Notice of the FXC Online Seminar on July 28

Interop 'Best of Show Award' winning product 10G compatible media converter 'LEX3881-2F'

The "LEX3881-2F" is a media converter that supports Ethernet OAM and is equipped with Link OAM/CFM OAM functionality. It achieves the world's smallest size (Note 1) for an Ethernet OAM-compatible media converter. The "LEX3881-2F" simultaneously implements 1G/10G-SFP, can automatically determine speed, allows for conversion from two fibers to one, extends distance through the implementation of long-distance 10G-SFP x2, and supports various functions such as rate changes from 1G to 10G. Additionally, it operates within a temperature range of -10 to 55°C, covering a wide range of temperature conditions. Furthermore, it is equipped with a Dying Gasp function that remotely notifies of power outages, allowing for quick responses in case of failures. (*) Based on our research on standalone (single unit) gigabit media converters compatible with Ethernet OAM. ● For more details, please contact us or download the catalog.

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World's smallest class! Remote monitoring with Ethernet OAM compatible media converter series! 【*Free demo units available for loan】

■Achieves the world's smallest size for Ethernet OAM-compatible gigabit media converters (※1). ■Made in Japan, domestic quality. ■Adopts an intuitive and easy-to-understand Japanese GUI. (CLI is also available) ■Equipped with comprehensive maintenance features. ・In-band monitoring function. Remote monitoring/control via link OAM (IEEE802.3ah) is possible. ・Equipped with Ethernet OAM functionality. (IEEE802.3ah, IEEE802.1ag, ITU-T Y.1731) ・Equipped with link pass-through functionality. ■Stable transmission quality. (Shaping control/bandwidth control) ■Planned support for power failure notification function (Dying Gasp). (※1) Based on our research on standalone (single unit) gigabit media converters compatible with Ethernet OAM. ▼FXC offers a free two-week evaluation unit loan service for testing purposes. Please feel free to contact us via the link below. *If we are unable to meet your desired delivery date, our sales department will contact you to make adjustments.

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LEX3000 Series Option SNMP Management Card

The "LEX3930-00" is an SNMP management card compatible with the "LEX3020," allowing for monitoring the status of the power supply unit and fan unit installed in the chassis, as well as the link status of each media converter in the LEX3000 series and various settings via the network. It also supports monitoring settings for adjacent line cards using Link OAM (IEEE802.3ah) and wide area Ethernet status monitoring using Ethernet OAM (IEEE802.1ag / ITU-T Y.1731). ● For more details, please contact us or download the catalog.

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100BASE-FX/1000BASE-X media converter

■Achieved the world's smallest size (※1) as a Gigabit media converter supporting Ethernet OAM. ■Uses SFP for optical modules. Compatible with 100BASE-FX/1000BASE-SX/SX2/LX/ZX. Single-core types (BiDi/BX) and CWDM-compatible SFPs are also available! ■Switch operation. Supports jumbo frames. ■Supports power loss notification function (Dying Gasp). ■Signal Detect can be confirmed via LED. ■Fanless design, made in Japan, domestic quality. (※1) Based on our research for standalone (single unit) Gigabit media converters supporting Ethernet OAM. ●For more details, please contact us or download the catalog.

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LEX3000 Series Options AC Power Module / DC Power Module

The "LEX3910-15" and "LEX3910-45" are power modules for the "LEX3020," available in two types: AC power and DC power. They can be mounted on the rear chassis, allowing for a redundant configuration with up to two units. The power modules are integrated with two cooling fans and feature automatic speed control. The operational status of the power supply and fans can be checked via the front LED of the "LEX3020." For more details, please contact us or download the catalog.

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World's smallest Ethernet OAM-compatible media converter.

■Achieved the world's smallest size (as of April 18, 2018, according to our research) for an Ethernet OAM compatible gigabit media converter. ■Uses SFP optical modules. Compatible with 100BASE-FX/1000BASE-SX/SX2/LX/ZX. Single-core types (BiDi/BX) and CWDM SFPs are also available! ■Switch operation. Supports jumbo frames. ■Supports power loss notification function (Dying Gasp). ■Signal Detect can be confirmed via LED. ■Fanless design, made in Japan, domestic quality. ●For more details, please contact us or download the catalog.

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A modular chassis capable of accommodating up to 20 line cards for Ethernet OAM-compatible media converters.

The "LEX3020" is a 2U high, 19-inch rack-mounted chassis that can accommodate up to 20 media converters from the LEX3000 series. The chassis features a special insertion and removal structure in its slots, allowing the line card to tilt to the right when the screws are loosened during removal, causing the card to protrude forward. This design enables smooth insertion and removal of cards while preventing the loss of screws. Additionally, a tray for managing excess fiber length is incorporated at the bottom of the slots. For more details, please contact us or download the catalog.

