Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.

Ultrasonic assisted spindle equipped with a dual-end support mechanism that enables high-speed, high-precision cutting, improving productivity and quality - Ultrasonic dicing device!!

The mass production ultrasonic dicing device "CSX501" is a dicing machine that cuts difficult materials such as SiC, GaN, and fine ceramics with high speed and precision. The ultrasonic-assisted cutting with "CSX501" adds ultrasonic assistance to the "force generated by the rotation of the blade," allowing the blade to "vibrate in the outward direction" while cutting. This technology enables the achievement of improved throughput, reduced running costs, and increased yield while maintaining high-quality cutting. Furthermore, the addition of device monitoring functions allows for remote support, contributing to a reduction in recovery time from unexpected troubles. Additionally, by equipping various optional functions, it also contributes to the control of blade edge shapes and the reduction of cutting burrs. *We also conduct evaluations by cutting sample work upon request, so please feel free to contact us. *For more details, please refer to the PDF materials.

• Ultrasonic Oscillator
• Other processing machines
• Other cutting tools

A single-layer resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from a high-pressure jet.

A research and development device that combines a standard straight nozzle with a high-pressure jet nozzle, designed for resist stripping and metal lift-off processes for small-scale production. It features a compact design that can be installed in tight spaces (approximately 40% more compact than conventional models). The one-chamber system performs resist stripping, lift-off, rinsing, and drying all in a single chamber, contributing not only to high throughput but also to reduced footprint. Additionally, it is possible to separate and recover the used chemicals for reuse, which helps reduce running costs. *It can also be repurposed as an organic cleaning device, not just for resist stripping and lift-off.*

• Resist Device
• High pressure cleaner

A single-layer resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from a high-pressure jet.

A mass production-oriented resist stripping and metal lift-off processing device that combines a standard straight nozzle with a high-pressure jet nozzle. The one-chamber type, which performs resist stripping, lift-off, rinsing, and drying all in one chamber, contributes not only to high throughput but also to a reduced footprint. Additionally, it is possible to separate and recover the used chemicals for reuse, which helps reduce running costs. *It can also be repurposed as an organic cleaning device, not just for resist stripping and lift-off. 【Features】 ■ Unique jet lift-off mechanism with high stripping performance ■ Improved flexibility and reduced running costs to accommodate small quantities of various products and fluctuations in production volume ■ Improved quality and yield through single wafer processing (achieving precise processing without cross-contamination and enhancing uniformity and control across the surface) *For more details, please contact us or download the PDF for further information.

• High pressure cleaner

Dicing ring (frame) cleaning device available in two types: jet cleaning type (non-contact) and scrub cleaning type (contact).

Have you been struggling with running costs and labor issues due to manual cleaning or relying on contractors for cleaning? This device automatically cleans dicing frames through automated transport. - Jet cleaning type (focused on reducing running costs) - Scrub cleaning type (focused on cleaning power) We offer these two types in our lineup. By selecting a specification that matches the dirt on the frames you use, we can propose quality and cost benefits. Additionally, dicing frames with tape (sheets) can also be processed, allowing for tape removal and cleaning within the device. (*Optional)

• Other semiconductor manufacturing equipment

A sheet-type resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from high-pressure jets [testable].

A metal lift-off processing device for research and development that combines a standard straight nozzle with a high-pressure jet nozzle. This model is a compact version of the TWPm, further miniaturized and cost-effective by omitting the transport unit. The one-chamber complete type performs resist stripping, lift-off, rinsing, and drying all in one chamber, contributing not only to high throughput but also to a reduced footprint. Additionally, it is possible to separate and recover the used chemicals for reuse, which helps reduce running costs. *It can also be repurposed as an organic cleaning device, not just for resist stripping and lift-off. 【Features】 ■ 60% reduction in footprint (compared to our TWPm) ■ One-chamber completion ■ Prevention of chemical backflow (patented) ■ Prevention of liquid and mist scattering and reattachment *For more details, please contact us or download the PDF for further information.

• Resist Device
• Other semiconductor manufacturing equipment
• High pressure cleaner

Achieving efficiency in the preparation of cross-sectional observation samples! Ultrasonic cutting device for ion milling pretreatment can also replace polishing machines. *Demo tests available.

This is a device specialized for the production of cross-sectional observation samples that can simultaneously "cut" and "polish" using the cutting surface polishing effect of "ultrasonic cutting technology" (PolishCutTM). It is particularly used in situations where many cross-sectional observation samples are being produced. We also have a demo environment where you can actually cut your samples and evaluate them, so please feel free to contact us. 【Features】 ■ Clean cutting surface ■ Accurate cutting at the targeted position ■ Cutting of invisible objects by overlaying X-ray images with monitor images ■ Skill-free production of cross-sectional observation samples ■ Can be used as a pre-treatment device for ion milling to reduce milling time *For more details, please contact us or download the PDF for more information.

