We will hold the Implementation Assembly Process Technology Exhibition 2021.

By adopting a cartridge heater in a lightweight and compact head, it is possible to insert the sleeve into narrow spaces of high-density mounted components.

- Metal sleeve (soldering iron) By using materials with excellent thermal conductivity, it minimizes temperature drop during soldering and ensures good response during temperature recovery. - Quantification of solder amount Since solder does not adhere, all supplied solder flows to the workpiece. Soldering can always be done in a quantified manner. - Integration of mechanical and heater components The coaxial design prevents interference with the workpiece. - Prevention of flux and solder ball scattering By melting solder within the sleeve, it prevents scattering of flux and solder balls. - Standard nitrogen (N2) generation device Prevents oxidation of the solder surface by N2.

• Soldering Equipment

By using a dedicated heater to burn the ceramic sleeve, we incinerate the adhered dross and perform cleaning.

Dimensions: 170mm(W) x 247mm(D) x 167mm(H) Heater: 135W Power Supply: AC85~264V

• Soldering Equipment

Dedicated machines and inline single-axis CMS robots.

- Metal Sleeve (Soldering Iron) By using a material with excellent thermal conductivity, it minimizes temperature drop during soldering and provides good response during temperature recovery. - Quantification of Solder Amount Since solder does not adhere, all supplied solder flows to the workpiece. Soldering can always be done in a quantified manner. - Integration of Mechanism and Heater The coaxial design prevents interference with the workpiece. - Prevention of Flux and Solder Ball Splashing Solder is melted within the sleeve, preventing the splashing of flux and solder balls. - Standard Equipped Nitrogen (N2) Generation Device Prevents oxidation of the solder surface due to N2.

• Soldering Equipment

The rotating drill bit removes the debris attached to the inside of the sleeve.

Dimensions: 77mm(W) X 144mm(D) X 54mm(H) Drill speed: Approximately 8000rpm Power supply: DC24V (30mA)

• Soldering Equipment

Berry Inc. (Headquarters: Taito-ku, Tokyo; CEO: Hiroshi Nakano) will hold a free online seminar titled "Evolved with AI! - A Comprehensive Explanation of eQMS 'QMSmart' from Basics to Latest Updates," which will explain the overall picture and latest updates of the cloud-based eQMS "QMSmart" with a live screen demo, on August 21, 2026 (Friday) from 14:00 to 15:00. This seminar is aimed at those considering the introduction of eQMS, as well as quality assurance, design development, and manufacturing personnel at medical device manufacturers who feel limited by paper and Excel-based QMS operations, as well as management. Participants will be able to see the evolved QMSmart in its entirety in one hour, following this summer's major update.

Takaya Corporation will be exhibiting at the "36th Microelectronics Symposium (MES2026)" held at Osaka University Nakanoshima Center from September 16 (Wednesday) to 18 (Friday), 2026. MES2026 is one of Japan's leading technical symposiums in the field of electronics packaging. The symposium will focus on implementation technologies that support the high functionality, miniaturization, and high reliability of electronic devices, featuring the latest research results and technological trends from universities, research institutions, and companies. Additionally, technical exchanges and information sharing will take place through corporate exhibitions. At our booth, we will introduce the features of the Flying Probe Tester "APT Series" and solutions that contribute to quality improvement, as well as offer consultations regarding inspection processes. We invite you to stop by the Takaya booth during your visit.

In this session, we will thoroughly analyze case studies of three major chemical accidents that occurred in the past! When we unravel the root causes of these accidents, we find a common pattern of "lack of safety management systems" rather than just equipment failure or chemical reactions. We will introduce specific solutions to bridge the three gaps of "Visibility," "Control," and "Preparedness," and discuss Chemwatch's efforts to prevent risks before they occur. For any questions, please contact us at japan@chemwatch.net. We sincerely look forward to your participation.

☆☆☆ Urgent Visit to Japan & Emergency Event Announcement ☆☆☆ Dr. Yuval Levy, CEO of ISCFDC and developer of EPPIC, who has been involved in CFD research at NASA Ames Research Center for about five years, is coming to Japan! He will demonstrate and explain advanced CFD technologies, application cases, and the latest features of EPPIC himself. □ Date and Time □ July 31, 2026 (Friday) 13:00-18:00 (Registration starts at 12:30) <Part 1: Post-Processor Session> 13:00-16:40 <Part 2: Pre-Processor Session> 16:50-17:50 <Networking Event> 18:10-19:40 □ For more details □ Visit the Hulinks page https://www.hulinks.co.jp/seminar/eppic/

While the business utilization of generative AI (such as ChatGPT) is rapidly advancing, the "security risk of confidential information such as on-site data, proprietary manuals, and customer information being sent to the cloud" has become a significant issue. Until now, the high cost of GPU servers and the necessity of relying on the cloud for model intelligence have been challenges. However, this premise is now undergoing a major change. With the emergence of Google's latest open model, 'Gemma4', we have finally entered an era where it is possible to operate with "intelligence equal to or greater than that of the cloud" at "one-third the hardware cost of traditional setups," and within "a secure, company-exclusive server completely isolated from the internet." We will introduce the latest trends in AI implementation along with our company's latest DX solutions.