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  4. [Book] Development of Heat Dissipation and Cooling Technologies and Materials for Electronic Devices (No. 2115)
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  • Jul 30, 2021
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Jul 30, 2021

[Book] Development of Heat Dissipation and Cooling Technologies and Materials for Electronic Devices (No. 2115)

TECHNICAL INFOMATION INSTITUTE CO.,LTD TECHNICAL INFOMATION INSTITUTE CO.,LTD
★ A Comprehensive Explanation of Heat Problem Solutions Due to High-Speed Performance of Semiconductors and High-Density Device Implementation! --------------------- ■ Table of Contents Chapter 1: Design of Heat Sinks and Miniaturization with High Thermal Conductivity Chapter 2: Design of Heat Pipes and Miniaturization, Improvement of Thermal Transport Efficiency Chapter 3: Development and Application of Various TIM Materials Chapter 4: Development of High Heat Dissipation and High Thermal Conductivity Substrates Chapter 5: Development of High-Efficiency Cooling Technologies Chapter 6: Thermal Simulation Technologies for Electronic Device Design Chapter 7: Thermal Conductivity, Temperature Measurement, and Know-How Chapter 8: Heat Dissipation Technologies for Printed Circuit Boards Chapter 9: Heat Dissipation and Cooling Technologies for 5G and Information Communication Devices Chapter 10: Thermal Management Technologies in Sensor Design Chapter 11: Heat Dissipation and Cooling Technologies for Power Electronics Chapter 12: Heat Dissipation and Cooling Technologies for EV Batteries Chapter 13: Heat Dissipation Design for Automotive Electronics --------------------- ● Publication Date: July 30, 2021 ● Format: A4, 676 pages ● Authors: 62 ● ISBN: 978-4-86104-852-4 --------------------- * For details, please download the catalog. * "Free preview" is available.
"Development of Heat Dissipation and Cooling Technology and Materials for Electronic Devices" Book Photo
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[Book] Development of Heat Dissipation and Cooling Technologies and Materials for Electronic Devices (No. 2115)

[Free trial available - Specialized book] ★ Thorough explanation of heat problem countermeasures associated with the high-speed operation of high-performance semiconductors and the high-density implementation of devices.

- Response to 5G, high-speed, and miniaturization - ■ Key Points of This Document Design and Application of Heat Sinks - Resolution of hotspot issues in next-generation power devices - Increase in maximum heat transport per unit - Composite use of graphite and metal materials and application of heat spreaders Development and Application Examples of TIM (Thermal Interface Material) - Orientation technology for transporting large amounts of heat in the thickness direction - Emergence of high thermal conductivity in TIM and reduction of contact thermal resistance - Achievement of high thermal conductivity with less filler content Development of Heat Dissipation Substrates - Improvement of high thermal conductivity and heat shock characteristics of metal-based substrates - Enhancement of thermal conductivity in silicon nitride substrates Prospects for Next-Generation Cooling Technologies - Outlook and challenges of boiling cooling technology - Boiling heat transfer under electric field application Examples of Heat Dissipation Design for Devices - Approach to thermal design and thermal verification, simulation technology - Response to thermal design based on substrate heat dissipation, component technology - Design and evaluation of submerged processor chips aimed at liquid immersion cooling - Key points of thermal design in mobile devices

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[Book] Development of Heat Dissipation and Cooling Technology for Electronic Devices and Components (No. 2115)

[Book] Development of Heat Dissipation and Cooling Technology for Electronic Devices and Components (No. 2115)

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"ROBO TUBE" is a microtube with 1D/2D code that achieves excellent sealing and fitting properties. By integrating polypropylene and thermoplastic elastomer through one-shot molding, it realizes superior sealing and fitting. Compared to conventional microtubes, the opening and closing of the cap is very smooth, reducing the stress of cap operation. 【Features】 ■ The opening and closing of the cap is very smooth compared to conventional microtubes ■ Reduces the stress of cap operation ■ Innovative two-color molding of polypropylene and thermoplastic elastomer ■ Achieves excellent sealing and fitting properties ■ High compatibility with lab automation *For more details, please download the PDF or feel free to contact us.

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[New Product] Downflow Dust Collector and Workbench Type Dust Collector

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Expanding Possibilities with New Solutions - The Cutting Edge of Thick Plate Processing

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We will hold a thick plate solution event. We will propose a highly efficient automated operation for the entire factory, including cutting with the newly unveiled fiber laser machine, automatic transportation, and bending processing. This event will allow you to experience the latest machines and processing, so we encourage you to attend. 【Event Schedule】 November 21 (Friday) and 22 (Saturday), 2025, from 13:00 to 14:00 *Please note that the capacity for November 21 (Friday) is nearing full, so we recommend attending on November 22 (Saturday). If we reach capacity, we may have to decline participation. Please apply early. 【Event Location】 Amada Global Innovation Center (200 Ishida, Isehara City, Kanagawa Prefecture) 【Event Content】 Part 1: Product Introduction Seminar Part 2: Live Demonstration

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Clear vision: The essential KNF vacuum pump for cataract surgery.

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Nov 07, 2025

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