• Analytical Equipment and Devices

No resin embedding! Achieving efficiency in cross-section sample preparation without the need for skills. Contributing to the efficiency of SEM observation. 'Ultrasonic Cutting Device CSX-100Lab'

The cross-section sample preparation device "CSX-100Lab" is a specialized device that utilizes the cutting surface polishing effect (PolishCut) of our uniquely developed "ultrasonic cutting technology" to simultaneously perform "cutting" and "polishing." It is ideal for improving the efficiency of cross-sectional observation, failure analysis, defect analysis, structural analysis, and verification of manufacturing conditions. Features include: 1) clean cross-sections, 2) precise cutting at targeted positions, 3) cutting of invisible objects by overlaying drawings or X-ray images with monitor images (skeleton cut option), 4) skill-free cross-section sample preparation, 5) reduction of milling time when used as a pre-treatment device for ion milling during SEM observation, and 6) cross-sectional observation of small chip components like 0402. It is particularly used in situations where many cross-section samples are prepared. We also have a demo environment where you can evaluate the actual cutting of your samples, so please feel free to contact us!

• Analytical Equipment and Devices

We will be exhibiting at the 3rd Decarbonization Exhibition for Material Factories during the High-Performance Materials Week 2026 Tokyo Exhibition, which will be held at Makuhari Messe from September 30 (Wednesday) to October 2 (Friday). At our booth, we will introduce our efforts to solve challenges in advanced materials such as semiconductor materials and battery materials with engineering solutions, creating new value. When you visit, please stop by our booth in Hall 6, 35-34.

【What if a massive earthquake halts production at factories, resulting in losses of hundreds of millions of yen!?】 Revealing successful case studies of "DX × Earthquake Countermeasures" to protect the future of manufacturing! A massive earthquake is not something that "will happen someday," but rather "can happen at any time." If a major earthquake were to occur now and halt production lines in factories... businesses would face critical risks to their survival (losses ranging from millions to billions of yen) due to not only damage to buildings and equipment but also delays in delivery and withdrawal of business partners. This document presents real examples of "actual loss amounts and reconstruction costs" that occur in factories during an earthquake, based on data from the Great East Japan Earthquake and the Kumamoto Earthquake. ▼ What you will learn in this seminar Actual damages during an earthquake: Real data on sales losses and reconstruction costs associated with factory shutdowns On-site action guide: A chronological action plan and checklist to follow without hesitation from initial response to recovery Safety measures utilizing DX and AI: The mechanism and estimated costs of systems that detect shaking and automatically stop equipment and enable remote recovery Keys to successful business continuity: How to effectively use earthquake insurance to expedite recovery and case studies from advanced companies ▼ Event Overview Date: September 11, 2026 (Friday) 13:30 - 14:30 Format: Online (Teams Webinar) Participation fee: Free

[Reforming Manufacturing Sites] "Invisible Inventory" and "Manual Errors" Solved by AI! The Cutting Edge of DX in Inventory Management and Logistics Main Text: "Searching for where everything is takes too much time..." "Ordering based on experience and intuition leads to overstock and stockouts..." Do you face these issues in your manufacturing site? This document introduces the latest examples of automating inbound and outbound processing and achieving real-time visibility of inventory data by utilizing camera imaging, barcodes, QR codes, and AI! ▼ Three Key Points Explained in the Document Instant reading with batch imaging! Automate inbound processing and data updates to significantly reduce work time. AI automatically determines the optimal storage location! Eliminate waste in searching and moving, maximizing storage efficiency. [Case Study] A unified management model from procurement to the reuse of processed scrap in a plastic product processing factory. This is the definitive guide to DX that covers data integration with WMS and production management systems, ready for immediate application in the field. Please download and read it! ▼ Event Overview Date: October 9, 2026 (Friday) 13:30 - 14:30 Format: Online (Teams Webinar) Participation Fee: Free

Trelleborg Sealing Solutions will host a two-and-a-half-hour online event introducing the basics of rotary seals, the latest technological trends, and selection methods based on applications. This event, taking place on September 22, 2026 (Tuesday), will feature two sessions with the same content to allow participation from around the world: For Asia-Pacific and Europe: September 22, 2026 (Tuesday) at 16:00 (Japan time) For Europe and North and South America: September 22, 2026 (Tuesday) at 23:00 (Japan time)

Trelleborg Sealing Solutions will hold a two-and-a-half-hour online event introducing the basics of rotary seals, the latest technological trends, and selection methods according to applications. This event, taking place on September 22, 2026 (Tuesday), will feature two sessions with the same content to accommodate participants from around the world: For Asia-Pacific and Europe: September 22, 2026 (Tuesday) at 16:00 (Japan time) For Europe and North and South America: September 22, 2026 (Tuesday) at 23:00 (Japan time)