Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.

Ultrasonic assisted spindle equipped with a dual-end support mechanism that enables high-speed, high-precision cutting, improving productivity and quality - Ultrasonic dicing device!!

The mass production ultrasonic dicing device "CSX501" is a dicing machine that cuts difficult materials such as SiC, GaN, and fine ceramics with high speed and precision. The ultrasonic-assisted cutting with "CSX501" adds ultrasonic assistance to the "force generated by the rotation of the blade," allowing the blade to "vibrate in the outward direction" while cutting. This technology enables the achievement of improved throughput, reduced running costs, and increased yield while maintaining high-quality cutting. Furthermore, the addition of device monitoring functions allows for remote support, contributing to a reduction in recovery time from unexpected troubles. Additionally, by equipping various optional functions, it also contributes to the control of blade edge shapes and the reduction of cutting burrs. *We also conduct evaluations by cutting sample work upon request, so please feel free to contact us. *For more details, please refer to the PDF materials.

• Ultrasonic Oscillator
• Other processing machines
• Other cutting tools

A single-layer resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from a high-pressure jet.

A research and development device that combines a standard straight nozzle with a high-pressure jet nozzle, designed for resist stripping and metal lift-off processes for small-scale production. It features a compact design that can be installed in tight spaces (approximately 40% more compact than conventional models). The one-chamber system performs resist stripping, lift-off, rinsing, and drying all in a single chamber, contributing not only to high throughput but also to reduced footprint. Additionally, it is possible to separate and recover the used chemicals for reuse, which helps reduce running costs. *It can also be repurposed as an organic cleaning device, not just for resist stripping and lift-off.*

• Resist Device
• High pressure cleaner

A single-layer resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from a high-pressure jet.

A mass production-oriented resist stripping and metal lift-off processing device that combines a standard straight nozzle with a high-pressure jet nozzle. The one-chamber type, which performs resist stripping, lift-off, rinsing, and drying all in one chamber, contributes not only to high throughput but also to a reduced footprint. Additionally, it is possible to separate and recover the used chemicals for reuse, which helps reduce running costs. *It can also be repurposed as an organic cleaning device, not just for resist stripping and lift-off. 【Features】 ■ Unique jet lift-off mechanism with high stripping performance ■ Improved flexibility and reduced running costs to accommodate small quantities of various products and fluctuations in production volume ■ Improved quality and yield through single wafer processing (achieving precise processing without cross-contamination and enhancing uniformity and control across the surface) *For more details, please contact us or download the PDF for further information.

• High pressure cleaner

Dicing ring (frame) cleaning device available in two types: jet cleaning type (non-contact) and scrub cleaning type (contact).

Have you been struggling with running costs and labor issues due to manual cleaning or relying on contractors for cleaning? This device automatically cleans dicing frames through automated transport. - Jet cleaning type (focused on reducing running costs) - Scrub cleaning type (focused on cleaning power) We offer these two types in our lineup. By selecting a specification that matches the dirt on the frames you use, we can propose quality and cost benefits. Additionally, dicing frames with tape (sheets) can also be processed, allowing for tape removal and cleaning within the device. (*Optional)

• Other semiconductor manufacturing equipment

A sheet-type resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from high-pressure jets [testable].

A metal lift-off processing device for research and development that combines a standard straight nozzle with a high-pressure jet nozzle. This model is a compact version of the TWPm, further miniaturized and cost-effective by omitting the transport unit. The one-chamber complete type performs resist stripping, lift-off, rinsing, and drying all in one chamber, contributing not only to high throughput but also to a reduced footprint. Additionally, it is possible to separate and recover the used chemicals for reuse, which helps reduce running costs. *It can also be repurposed as an organic cleaning device, not just for resist stripping and lift-off. 【Features】 ■ 60% reduction in footprint (compared to our TWPm) ■ One-chamber completion ■ Prevention of chemical backflow (patented) ■ Prevention of liquid and mist scattering and reattachment *For more details, please contact us or download the PDF for further information.

• Resist Device
• Other semiconductor manufacturing equipment
• High pressure cleaner

Achieving efficiency in the preparation of cross-sectional observation samples! Ultrasonic cutting device for ion milling pretreatment can also replace polishing machines. *Demo tests available.

This is a device specialized for the production of cross-sectional observation samples that can simultaneously "cut" and "polish" using the cutting surface polishing effect of "ultrasonic cutting technology" (PolishCutTM). It is particularly used in situations where many cross-sectional observation samples are being produced. We also have a demo environment where you can actually cut your samples and evaluate them, so please feel free to contact us. 【Features】 ■ Clean cutting surface ■ Accurate cutting at the targeted position ■ Cutting of invisible objects by overlaying X-ray images with monitor images ■ Skill-free production of cross-sectional observation samples ■ Can be used as a pre-treatment device for ion milling to reduce milling time *For more details, please contact us or download the PDF for more information.

