We will hold the Implementation Assembly Process Technology Exhibition 2021.

By adopting a cartridge heater in a lightweight and compact head, it is possible to insert the sleeve into narrow spaces of high-density mounted components.

- Metal sleeve (soldering iron) By using materials with excellent thermal conductivity, it minimizes temperature drop during soldering and ensures good response during temperature recovery. - Quantification of solder amount Since solder does not adhere, all supplied solder flows to the workpiece. Soldering can always be done in a quantified manner. - Integration of mechanical and heater components The coaxial design prevents interference with the workpiece. - Prevention of flux and solder ball scattering By melting solder within the sleeve, it prevents scattering of flux and solder balls. - Standard nitrogen (N2) generation device Prevents oxidation of the solder surface by N2.

• Soldering Equipment

By using a dedicated heater to burn the ceramic sleeve, we incinerate the adhered dross and perform cleaning.

Dimensions: 170mm(W) x 247mm(D) x 167mm(H) Heater: 135W Power Supply: AC85~264V

• Soldering Equipment

Dedicated machines and inline single-axis CMS robots.

- Metal Sleeve (Soldering Iron) By using a material with excellent thermal conductivity, it minimizes temperature drop during soldering and provides good response during temperature recovery. - Quantification of Solder Amount Since solder does not adhere, all supplied solder flows to the workpiece. Soldering can always be done in a quantified manner. - Integration of Mechanism and Heater The coaxial design prevents interference with the workpiece. - Prevention of Flux and Solder Ball Splashing Solder is melted within the sleeve, preventing the splashing of flux and solder balls. - Standard Equipped Nitrogen (N2) Generation Device Prevents oxidation of the solder surface due to N2.

• Soldering Equipment

The rotating drill bit removes the debris attached to the inside of the sleeve.

Dimensions: 77mm(W) X 144mm(D) X 54mm(H) Drill speed: Approximately 8000rpm Power supply: DC24V (30mA)

• Soldering Equipment

Rineo Solutions will be exhibiting at EdgeTech+ 2025. At the venue, we will introduce the total solutions from the Cybertrust Group that can be widely used from the design to the operational phase of embedded Linux development. We invite you to visit the Cybertrust/Rineo Solutions booth during your visit. ■ Products Scheduled for Display SBOM and Vulnerability Management "Timesys Vigiles" Embedded Linux Ultra-Fast Boot Solution "LINEOWarp!!" "Embedded Linux Maintenance Service" Long-Term Usable IoT and Embedded Linux OS "EMLinux" SBOM-Compatible Vulnerability Management Tool "Miracle Vul Hammer" ■ Announcement of Presentations At this exhibition, there will be two presentations by members of Cybertrust/Rineo Solutions. We plan to introduce useful information for the development and operation of embedded Linux products, so please join us.

The JIMTOF2026 has started today, October 26! When you visit, please be sure to stop by our booth. (Booth number: East 1 E1014) ▼JIMTOF2026 Special Page https://www.somax.co.jp/notice02/ We sincerely look forward to your visit!

● Dates: November 12 (Thursday) to November 14 (Saturday), 2026 10:00 AM to 4:00 PM (Final day, the 14th, until 3:00 PM) ● Venue: Okaya City Comprehensive Gymnasium ● Exhibition Name: Suwa Area Industrial Messe 2026 ● Our Booth: East 156 ● Exhibition Content: We will showcase our main products in six categories, including "Linear Encoders," "Linear Displacement Sensors," "Sensors for Unmanned Transport Vehicles," "Magnetic Proximity Switches," "High-Precision Magnetic Sensors/Switches," and "Inclinometers/Inclinometer Detectors," as well as other magnetic application devices. ● Pre-registration for attendance: Free, but please register in advance. ● For other inquiries, please contact us using the options below: · Phone inquiries · Inquiry form Sales and technical staff will be on-site, so we welcome consultations on matters beyond the exhibited products. Feel free to stop by. We look forward to your visit.

We will be exhibiting at the "Powder Technology Exhibition 2026" held at Tokyo Big Sight. During the event, we will showcase various products. We invite all related parties to come and visit us. 【Suppliers】 ・Hielscher

● Dates: November 5 (Thursday) to November 6 (Friday), 2026 10:00 AM to 5:30 PM (last day, November 6, until 5:00 PM) ● Venue: Access Sapporo ● Exhibition Name: Business EXPO "40th Hokkaido Technology and Business Exchange Meeting" ● Our Booth: Inside the Shinei Plant Co., Ltd. booth ● Exhibition Content: We will showcase our main products in six categories, including "Linear Encoders," "Linear Displacement Sensors," "Sensors for Unmanned Transport Vehicles," "Magnetic Proximity Switches," "High-Precision Magnetic Sensors/Switches," and "Inclinometers/Inclinometer Detectors," as well as other magnetic application devices. ● Pre-registration for attendance: Free, but please register in advance from here. ● For other inquiries, please contact us using the options below: · Phone inquiries · Inquiry form Our sales and technical staff will be on-site, so we also welcome consultations beyond the exhibited products. Feel free to stop by. We look forward to your visit.