【Product Introduction Webinar on August 3 (Monday) from 13:30 to 14:00】Introduction of the Intel 8th Generation Ultra-Low Power Core i7 Compatible Single Board Computer MIO-5373.

2 x RS-232, 2 x RS-232/422/485 (power and isolation specifications), 2 x USB 2.0

- 4 COM support ±15kV air gap ESD protection: COM1: RS-232/422/485 (isolation, RS-485 automatic flow control), COM2: RS-232/422/485 (Wake on Ring, RS-485 automatic flow control, 12V/5V power supply (selectable via jumper)), COM3/4: RS-232 (Wake on Ring) - Supports 2 x USB2.0 via internal box wafer connector - Optional rear I/O connector (coastline or internal connector) support - Compatible with MIO-ultra single board computer

• Embedded Board Computers

2-Port Isolated Protection CAN Bus MIOe Module

- Simultaneous operation of two individual CAN networks - High-speed transmission up to 1 Mbps - 16 MHz CAN controller frequency - Reliability ensured by a 2500 VDC optical isolation protection system - Automatically assigned I/O addresses via PCI PnP - LED indicators for transmit/receive status on each port - Includes Windows DLL library and examples - Drivers and utilities for Windows CE5/CE6/XP/7 - Supports Linux 2.4.xx / 2.6.xx; QNX 6.3x/6.4.x/6.5.x on Intel x86 hardware platforms - 2-port CAN-Bus MIOe module (with isolation protection)

• Embedded Board Computers

Equipped with Intel Pentium N4200, Celeron N3350, and Atom E3950/E3940/E3930.

- Intel Pentium N4200 & Celeron N3350, Atom E3950, E3940, E3930, supports up to 8 GB of DDR3L 1867 MHz - DirectX 12.0, OpenGL 4.3, OpenCL 2.0, supports independent display on 3 screens: VGA + LVDS/eDP + HDMI/DP* - Flexible design using integrated multiple I/O: By using MIOe expansion, it is possible to design suitable for specific market applications and retain proprietary know-how - 2 Intel i210 Gigabit Ethernet, rich I/O interfaces (4 COM, 2 SATA, 2 USB 3.0, SMBus/I2C, GPIO full-size Mini PCIe, full-size mSATA) - Supports iManager, RMM, and embedded software API

• Embedded Board Computers

7th generation Intel Core mobile processors, i7, i5, i3 3.5-inch SBC in size 14cm x 10cm.

- 7th generation Intel Core i7 / i5 / i3 + PCH QM175 - Dual channel DDR4 2400, up to 32GB (ECC option) - 1 Intel i210 GbE & 1 Intel i219 GbE with iAMT support - Rich I/O: 2 COM, SATA, USB 3.0, SMBus / I2C, 16-bit GPIO - Full-size mini PCIe or mSATA / M.2 E-key supporting NVME - 12V power input - Full-size mini PCIe or mSATA / M.2 E-key - NVME compatible (optional) - iManager, WISE-PaaS/RMM, emb. SW API support

• Industrial PCs
• Embedded Board Computers

AMDG Series SoC GX-210JA/GX-415GA Pico-ITX Single Board Computer

- Supports embedded AMD G series SoC GX-210JA/GX-415GA with a maximum Quad-Core processor, and supports DDR3/DD3L 1600MHz up to 8GB. - Outstanding graphic performance: Supports DirectX 11.1, independent dual display (18-bit LVDS + VGA or 18-bit LVDS + HDMI). - Flexible design with integrated diverse I/O: MIOe module that leverages domain expertise for specific markets. - Rich I/O interfaces: 2 COM, 1 SATA, USB 3.0, PCIe Mini Card, and mSATA. - Supports SUSIAccess and embedded software API.

