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  1. Home
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  3. グレープシステム
  4. ITmedia Virtual EXPO Autumn 2020
SEMINAR_EVENT
  • Aug 21, 2020
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Aug 21, 2020

ITmedia Virtual EXPO Autumn 2020

グレープシステム グレープシステム
Grape System will exhibit at "ITmedia Virtual EXPO," one of the largest virtual exhibitions in Japan, aimed at information gathering for specialists in various industries such as manufacturing and construction. More than 100 companies will participate in five EXPOs: "Mechanical Design," "Smart Factory," "Embedded Development & Electronics/AI," "Building × IT," and "Retail & Logistics Supply Chain," delivering the latest technology and product information. This is a new style of exhibition held online. Registration is free and available for a limited time, so please be sure to register. All of us at Grape System look forward to your visit.
Date and time Always open
Capital
Entry fee Free
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Related product

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Bluetooth products

The embedded BT stack "Bluelet" has a proven track record of being adopted in 20 million devices, providing the highest performance for devices utilizing BT.

The Bluetooth protocol stack "Bluelet," developed by Barrot Corporation (formerly IVT Wireless), has been adopted by 20 million units across 150 companies worldwide, providing the best performance for various Bluetooth-enabled devices such as mobile phones, headsets, printers, and keyboards.

  • Software (middle, driver, security, etc.)
  • Other network tools

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Bluetooth module

Bluetooth module for embedded systems 'Barrot Module'

The Bluetooth module developed by Barrot Corporation (formerly IVT Wireless) for embedded applications has a proven track record of being adopted in numerous products worldwide, providing the best performance for various devices utilizing Bluetooth. It also supports the original stack "Bluelet" and can accommodate profile implementation, profile extensions, and customizations.

  • Other network tools

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Comprehensive catalog of embedded middleware products

Comprehensive catalog of embedded middleware products! Available for free.

"GRAPEWARE" is middleware developed by our company for embedded systems. We are currently offering a comprehensive catalog for free. ======= Features ======== ■ Shortened development time and reduced development costs The middleware provided by Grapesystem Co., Ltd. helps shorten the development period for embedded devices and contributes to cost reduction by narrowing the debugging scope. ■ Wide range of solutions A wide variety of detailed solutions can be provided through combinations of various products. It can be used on real-time operating systems such as μITRON. ■ Easy-to-implement pricing With a royalty-free contract, it is ideal for mass-produced products. ■ Source code provided The product is written in ANSI C. ■ Integration services A strong team of engineers provides extensive support from porting and customization to application development. We undertake contract development in various fields, including network devices, digital cameras, printers, and semiconductor manufacturing equipment. ★ For more details, please request materials or refer to the catalog ★

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Grape System Inc. Business Introduction

Grape System is an expert in embedded and printer development.

Since its establishment in 1991, the company has been engaged in the sale and support of its own developed software products for embedded devices, as well as the sale and support of imported products primarily from overseas and contract development. We continue to maintain the high technical standards of embedded development that we have cultivated over the years, and our self-developed GRAPEWARE products, centered around USB and FILE, are used by over 450 companies. In recent years, we have also focused on areas such as IoT, voice recognition, and open-source management, actively promoting proposal activities that help solve our customers' challenges. At Grape System, we strive to maintain a spirit of gratitude and continuous improvement, and based on the "Corporate Philosophy" below, we aim to actively embrace change while coexisting with courageous reform and prudent maintenance, always wanting to exist as a unique company for our customers. 【Business Activities】 ○ Development, sales, and support of software products related to embedded devices ○ Sales and technical support for imported software for embedded devices ○ Development, sales, and support of software products related to printing technology in general ○ Contract development specializing in embedded devices and printing technology ○ General consulting services related to the above

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[Notice of Exhibition Participation by Fukuda Co., Ltd.] TOKYO PACK 2026 Tokyo International Packaging Exhibition

