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  3. ヘルヴェチア
  4. Notice of Participation in the 'New Manufacturing and New Services Exhibition for Small and Medium Enterprises' from December 7 (Monday) to December 9 (Wednesday), 2020.
SEMINAR_EVENT
  • Oct 28, 2020
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Oct 28, 2020

Notice of Participation in the 'New Manufacturing and New Services Exhibition for Small and Medium Enterprises' from December 7 (Monday) to December 9 (Wednesday), 2020.

ヘルヴェチア ヘルヴェチア
Our company will be exhibiting at the "New Manufacturing and New Services Exhibition for Small and Medium Enterprises" held at Tokyo Big Sight from December 7 (Monday) to December 9 (Wednesday), 2020. On that day, we will showcase the IoT gateway adapter "VPLC-2000" and the "HD-PLC communication device" compatible with external power supplies. We sincerely apologize for the inconvenience during your busy schedule, but we kindly ask you to visit our booth. 【Overview】 <Exhibited Products> ■ IoT Gateway Adapter "VPLC-2000" ■ "HD-PLC Communication Device" compatible with external power supplies <Features> ・Easily enables IP conversion of various control devices ・Adapter suitable for use with twisted pair cables and coaxial cables ・Operates on DC12V power supply ・Achieves high-speed communication ・High noise resistance performance
Date and time Monday, Dec 07, 2020 ~ Wednesday, Dec 09, 2020
■Monday, the 7th: 11:00 AM - 5:00 PM (Opening ceremony scheduled for 10:40 AM) ■Tuesday, the 8th: 10:00 AM - 5:00 PM ■Wednesday, the 9th: 10:00 AM - 4:00 PM
Capital ■Venue: Tokyo Big Sight, A Hall, Aomi Exhibition Center ■Booth Number: L38 ■Address: 1-2-33 Aomi, Koto City, Tokyo 135-0064 ■Access < Rinkai Line > - Tokyo Teleport Station (about 2 minutes on foot) < Yurikamome > - Aomi Station (about 4 minutes on foot) - Odaiba Kaihin Koen Station (about 6 minutes on foot)
Entry fee Free *Pre-registration is required.
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poc-700-intel-corei3-n305-atom-x7425e-compact-fanless-pc.jpg

Fanless Embedded PC for Industrial and Surveillance Use 'POC-700'

Intel Core i3-N305 / Atom x7425E Ultra Compact Embedded Computer

The "POC-700 Series" is a super compact fanless embedded computer. It is active in the fields of machine vision, surveillance/security, and inspection equipment. ■ Features - Manufacturer: Neousys - Compact: 64mm x 116mm x 176mm - Equipped with Intel Alder Lake Core i3-N305 processor (POC-715) - Equipped with Intel Alder Lake Atom x7425E processor (POC-712) - 4x Ethernet (Intel I350-AM4) - 1x DP, 1x HDMI - 4x USB 3.2 ports - 4x Serial ports - Fanless - Wide range power input (8~35V) Neousys is a manufacturer specializing in the development of reliable embedded products for industrial use. Our company, Helvetia, has a cooperative relationship as a domestic agent in Japan and has a proven track record of delivering many embedded products to domestic manufacturers.

  • Industrial PCs

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image_4879.png

Platform "Nuvo-7160GC Series"

High durability! Compatible with 120W NVIDIA GPU and Intel 9th/8th generation Core processors.

The "Nuvo-7160GC series" is a robust GPU-enabled edge computing platform designed for new machine learning applications such as autonomous driving, facial recognition, and machine vision. It supports GPUs with a maximum of 120W and provides 4 to 6 TFLOPS of computational power for inference. Additionally, it achieves up to a 50% improvement in CPU performance over the previous generation with Intel's 9th/8th generation Coffee Lake Core 8/6 core CPUs. 【Features】 ■ Supports NVIDIA GPU graphics cards with a maximum TDP of 120W ■ Patented thermal design enabling operation in a wide temperature range of -25°C to 60°C ■ Compatible with Intel 9th/8th generation Core 35W/65W LGA1151 CPUs ■ Supports up to 6x GigE ports with 9.5 KB jumbo frame support Neousys is a reliable manufacturer of embedded products for industrial applications. Helvetia has a cooperative relationship as a domestic agent in Japan and has a proven track record of delivering numerous embedded products to domestic manufacturers. *For more details, please refer to the PDF document or feel free to contact us.