• Embedded Board Computers

Intel Pentium N4200 / Celeron N3350 Pico-ITX, full-size mini PCIe

Intel Pentium N4200 / Celeron N3350 Pico-ITX, full-size mini PCIe ● Supports Intel® Pentium N4200/Celeron N3350 embedded, DDR3L 1866MHz up to 8GB ● Compatible with Intel 7th generation DirectX 11.1, dual independent displays: 18/24bit LVDS, VGA, DP/HDMI ● Flexible design using multiple integrated I/O: MIOe approaches vertical applications while maintaining domain expertise ● Rich I/O interfaces with Intel GbE support, 2 COM, 1 SATA, 4 USB 2.0, GPIO, SMBus, I2C, and MIOe expansion interface ● Supports SUSIAccess and embedded software API

• Industrial PCs

Single board computer featuring high reliability and abundant I/O equipped with Intel Celeron & Atom.

Advantech's embedded single board computer (SBC) series includes a lineup of 2.5-inch PICO-ITX, 3.5-inch SBC, and PC/104 form factors. The embedded SBC series features a full range of computer products with rich embedded functionalities and robust designs, aimed at advancing product development while reducing design burdens and project complexities. In addition to a wide range of integrated services, embedded SBCs can also be provided for specialized applications in various domains for AGV and AMR. **Key Features of This Product** - Intel Celeron J1900 & Atom E3825/E3845, DDR3L-1333MHz 2/4GB onboard - Dual display support: HDMI, VGA, LVDS - CPU bottom-up design for system integration and robust design for various factory environments - 3x Intel i210 GbE (eMMC onboard), rich I/O: 4x COM, SATA, USB3.0, SMBus/I2C, 16-bit GPIO, full-size mini PCIe/M.2 E-key, half-size mSATA, 12V/24V power input, SIM card holder

• Industrial PCs
• Embedded Board Computers

MIOe Evaluation Board (for MIO-2262)

MIOe Evaluation Board (for MIO-2262) Specifications and Features - Complete and flexible interface for verification - Accelerates customer carrier board development - All circuit designs follow MI/O extension design guidelines - Utilizes standard EPIC form factor - Interfaces: 1 x DP, 1 x PCIe, 1 x mini PCI, 1 x SIM holder, 1 x USB 3.0, 4 x USB 2.0, 1 x LPC, 1 x SMBus, 1 x I2C, 1 x HD audio line input, 1 x HD audio line output, 1 x HD audio microphone input, powered 1 x SATA, 8-bit GPIO, PWR/HDD LED, PWR/reset button, inverter, +12V power input

• Industrial PCs

Evaluation board for MIO-3260

Evaluation Board for MIO-3260 Specifications and Features - Complete and flexible interface for verification - Accelerates customer carrier board development - All circuit designs follow MI/O expansion design guidelines - Uses standard EPIC form factor - Interfaces: 1 x DP, 1 x PCIe, 1 x mini PCI, 1 x SIM holder, 1 x USB 3.0, 4 x USB 2.0, 1 x LPC, 1 x SMBus, 1 x I2C, 1 x HD audio line input, 1 x HD audio line output, 1 x HD audio microphone input, powered 1 x SATA, 8-bit GPIO, PWR/HDD LED, PWR/reset button, inverter, +12V power input

• Industrial PCs

MIOe Evaluation Board (for MI/O-Compact and MI/O-Ultra SBC)

MIOe Evaluation Board (for MI/O-Compact and MI/O-Ultra SBC) Specifications and Features - Compatible with both MI/O-Compact SBC and MI/O-Ultra SBC - All circuit designs conform to the MI/O Expansion Design Guide - Mechanical design for diverse applications - Complete and flexible interface for verification - Uses standard ATX form factor - Interfaces: 3 PCIe x1, 1 DP, 1 mini PCI, 1 SIM, 1 USB 3.0, 1 USB 2.0, 1 LPC, 1 SMBus, 1 LineOut (with amplifier), system fan, +12V power input