• Analytical Equipment and Devices

No resin embedding! Achieving efficiency in cross-section sample preparation without the need for skills. Contributing to the efficiency of SEM observation. 'Ultrasonic Cutting Device CSX-100Lab'

The cross-section sample preparation device "CSX-100Lab" is a specialized device that utilizes the cutting surface polishing effect (PolishCut) of our uniquely developed "ultrasonic cutting technology" to simultaneously perform "cutting" and "polishing." It is ideal for improving the efficiency of cross-sectional observation, failure analysis, defect analysis, structural analysis, and verification of manufacturing conditions. Features include: 1) clean cross-sections, 2) precise cutting at targeted positions, 3) cutting of invisible objects by overlaying drawings or X-ray images with monitor images (skeleton cut option), 4) skill-free cross-section sample preparation, 5) reduction of milling time when used as a pre-treatment device for ion milling during SEM observation, and 6) cross-sectional observation of small chip components like 0402. It is particularly used in situations where many cross-section samples are prepared. We also have a demo environment where you can evaluate the actual cutting of your samples, so please feel free to contact us!

• Analytical Equipment and Devices

Rineo Solutions will be exhibiting at EdgeTech+ 2025. At the venue, we will introduce the total solutions from the Cybertrust Group that can be widely used from the design to the operational phase of embedded Linux development. We invite you to visit the Cybertrust/Rineo Solutions booth during your visit. ■ Products Scheduled for Display SBOM and Vulnerability Management "Timesys Vigiles" Embedded Linux Ultra-Fast Boot Solution "LINEOWarp!!" "Embedded Linux Maintenance Service" Long-Term Usable IoT and Embedded Linux OS "EMLinux" SBOM-Compatible Vulnerability Management Tool "Miracle Vul Hammer" ■ Announcement of Presentations At this exhibition, there will be two presentations by members of Cybertrust/Rineo Solutions. We plan to introduce useful information for the development and operation of embedded Linux products, so please join us.

The JIMTOF2026 has started today, October 26! When you visit, please be sure to stop by our booth. (Booth number: East 1 E1014) ▼JIMTOF2026 Special Page https://www.somax.co.jp/notice02/ We sincerely look forward to your visit!

● Dates: November 12 (Thursday) to November 14 (Saturday), 2026 10:00 AM to 4:00 PM (Final day, the 14th, until 3:00 PM) ● Venue: Okaya City Comprehensive Gymnasium ● Exhibition Name: Suwa Area Industrial Messe 2026 ● Our Booth: East 156 ● Exhibition Content: We will showcase our main products in six categories, including "Linear Encoders," "Linear Displacement Sensors," "Sensors for Unmanned Transport Vehicles," "Magnetic Proximity Switches," "High-Precision Magnetic Sensors/Switches," and "Inclinometers/Inclinometer Detectors," as well as other magnetic application devices. ● Pre-registration for attendance: Free, but please register in advance. ● For other inquiries, please contact us using the options below: · Phone inquiries · Inquiry form Sales and technical staff will be on-site, so we welcome consultations on matters beyond the exhibited products. Feel free to stop by. We look forward to your visit.

We will be exhibiting at the "Powder Technology Exhibition 2026" held at Tokyo Big Sight. During the event, we will showcase various products. We invite all related parties to come and visit us. 【Suppliers】 ・Hielscher

● Dates: November 5 (Thursday) to November 6 (Friday), 2026 10:00 AM to 5:30 PM (last day, November 6, until 5:00 PM) ● Venue: Access Sapporo ● Exhibition Name: Business EXPO "40th Hokkaido Technology and Business Exchange Meeting" ● Our Booth: Inside the Shinei Plant Co., Ltd. booth ● Exhibition Content: We will showcase our main products in six categories, including "Linear Encoders," "Linear Displacement Sensors," "Sensors for Unmanned Transport Vehicles," "Magnetic Proximity Switches," "High-Precision Magnetic Sensors/Switches," and "Inclinometers/Inclinometer Detectors," as well as other magnetic application devices. ● Pre-registration for attendance: Free, but please register in advance from here. ● For other inquiries, please contact us using the options below: · Phone inquiries · Inquiry form Our sales and technical staff will be on-site, so we also welcome consultations beyond the exhibited products. Feel free to stop by. We look forward to your visit.