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A must-see for those considering the introduction of 3D printers! If you want to hear about practical examples, please take a look. ------ In recent years, 3D printers have been increasingly utilized in various fields such as prototype development, jig manufacturing, and small-lot production. However, many may have questions such as, "How does the printing process work?", "How can we utilize it in our company?", and "Which model should we choose?" This seminar will clearly introduce the basics of 3D printers as well as actual case studies. It is recommended not only for those who are considering the introduction of 3D printers but also for those who are already using them and want to expand their applications. ----- ◆ Recommended for: - Those considering the introduction of a 3D printer - Those who want to know the basic mechanisms of 3D printers - Those looking to improve efficiency in prototyping or jig manufacturing - Those who want to reference case studies from other companies - Those searching for a suitable 3D printer for their company Even if you cannot watch it in real-time, you can view the recorded session for one week after the event. We sincerely look forward to your participation! *This seminar will be held in an online format using Zoom.

The particle visualization technology developed under our brand "ViEST" has a very high level of detection sensitivity, capable of visualizing the suspended or adhered states of micro and nano-sized particles in real time. We are engaged in the sale of visualization systems and contract services for evaluation (investigating particles and airflow in production processes, inside and outside manufacturing equipment, evaluating the performance of cleaning products, proposing yield improvement measures, etc.) both domestically and internationally. In manufacturing environments, invisible fine foreign substances, dust generation, particle adhesion due to static electricity, and airflow disturbances can cause quality defects and reduced yield. Our company clarifies these contamination factors through visualization technology and provides consistent support from identifying the source of the problem to considering and confirming improvement measures. Do you have any of the following concerns? - Unable to identify the cause of foreign matter contamination - Want to check airflow and cleanliness in clean rooms - Want to understand dust generation from manufacturing equipment and transport systems - Want to reduce particle adhesion to films and substrates - Want to improve contamination that leads to reduced yield

[Lecturers] KPMG Consulting Co., Ltd. Executive Officer, Partner Kazushige Ikeda KPMG Consulting Co., Ltd. Technology Consulting Senior Consultant Kakeru Ota [Key Lecture Content] In recent years, AI has evolved beyond information processing in digital spaces, such as text generation and image recognition, to become Physical AI that perceives, judges, and acts in the real world by connecting with sensors, robots, vehicles, industrial equipment, and more. Physical AI is increasingly important across a wide range of fields, including manufacturing, as it addresses industrial challenges such as labor shortages, skill transfer, replacement of hazardous work, and productivity improvement. Additionally, foundational models, semiconductors, sensors, actuators, and robotics-related technologies that support Physical AI are becoming increasingly significant from the perspective of economic security, particularly in terms of responding to supply chain risks and securing and managing critical technologies. This lecture will organize the basic concepts and key technologies of Physical AI, discuss its potential applications in manufacturing and industrial sectors, outline practical considerations for implementation and operation, and explain the actions that companies should take moving forward.

[Instructor] Nobuyuki Oonaka, CEO of Bridge Inc., Project Designer [Key Lecture Content] "Why do new businesses often come to a halt?" The cause may not be a lack of ideas or talent. Through supporting over 300 new businesses and business developments, I have learned that what separates success from failure is "the structure of the organization"—specifically, how decisions are made, how dialogue occurs, and how assumptions are shared. In this seminar, based on the book "How to Create Self-Driving New Businesses" (Shoei-sha), we will analyze the "communication problems" that cause new businesses to stop as a structure. The goal is to develop a common language within the organization to identify "where we are stuck and what actions we should take." I will share how to use the "self-driving map" in practical terms.

In this seminar, we will focus on the challenges of sensitivity reduction and separation performance in GC/MS analysis, and introduce the latest technologies and practical know-how that can help solve these issues. This time, we will also have a presentation from LECO Japan, who will discuss the benefits and applications of high-resolution and high-separation analysis with real examples. Additionally, Restek will introduce column technologies effective for improving sensitivity in trace analysis. Restek: We will explain the inert performance of the RMX GC column, which is effective for improving sensitivity in trace analysis, and the column technology that suppresses adsorption loss in low concentration areas, along with actual measurement data. LECO: We will present the latest application examples of comprehensive detection of trace components using high-sensitivity GC-TOFMS and RMX columns, including environmental, aroma, and material analysis. This content is recommended for anyone involved in multi-component analysis using GC/MS, whether for target or non-target analysis, as well as those who are just starting out. We will provide clear explanations suitable for beginners in GC/MS, so please join us.