• Industrial PCs

DC to DC power module MI /O chassis compliant from 9 to 36V

Specifications and Features DC power module MI/O compliant with 9-36V DC chassis

• Industrial PCs

The goal is not to introduce AI. We will explain "standardization of manufacturing processes" to eliminate dependency and maximize the effectiveness of AI! While the spread of generative AI is progressing, there is an increasing number of manufacturing companies that say, "We don't know where to apply AI due to the black box nature of the site," and "Despite implementation, productivity hasn't increased." The cause lies not in the performance of AI, but in the "lack of business organization and standardization before implementation." In this webinar, we will clearly explain business improvement methods (BPMS) and how to properly organize business processes to avoid wasting AI investments, using case studies. [Recommended for those who:] - Are struggling to engage the field due to resistance like "busy" or "it's fine as it is." - Want to eliminate differences in rules between factories and locations, as well as dependency and black box issues with veteran employees. - Are being asked to "utilize AI" but don't know where to start due to disorganized business processes. [Here is the application form] https://www.earthlink.co.jp/seminar/10840/ *Pre-registration required (free) *We will give a "partial excerpt of the presentation materials" to those who respond to the survey after viewing.

[Speaker] Ms. Sayako Sumomo, Director, International Equipment Division, Equipment Policy Department, Acquisition, Technology & Logistics Agency [Key Lecture Content] As the security environment surrounding our country changes at an accelerating pace, the government is promoting defense equipment transfers as an important policy measure to create a desirable security environment for our nation. Promoting defense equipment transfers not only enhances regional deterrence and response capabilities for peace and stability in the Indo-Pacific region but also contributes to strengthening our country's defense production and technological base through market expansion and supply chain cooperation. Furthermore, the development of the defense industry and other industries with dual-use technologies can lead to growth in the Japanese economy. In this lecture, I will explain recent trends in defense equipment transfers, taking into account the recent revisions to the equipment transfer system. [Lecture Topics] 1. Japan's Defense Policy 2. Significance and System of Equipment Transfers 3. Recent Trends in Equipment Transfers 4. Government Initiatives 5. Q&A / Business Card Exchange

[Speaker] Hiroki Hara, Country Lead, Cloud & Service Provider Segment, Schneider Electric Holdings Co., Ltd. [Key Lecture Content] In the era of AI, it is essential to redesign not just the equipment but the very way energy is utilized in data centers. This presentation will organize the approach to power architecture aimed at enhancing competitiveness, taking into account global trends and the constraints of the Japanese market. Additionally, through Schneider Electric's comprehensive portfolio, which includes cooling and operations, we will provide perspectives for selecting optimal options in Japan's increasingly complex power environment, as well as hints for future implementations. [Lecture Items] 1. Introduction to Schneider Electric 2. Global megatrends and the external environment surrounding the data center industry 3. Architecture of data center power infrastructure - Design philosophy necessary for safely delivering electricity 4. Schneider's portfolio connecting power and cooling, design, construction, and operation 5. Unique challenges of the Japanese market and options for optimal solutions 6. Q&A / Business card exchange

[Speaker] Yuya Sato, Director, Innovation Management Co., Ltd. [Lecture Topics] 1. Main challenges in the field of research and development 2. Overview of research and development management 3. How to utilize "roadmaps" for formulating persuasive mid- to long-term strategies 4. How to utilize "technology portfolios" to achieve convincing resource allocation 5. "Gate management" to improve the success rate of highly innovative research and development themes 6. Integrated research and development management process 7. Q&A

Our TL Division will be exhibiting at the "Surface Treatment Processing Technology Exhibition 2026" to be held on June 26 (Friday) at the Osaka Industry Creation Center. We invite you to visit our booth to see our products and technologies. We sincerely look forward to your attendance. ■ Exhibition Name Surface Treatment Processing Technology Exhibition 2026 ■ Date June 26, 2026 (Friday) ■ Venue Osaka Industry Creation Center, 3F Market Plaza / 4F Event Hall ■ Exhibited Technology We will introduce optimal solutions for surface modification composites and ultra-hard coating removal by adding a new coating to Y-Coat, which leads the mold market. New Coating: Y-Coat Type UL Product Introduction Page