【Product Introduction Webinar on August 3 (Monday) from 13:30 to 14:00】Introduction of the Intel 8th Generation Ultra-Low Power Core i7 Compatible Single Board Computer MIO-5373.

2 x RS-232, 2 x RS-232/422/485 (power and isolation specifications), 2 x USB 2.0

- 4 COM support ±15kV air gap ESD protection: COM1: RS-232/422/485 (isolation, RS-485 automatic flow control), COM2: RS-232/422/485 (Wake on Ring, RS-485 automatic flow control, 12V/5V power supply (selectable via jumper)), COM3/4: RS-232 (Wake on Ring) - Supports 2 x USB2.0 via internal box wafer connector - Optional rear I/O connector (coastline or internal connector) support - Compatible with MIO-ultra single board computer

• Embedded Board Computers

2-Port Isolated Protection CAN Bus MIOe Module

- Simultaneous operation of two individual CAN networks - High-speed transmission up to 1 Mbps - 16 MHz CAN controller frequency - Reliability ensured by a 2500 VDC optical isolation protection system - Automatically assigned I/O addresses via PCI PnP - LED indicators for transmit/receive status on each port - Includes Windows DLL library and examples - Drivers and utilities for Windows CE5/CE6/XP/7 - Supports Linux 2.4.xx / 2.6.xx; QNX 6.3x/6.4.x/6.5.x on Intel x86 hardware platforms - 2-port CAN-Bus MIOe module (with isolation protection)

• Embedded Board Computers

Equipped with Intel Pentium N4200, Celeron N3350, and Atom E3950/E3940/E3930.

- Intel Pentium N4200 & Celeron N3350, Atom E3950, E3940, E3930, supports up to 8 GB of DDR3L 1867 MHz - DirectX 12.0, OpenGL 4.3, OpenCL 2.0, supports independent display on 3 screens: VGA + LVDS/eDP + HDMI/DP* - Flexible design using integrated multiple I/O: By using MIOe expansion, it is possible to design suitable for specific market applications and retain proprietary know-how - 2 Intel i210 Gigabit Ethernet, rich I/O interfaces (4 COM, 2 SATA, 2 USB 3.0, SMBus/I2C, GPIO full-size Mini PCIe, full-size mSATA) - Supports iManager, RMM, and embedded software API

• Embedded Board Computers

7th generation Intel Core mobile processors, i7, i5, i3 3.5-inch SBC in size 14cm x 10cm.

- 7th generation Intel Core i7 / i5 / i3 + PCH QM175 - Dual channel DDR4 2400, up to 32GB (ECC option) - 1 Intel i210 GbE & 1 Intel i219 GbE with iAMT support - Rich I/O: 2 COM, SATA, USB 3.0, SMBus / I2C, 16-bit GPIO - Full-size mini PCIe or mSATA / M.2 E-key supporting NVME - 12V power input - Full-size mini PCIe or mSATA / M.2 E-key - NVME compatible (optional) - iManager, WISE-PaaS/RMM, emb. SW API support

• Industrial PCs
• Embedded Board Computers

AMDG Series SoC GX-210JA/GX-415GA Pico-ITX Single Board Computer

- Supports embedded AMD G series SoC GX-210JA/GX-415GA with a maximum Quad-Core processor, and supports DDR3/DD3L 1600MHz up to 8GB. - Outstanding graphic performance: Supports DirectX 11.1, independent dual display (18-bit LVDS + VGA or 18-bit LVDS + HDMI). - Flexible design with integrated diverse I/O: MIOe module that leverages domain expertise for specific markets. - Rich I/O interfaces: 2 COM, 1 SATA, USB 3.0, PCIe Mini Card, and mSATA. - Supports SUSIAccess and embedded software API.

