We will be exhibiting at INCHEM TOKYO 2021 with our 3D printer!

PEEK compatible, large-scale 3D printer with chamber for various materials, with a total shipment of over 2000 units in the series. Suitable for jigs and small lot production.

HT's high-end model 410 (2 heads, larger size) - 2 heads for smooth removal of support materials Various support materials are also available Super engineering plastic support material "SP5000" (manufactured by INTAMSYS) For ABS and PC, "Hips" - Large-scale printing with stable formation using a chamber heater Print area 305*305*406mm, compatible with PEEK - Multi-material compatible Super engineering plastics PEEK, PEEK-CF, PEEK-GF, PEKK PEI (ULTEM9085, ULTEM1010), PPSU, PPS General-purpose engineering plastics PLA, ABS, ASA, PETG, PC (PC, PC-ABS) PA (CoPA, PA6-CF, PA6-GF, PA12-CF) PP (PP, PPGF30) Main body size: 728*684*1480mm Weight: 222Kg High-temperature nozzle: Max 500°C High-temperature chamber: Max 90°C

• Other machine tools

Compatible with difficult-to-shape materials such as ABS, PC, nylon, PEEK, ULTEM, and PPSU!

The "FUNMAT Series" is a 3D printer that enables stable molding of super engineering plastics thanks to its internal temperature heating function. Equipped with a high-temperature nozzle. It can stably mold large engineering plastics such as ABS, PC, nylon, PEEK, ULTEM, and PPSU, which have been difficult to mold due to thermal shrinkage and distortion. 【Features】 ■ High-temperature nozzle with a maximum temperature of 500℃ ■ Chamber heater that maintains an internal temperature of 300℃ ■ Dual-head design allows for easy removal of "support materials." ■ Water-soluble support materials are available ■ Minimum layer pitch of 0.1mm ■ Oven filament system *For more details, please refer to the PDF document or feel free to contact us.

• Other machine tools
• Other processing machines

Equipped with a chamber heater that maintains a constant temperature! Stable molding of super engineering plastics is possible.

The "FUNMAT series" is a 3D printer that enables stable printing of super engineering plastics thanks to its internal temperature heating function. Equipped with a high-temperature nozzle, it can stably print large engineering plastics that were previously difficult to print due to thermal shrinkage and warping. Three products are available in the lineup depending on the application. 【Features】 ■ High-temp nozzle with a maximum temperature of 450℃ ■ Chamber heater that maintains a constant internal temperature ■ Hotbed maximum temperature of 160℃ ■ Minimum layer pitch of 0.05mm ■ Easy-to-maintain unit parts *For more details, please refer to the PDF document or feel free to contact us.

• Other machine tools
• 3D Printer

A small desktop model that can also 3D print PEEK.

< Entry model compatible with PEEK > - Large-scale printing with stable formation using a chamber heater Print area: 260*260*260mm - Multi-material compatibility Super engineering plastics PEEK, PEEK-CF, PEEK-GF, PEKK PEI (ULTEM9085, ULTEM1010), PPSU, PPS General-purpose engineering plastics PLA, ABS, ASA, PETG, PC (PC, PC-ABS) PA (CoPA, PA6-CF, PA6-GF, PA12-CF) PP (PP, PPGF30)

• Other machine tools

PEEK, PEI, PPSU, PPS, PEKK lineup

Various Super Engineering Plastics Filaments: PEEK, PEI, PPSU, PEKK, PPS 〇INTAM Performance (Filament Base Material) - PEEK PEEK, PEEK-CF, PEEK-GF - PEI ULTEM9085, ULTEM1010 - PPSU - PPS - PEKK 〇INTAM Support (Support Material) - SP5000: Support material for PEEK-related applications Soaked in a dedicated solvent, it becomes brittle and can be peeled off. - SP5030: Support material for ULTEM 9085 No solvent required, can be easily peeled off by hand. - SP5080: Support material for ULTEM 1010 and PPSU No solvent required, can be easily peeled off by hand.

• Printing Machinery

We continue to provide high-quality filaments to the world through our unique quality control process.

< Wide Range of Lineup > PLA ABS ASA PETG PC PC, PC-FR, PC-ABS, PC-PBT PA CoPA, PA6-CF, PA6-GF TPU

• Engineering Plastics

Large, high-precision, low-cost touch panel series!

The "L-DEVO" is a 3D printer that solves the common modeling quality issues found in conventional FDM (Fused Deposition Modeling) 3D printers with significantly improved modeling accuracy. It features an impressive print area of "400mm square." Additionally, it adopts a data transfer method using a USB memory stick (included), freeing users from the stress of being tied to a PC for long periods. We also provide comprehensive after-sales support, so please feel free to consult us if you have any requests. 【Features】 ■ Simplified basic operations through a touch panel for ease of use by anyone ■ USB cable connection printing with security considerations ■ Improved pause and resume printing functionality ■ Added backup function for prints in progress *For more details, please download the PDF or feel free to contact us.

• Commercial printers
• 3D Printer
• Printer

Large print size 450*450*600mm. Large prints without warping even with ABS.

