Scale Energy Storage Business 6. Summary 7. Q&A

[Speaker] Hideo Yamamoto, President and CEO of DIVE COMPASS Inc. [Key Message] "Consumers will no longer be at the end of the power system." By reconfiguring the energy landscape starting from the "consumer" rather than viewing renewable energy, electricity retail, PPA, storage batteries, EVs, VPP, and DSF as separate businesses, there is potential to create new energy businesses in Japan. This presentation will not only introduce the latest trends in Europe but will also consider future market changes and business opportunities from the perspective of "what can be commercialized next in the Japanese market." [Presentation Items] 1. Why consider the electricity market from the consumer's perspective now? 2. Five market changes confirmed at FLEXCON 2026 on the front lines of European DSF 3. The current state of the Japanese DSF market seen through comparison with Europe 4. New consumer-centric energy businesses emerging in Japan 5. Who will hold the connection with consumers by 2030? 6. Q&A / Business card exchange

Are you struggling with the fact that even after raising recruitment costs and hourly wages, on-site personnel are not sticking around? The true causes of turnover lie in "fatigue from heavy labor" and "discomfort in the work environment." However, improving the entire facility or fully automating operations involves enormous initial investments and is not realistic. In this seminar, we will reveal three practical solutions to create a "preferred workplace" based on a case study that reduced investment costs by approximately 20% compared to traditional proposals, without relying on expensive renovations or endless wage increases. The key lies in the integrated design of "construction and equipment" and "robotics." By thoroughly eliminating unnecessary capital investments, we can dramatically reduce the burden on the workforce and enhance productivity. As a company that also engages in outsourcing, we will thoroughly explain the "three principles" that support integrated design, using actual improvement cases. This content is a must-see for executives and site managers who want to fundamentally solve labor shortages within their budgets. [Recommended for] - Companies that continue to face turnover and recruitment difficulties despite raising wages and recruitment costs. - Site managers and executives who considered full building air conditioning or complete automation but abandoned the idea due to high costs. - Site managers and executives who want to balance investment restraint and productivity improvement through relocation or renovations.

We will be exhibiting at the "26th Business Fair" hosted by Seibu Shinkin Bank, which will be held on Thursday, October 15, 2026, at the Triangle Plaza in Shinjuku Sumitomo Building! This event is a corporate exhibition and matching event aimed at expanding business opportunities for small and medium-sized enterprises. Over 300 companies and organizations will participate, promoting their excellent technologies and products to one another.