• Embedded Board Computers

Intel Pentium N4200 / Celeron N3350 Pico-ITX, full-size mini PCIe

Intel Pentium N4200 / Celeron N3350 Pico-ITX, full-size mini PCIe ● Supports Intel® Pentium N4200/Celeron N3350 embedded, DDR3L 1866MHz up to 8GB ● Compatible with Intel 7th generation DirectX 11.1, dual independent displays: 18/24bit LVDS, VGA, DP/HDMI ● Flexible design using multiple integrated I/O: MIOe approaches vertical applications while maintaining domain expertise ● Rich I/O interfaces with Intel GbE support, 2 COM, 1 SATA, 4 USB 2.0, GPIO, SMBus, I2C, and MIOe expansion interface ● Supports SUSIAccess and embedded software API

• Industrial PCs

Single board computer featuring high reliability and abundant I/O equipped with Intel Celeron & Atom.

Advantech's embedded single board computer (SBC) series includes a lineup of 2.5-inch PICO-ITX, 3.5-inch SBC, and PC/104 form factors. The embedded SBC series features a full range of computer products with rich embedded functionalities and robust designs, aimed at advancing product development while reducing design burdens and project complexities. In addition to a wide range of integrated services, embedded SBCs can also be provided for specialized applications in various domains for AGV and AMR. **Key Features of This Product** - Intel Celeron J1900 & Atom E3825/E3845, DDR3L-1333MHz 2/4GB onboard - Dual display support: HDMI, VGA, LVDS - CPU bottom-up design for system integration and robust design for various factory environments - 3x Intel i210 GbE (eMMC onboard), rich I/O: 4x COM, SATA, USB3.0, SMBus/I2C, 16-bit GPIO, full-size mini PCIe/M.2 E-key, half-size mSATA, 12V/24V power input, SIM card holder

• Industrial PCs
• Embedded Board Computers

MIOe Evaluation Board (for MIO-2262)

MIOe Evaluation Board (for MIO-2262) Specifications and Features - Complete and flexible interface for verification - Accelerates customer carrier board development - All circuit designs follow MI/O extension design guidelines - Utilizes standard EPIC form factor - Interfaces: 1 x DP, 1 x PCIe, 1 x mini PCI, 1 x SIM holder, 1 x USB 3.0, 4 x USB 2.0, 1 x LPC, 1 x SMBus, 1 x I2C, 1 x HD audio line input, 1 x HD audio line output, 1 x HD audio microphone input, powered 1 x SATA, 8-bit GPIO, PWR/HDD LED, PWR/reset button, inverter, +12V power input

• Industrial PCs

Evaluation board for MIO-3260

Evaluation Board for MIO-3260 Specifications and Features - Complete and flexible interface for verification - Accelerates customer carrier board development - All circuit designs follow MI/O expansion design guidelines - Uses standard EPIC form factor - Interfaces: 1 x DP, 1 x PCIe, 1 x mini PCI, 1 x SIM holder, 1 x USB 3.0, 4 x USB 2.0, 1 x LPC, 1 x SMBus, 1 x I2C, 1 x HD audio line input, 1 x HD audio line output, 1 x HD audio microphone input, powered 1 x SATA, 8-bit GPIO, PWR/HDD LED, PWR/reset button, inverter, +12V power input

• Industrial PCs

MIOe Evaluation Board (for MI/O-Compact and MI/O-Ultra SBC)

MIOe Evaluation Board (for MI/O-Compact and MI/O-Ultra SBC) Specifications and Features - Compatible with both MI/O-Compact SBC and MI/O-Ultra SBC - All circuit designs conform to the MI/O Expansion Design Guide - Mechanical design for diverse applications - Complete and flexible interface for verification - Uses standard ATX form factor - Interfaces: 3 PCIe x1, 1 DP, 1 mini PCI, 1 SIM, 1 USB 3.0, 1 USB 2.0, 1 LPC, 1 SMBus, 1 LineOut (with amplifier), system fan, +12V power input

• Industrial PCs

DC to DC power module MI /O chassis compliant from 9 to 36V

Specifications and Features DC power module MI/O compliant with 9-36V DC chassis

• Industrial PCs

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including new ones. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to attend this event. 【 Exhibition Name 】 31st Measurement and Measurement Exhibition INTERMEASURE 2024 Official Website: https://intermeasure.org/itms2024/ 【 Dates 】 From __ (Wednesday) to __ (Friday), 202_ 【 Venue 】 Tokyo Big Sight (Tokyo International Conference Center) East Hall (Booth Number: ___) 【 Exhibited Products 】 - Air Leak Tester - Hydrogen Leak Detector - Pin Hole (Reference Test Piece) and more. For more details, please refer to the "Related Materials" (PDF file) below.