Large-Scale Forming - Large-scale forming with stable shaping using chamber heater Print area: 450*450*600mm - Multi-material compatible General-purpose engineering plastics: PLA, ABS, ASA, PETG, PC (PC, PC-ABS) PA (CoPA, PA6-CF, PA6-GF) PP (PP, PPGF30)

• Other processing machines

A wide range of options including high precision, high speed, handheld type, and desktop type.

The lineup is as follows. We would appreciate it if you could consult us with the following information: - Purpose (measurement, reverse engineering, modeling, etc.) - Scanning subject <Handheld Type> Main Models - EinScan Pro HD: A model with high versatility and quality. - EinScan HX: The first industrial 3D scanner in the series. - EinScan H: A high-speed model that supports full color. <Desktop Type> With a fixed turntable, easy to use, bringing 3D scanning closer to you. <Desktop High-Precision Model for Inspection>

• 3D measuring device

We offer free demonstrations anywhere in the country! Our four scanning modes cater to a wide range of needs.

The "EinScan series" is a handheld desktop 3D scanner that can be used both as a handheld device and in a fixed position, catering to a wide range of needs. We offer hybrid handheld scanners like the "EinScan H/HX," which has two light sources, and the "EinScan Pro HD," which can scan in both fixed and handheld modes. Additionally, there is a package called the "Reverse Engineering Pack," which includes the EinScan Pro HD main unit, a tripod, and a turntable, along with "Geomagic Essentials." 【Features】 ■ Usable as both a handheld device and in a fixed position ■ Four scanning modes to meet a wide range of needs ■ Improved scanning speed ■ Capable of converting to CAD format ■ Enhanced scanning accuracy *For more details, please refer to the PDF materials or feel free to contact us.

• Scanner

Nitto Kohki will be exhibiting at the "Data Center EXPO" held at Makuhari Messe Hall 1 from Wednesday, October 23 to Friday, October 25. [Booth Number: A6-23] At this exhibition, we will showcase the "Compact Zero Spill Coupler," which is specifically designed for data centers, including supercomputers. We will also present the "Blind Mate Type," a fitting exclusively for server cooling piping, as a reference exhibit.

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely invite you to visit us during this busy time. 【 Exhibition Name 】 Automotive Technology Exhibition 2025 YOKOHAMA https://aee.expo-info.jsae.or.jp/ja/yokohama/ (An "online exhibition" will also be held during and around the event period) 【 Dates 】 May 21 (Wednesday) - 23 (Friday), 2024 10:00 AM - 6:00 PM *On the final day, 9:00 AM - 4:00 PM (Online exhibition: May 14 (Wednesday) - June 4 (Wednesday)) 【 Venue 】 Pacifico Yokohama (1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa Prefecture) Our booth number: "Concourse 505"

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to attend this event. 【 Exhibition Name 】 27th INTERPHEX Week Tokyo https://www.interphex.jp/tokyo/ja-jp.html 【 Dates 】 July 9 (Wednesday) - 11 (Friday), 2025 10:00 AM - 5:00 PM 【 Venue 】 Tokyo Big Sight (3-11-1 Ariake, Koto-ku, Tokyo 135-0063)

[Lecturer] Taku Ito, Partner, Mori Hamada & Matsumoto Foreign Law Joint Enterprise Yoshifumi Nagakubo, Senior Associate [Key Lecture Content] As we move towards a carbon-neutral society, the large-scale introduction of renewable energy sources is progressing, making the enhancement of market design that balances stable electricity supply and economic efficiency an urgent issue. In this context, the "simultaneous market," which integrates the trading of electricity (kWh) and adjustment capacity (ΔkW), is being discussed as a core component of future electricity systems, and serious considerations for its implementation are underway. In this lecture, a lawyer who has led discussions at the forefront of national system design will explain in an easy-to-understand manner the background and necessity of the simultaneous market, as well as the overall picture of its complex mechanisms, based on practical experience. Furthermore, the lecture will clearly outline the latest developments in current discussions, realistic challenges for implementation, and prospects for future electricity business in Japan, incorporating perspectives and insights as a system designer and practitioner.

[Instructor] Hirokazu Shibata, President and CEO of ZAZU Design Co., Ltd. [Key Lecture Content] As the importance of heat dissipation design increases in daily operations, it is necessary to study a range of books on thermal engineering to learn the overall picture of heat dissipation design. However, books on thermal engineering typically start with the basics of heat transfer and cover topics such as temperature boundary layers and dimensionless numbers related to heat transfer, making it quite difficult for beginners to grasp the overall picture in a short period. This seminar is aimed at engineers who will begin thermal design in the future, focusing on various heat dissipation devices as specific subjects. The goal is to understand the basics of thermal design while learning about the characteristics and usage of these heat dissipation devices. After attending this seminar, participants are expected to acquire knowledge equivalent to that gained from studying a range of thermal engineering books. [Lecture Topics] 1. Current Status and Challenges of Thermal Design 2. How "Thermal Resistance" Determines Heat Dissipation Pathways 3. Fundamental Laws Governing Heat Transfer 4. Air Cooling through Heat Transfer 5. Heat Diffusion through Thermal Conduction 6. Heat Transfer via Two-Phase Flow of Gas and Liquid 7. Q&A Session