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  • SEMINAR_EVENT

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

Oct 08, 2026

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Creating an environment that thrives even in extreme heat: Introducing the results of closed-type greenhouse demonstrations and summer cooling methods - Exhibiting at the 14th Agricultural WEEK (commonly known as J-AGRI)

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  • SEMINAR_EVENT

Yazaki Energy System will be exhibiting at the "14th Agricultural WEEK (commonly known as J-AGRI)" held at Makuhari Messe. In response to challenges surrounding agriculture, such as record heat and soaring energy prices, our company proposes an agricultural system that utilizes surplus solar heat and waste heat from factories during the summer to support stable cultivation throughout the year, from winter heating to summer cooling. ■ Exhibition Details (Booth Number: 25-47) <Closed-type Agricultural House> Results from the second season and initiatives for the third season <Localized Cooling in Solar-Powered Agricultural Houses> Mechanism of substrate cooling, comparison of energy consumption with spatial cooling, growth conditions this summer <Cooling and Heating with Solar Heat> Examples of crown heating and house cooling, utilization of surplus heat in summer <Cooling of Crops and Workers with Well Water> Exhibition of a prototype well water cooler and proposals for the use of cooling jackets When you visit, please be sure to stop by our booth.

Oct 06, 2026

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Information on Autumn/Winter Internships for the Class of 2028

  • NEW
  • SEMINAR_EVENT

We would like to inform you about the autumn and winter internship opportunities for the 2028 graduates. 1. Open Company Dates: October 23, 2026 (Friday), November 11, 2026 (Wednesday), December 10, 2026 (Thursday), January 21, 2027 (Thursday) Time: 13:30 - 15:30 Location: Online (Microsoft Teams) 2. 1-Day Job Experience Dates: November 17, 2026 (Tuesday), December 16, 2026 (Wednesday) January 15, 2027 (Friday), January 27, 2027 (Wednesday), February 4, 2027 (Thursday), February 10, 2027 (Wednesday), February 18, 2027 (Thursday) Time: 10:00 - 17:30 (tentative) Location: Takaya Corporation Headquarters (661-1 Ibara-cho, Ibara City, Okayama Prefecture)

Oct 06, 2026

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Notice of Participation in FOOD Expo 2026 (November 11-13, 2026)

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  • SEMINAR_EVENT

Notice of participation in the "FOOD Expo 2026." 【Date and Time】  November 11 (Wednesday) - 13 (Friday), 2026  Opening hours: 10:00 AM - 5:00 PM 【Venue】  Tokyo Big Sight  East Hall 2, Booth Number B-36 【Exhibits】  Cardboard insulated boxes  Craft cooler cubes  Vacuum insulated panel  Pallet cubes

Oct 06, 2026

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[Seminar] From Generative AI to Physical AI: The Cutting Edge of Market and Industry Structure and Technology Development

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[Lecture Topics] 1. Co-creation Strategy to Deliver AI to the Field - Business Development and Joint Ventures in the Era of Generative AI and Physical AI Mr. Haruto Suzuki, Industrial and Regional Research Department, Development Bank of Japan 1. The Mechanism of Generative AI and Its Current Utilization by Companies 2. Expansion of the Generative AI Market and AI Infrastructure 3. Transition from Generative AI to Physical AI 4. Bottlenecks in Social Implementation and Solutions through Joint Ventures 5. Formation of an Implementation Ecosystem through Policy and Finance 6. Q&A / Business Card Exchange 2. Needs, Development Trends, Future Possibilities, and Challenges of Physical AI Mr. Kazushi Asama, Senior Researcher, Next-Generation Robot Research Organization, Waseda University / Emeritus Professor, University of Tokyo 1. What Physical AI Means 2. Needs for Physical AI and the Technological Trends of Generative AI Behind It 3. Development Trends of Physical AI 4. Future Possibilities and Challenges of Physical AI 5. Q&A / Business Card Exchange

Oct 06, 2026

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