Metal 3D printers can create complex shapes that are very difficult to achieve with conventional processing methods and technologies, including integrated complex shape manufacturing, 3D freeform pipe manufacturing, lattice and porous structure manufacturing, and hybrid structure manufacturing. This enables the creation of innovative die-casting molds, cost reduction and quality improvement, short-term prototyping and manufacturing, dramatic reductions in the number of parts, lightweighting, significant reductions in manufacturing processes and workforce, and extended mold life. In this seminar, advanced users J.3D and Castec, who boast top-level technology in die-casting mold production using metal 3D printers in Japan, will specifically explain the high-functionality and high-quality die-casting molds, core pins, and low-cost molds produced through 3D pipe and porous manufacturing with EOS-manufactured metal 3D printers, along with concrete examples of molding technologies and case studies, including success and failure stories. Additionally, we will introduce the recently popular topic of giga-casting, which has garnered attention in the United States and China. With the aim of solving various issues such as defects in die-casting molds, extending mold life, and significantly shortening molding time, and due to the retirement of veteran skilled workers making it increasingly difficult to produce high-quality, low-cost molds, the production of molds using metal 3D printers has been rapidly increasing recently.

We will be exhibiting at the exhibition "JASIS 2026," where cutting-edge science, analysis systems, and solutions come together. At our booth, we will showcase systems used for gas analyzers. Scheduled products for exhibition: - Automatic analysis system for high-purity gas products - MS-LIBS

[Lecturer] Arthur D. Little Japan, Inc. Principal Yuga Yabuuchi Manager Takuma Mitsukuni Consultant Takayuki Nakagami [Key Lecture Content] With the spread of generative AI, the focus of the AI development competition is rapidly shifting from "learning" to "inference." The emergence of AI agents has dramatically increased the volume of inference processing and is beginning to significantly change the competitive structure of the entire AI infrastructure, including AI semiconductors, data centers, and the cloud. These changes are also bringing new business opportunities for Japanese companies. In this lecture, we will analyze the structural changes in the AI inference market and the strategies of key players, and explain the areas of AI that Japan should strengthen, as well as the strategic direction for Japanese companies to establish a competitive advantage. [Lecture Items] 1. Shift from "learning" to "inference" in the AI market 2. New competitive axes that become important in the AI inference era 3. Methods and initiatives of major companies aimed at improving AI inference efficiency 4. Importance of memory selection in improving AI inference efficiency 5. Direction of initiatives towards achieving sovereign AI 6. Q&A / Business card exchange

[Speaker] Hao Li Dai, Head of Renewable Energy Aggregation Division, Natural Power Co., Ltd. [Key Lecture Content] With the spread of generative AI and the new construction of data centers and semiconductor factories, Japan's electricity demand, which has been declining for a long time, is expected to turn to an increase. On the other hand, the output control of renewable energy is increasing, becoming prolonged, and expanding in scope, while the revenue predictability for power sources is decreasing. Why is it that while demand is increasing, power sources are not being rewarded? The issue is not just about "quantity," but also about the mismatch of "time," "location," and "risk bearers." In this lecture, we will discuss our company's initiatives and organize the methods for maximizing profits in the post-FIT era, as well as the conditions under which aggregators can support fixed prices. We hope this will assist in the decision-making of both power holders and consumers. [Lecture Items] 1. How far will electricity demand grow, and what will it seek? 2. The economics of power sources in the post-FIT era 3. How to earn by power type 4. Why is the ecosystem not functioning? 5. Conditions for establishing "buying at a fixed price" 6. Decision-making from tomorrow 7. Q&A / Business card exchange