[Book] Interface Control, Molding Processing Technology, and Component Applications of CFRP/CFRTP (No. 2074BOD)

【Technical Specialty Book】★A comprehensive collection of case studies on improving wettability and adhesion between resins and fibers, as well as molding techniques compatible with complex shapes!

Book Title: Interface Control, Molding and Processing Technology, and Material Applications of CFRP/CFRTP --- ■ Key Points of This Book Characteristics and Selection of Base Resin, Production of Prepreg Materials - Properties of pitch-based and PAN-based carbon fibers - Epoxy resin with a high concentration of milled carbon fibers - CFRP using TriA-X resin Interface Control Between Base Resin and Carbon Fiber - Compatibilizers to enhance adhesion at the resin-fiber interface - Bonding using water-soluble polymers - Improvement of interface properties through colloidal adsorption Physical Properties, Strength, and Lifespan Evaluation - Interlaminar delamination characteristics of CFRP laminates - Laser ultrasonic and eddy current testing - Observation of crack initiation, propagation, and failure High-Cycle Molding and Adhesive Joining Technologies - Hybrid molding of CFRTP - Suppression of warpage in hybrid molded products - Strength enhancement through the combination of 3D printing and lasers - Steering laminate technology for CFRP Material Applications and Development Cases of CFRP and CFRTP - Application to automotive back doors - Sandwich structures of foam and CFRP - Application of CFRP in the aerospace field and multicopter airframes - Application to sound-absorbing materials and reinforcement materials for buildings

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Features: ● Equipped with ARM MediaTek Genio 700 / 510 ● Onboard LPDDR4 8GB ● HDMI 2.0 x 1, DP 1.4 x 1 ● eDP 2 lanes x 1, MIPI-DSI 4 lanes x 1 ● GbE x 1 ● USB 3.0 + 2.0 x 1, USB 2.0 x 5 ● UART x 4, GPIO x 12, MIPI CSI x 2, TPM 2.0 ● Fan-equipped heatsink, heatsink available separately ● Carrier board available separately

Features: ● Equipped with Intel Core Ultra 5 125H/7 155H ● LPDDR5 16GB onboard memory ● NVMe 128GB onboard storage ● eDP x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen2 x 2 ● PCIe 4.0[x1] x 4 ● 2.5GbE x 1 ● COMe Type10 standard, size 84mm x 55mm ● Optional items ECB-920A-0001: Development carrier board NANOCOM-MTU-FAN: CPU fan NANOCOM-MTU-HSP: Heat spreader (Note: Heat dissipation is required in the enclosure)

Features: ● Equipped with Intel Core Ultra 9 185H / 7 155H / 5 125H processors ● DDR5 5600MHz Dual Channel SODIMM x2 (up to 96GB) (sold separately) ● VGA switch DDI x1, LVDS colay eDP x1, DDI x2 ● USB 2.0 x8, USB 3.2 Gen 2 x4 ● PCIe [x1] x4, PCIe [x4] x1, PEG [x8] + [x4] + [x4] ● 2.5GbE x1 ● DC 9~16V input ● COM Express Type 6, 3.75 inches x 3.75 inches (95mm x 95mm)

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