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[Notice of Exhibition Participation by Fukuda Co., Ltd.] TOKYO PACK 2026 Tokyo International Packaging Exhibition

  • NEW
  • SEMINAR_EVENT

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

Oct 07, 2026

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Information on Autumn/Winter Internships for the Class of 2028

  • NEW
  • SEMINAR_EVENT

We would like to inform you about the autumn and winter internship opportunities for the 2028 graduates. 1. Open Company Dates: October 23, 2026 (Friday), November 11, 2026 (Wednesday), December 10, 2026 (Thursday), January 21, 2027 (Thursday) Time: 13:30 - 15:30 Location: Online (Microsoft Teams) 2. 1-Day Job Experience Dates: November 17, 2026 (Tuesday), December 16, 2026 (Wednesday) January 15, 2027 (Friday), January 27, 2027 (Wednesday), February 4, 2027 (Thursday), February 10, 2027 (Wednesday), February 18, 2027 (Thursday) Time: 10:00 - 17:30 (tentative) Location: Takaya Corporation Headquarters (661-1 Ibara-cho, Ibara City, Okayama Prefecture)

Oct 06, 2026

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[Seminar] From Generative AI to Physical AI: The Cutting Edge of Market and Industry Structure and Technology Development

  • NEW
  • SEMINAR_EVENT

[Lecture Topics] 1. Co-creation Strategy to Deliver AI to the Field - Business Development and Joint Ventures in the Era of Generative AI and Physical AI Mr. Haruto Suzuki, Industrial and Regional Research Department, Development Bank of Japan 1. The Mechanism of Generative AI and Its Current Utilization by Companies 2. Expansion of the Generative AI Market and AI Infrastructure 3. Transition from Generative AI to Physical AI 4. Bottlenecks in Social Implementation and Solutions through Joint Ventures 5. Formation of an Implementation Ecosystem through Policy and Finance 6. Q&A / Business Card Exchange 2. Needs, Development Trends, Future Possibilities, and Challenges of Physical AI Mr. Kazushi Asama, Senior Researcher, Next-Generation Robot Research Organization, Waseda University / Emeritus Professor, University of Tokyo 1. What Physical AI Means 2. Needs for Physical AI and the Technological Trends of Generative AI Behind It 3. Development Trends of Physical AI 4. Future Possibilities and Challenges of Physical AI 5. Q&A / Business Card Exchange

Oct 06, 2026

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Notice of Participation in FOOD Expo 2026 (November 11-13, 2026)

  • NEW
  • SEMINAR_EVENT

Notice of participation in the "FOOD Expo 2026." 【Date and Time】  November 11 (Wednesday) - 13 (Friday), 2026  Opening hours: 10:00 AM - 5:00 PM 【Venue】  Tokyo Big Sight  East Hall 2, Booth Number B-36 【Exhibits】  Cardboard insulated boxes  Craft cooler cubes  Vacuum insulated panel  Pallet cubes

Oct 06, 2026

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[Seminar] How is it changing? The revenue structure of grid storage batteries

  • NEW
  • SEMINAR_EVENT

[Instructor] Yasuhiko Ogushi, Co-Representative, Bayside Energy Insights LLP [Key Lecture Content] In Japan's demand-supply adjustment market, the entry of storage batteries has intensified bidding competition, with the national bidding competition rate for primary adjustment capacity exceeding 1x by June 2026. Furthermore, preliminary figures from September indicate a notable decline in the average winning bid price for storage batteries. Is the current change temporary, or does it signal a transformation in future revenue structures? This lecture will analyze the current state of the domestic market using data on recruitment volume, bidding volume, contract rates, and prices. It will then conduct a detailed analysis of the leading markets in the UK and the US, examining how the increase in storage battery entries has impacted the revenue of the adjustment capacity market and how the roles of other markets, such as the wholesale electricity market, have changed following the revenue decline. Attention will also be paid to the differences in market systems and the factors contributing to revenue decline across countries and regions. Finally, the lecture will organize the factors that will influence future revenues in Japan's demand-supply adjustment, wholesale, and capacity markets, providing business operators engaged in grid storage battery investments with materials to create new revenue assumptions or to reassess existing revenue assumptions.

Oct 06, 2026

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