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  3. フュージョンテクノロジー 本社
  4. We will be exhibiting at INCHEM TOKYO 2021 with our 3D printer!
SEMINAR_EVENT
  • Oct 28, 2021
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Oct 28, 2021

We will be exhibiting at INCHEM TOKYO 2021 with our 3D printer!

フュージョンテクノロジー フュージョンテクノロジー 本社
We will also be showcasing the 3D printer 'FUNMAT Series', which enables stable molding of super engineering plastics thanks to its internal temperature heating function. The lineup is expanded based on different applications. 【Features】 ■ High-temperature nozzle Max 450℃ ■ Chamber heater to maintain a constant internal temperature (Max 90℃) ■ Hot bed Max 160℃ ■ Equipped with dual-head nozzle ■ Minimum layer pitch of 0.05mm ■ Easy-to-maintain unit parts Please feel free to stop by our booth.
Date and time Wednesday, Nov 17, 2021 ~ Friday, Nov 19, 2021
10:00 AM ~ 05:00 PM
Capital Tokyo Big Sight South Exhibition Hall
Entry fee Free
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Related product

410.png

FUNMAT PRO410-G2 3D printer with high-temperature chamber

PEEK compatible, large-scale 3D printer with chamber for various materials, with a total shipment of over 2000 units in the series. Suitable for jigs and small lot production.

HT's high-end model 410 (2 heads, larger size) - 2 heads for smooth removal of support materials Various support materials are also available Super engineering plastic support material "SP5000" (manufactured by INTAMSYS) For ABS and PC, "Hips" - Large-scale printing with stable formation using a chamber heater Print area 305*305*406mm, compatible with PEEK - Multi-material compatible Super engineering plastics PEEK, PEEK-CF, PEEK-GF, PEKK PEI (ULTEM9085, ULTEM1010), PPSU, PPS General-purpose engineering plastics PLA, ABS, ASA, PETG, PC (PC, PC-ABS) PA (CoPA, PA6-CF, PA6-GF, PA12-CF) PP (PP, PPGF30) Main body size: 728*684*1480mm Weight: 222Kg High-temperature nozzle: Max 500°C High-temperature chamber: Max 90°C

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FUNMAT PRO 610 HT SIDE.png

3D Printer FUNMAT PRO610 PEEK Compatible

Compatible with difficult-to-shape materials such as ABS, PC, nylon, PEEK, ULTEM, and PPSU!

The "FUNMAT Series" is a 3D printer that enables stable molding of super engineering plastics thanks to its internal temperature heating function. Equipped with a high-temperature nozzle. It can stably mold large engineering plastics such as ABS, PC, nylon, PEEK, ULTEM, and PPSU, which have been difficult to mold due to thermal shrinkage and distortion. 【Features】 ■ High-temperature nozzle with a maximum temperature of 500℃ ■ Chamber heater that maintains an internal temperature of 300℃ ■ Dual-head design allows for easy removal of "support materials." ■ Water-soluble support materials are available ■ Minimum layer pitch of 0.1mm ■ Oven filament system *For more details, please refer to the PDF document or feel free to contact us.

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  • Other processing machines

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1.png

3D printer "FUNMAT Series"

Equipped with a chamber heater that maintains a constant temperature! Stable molding of super engineering plastics is possible.

The "FUNMAT series" is a 3D printer that enables stable printing of super engineering plastics thanks to its internal temperature heating function. Equipped with a high-temperature nozzle, it can stably print large engineering plastics that were previously difficult to print due to thermal shrinkage and warping. Three products are available in the lineup depending on the application. 【Features】 ■ High-temp nozzle with a maximum temperature of 450℃ ■ Chamber heater that maintains a constant internal temperature ■ Hotbed maximum temperature of 160℃ ■ Minimum layer pitch of 0.05mm ■ Easy-to-maintain unit parts *For more details, please refer to the PDF document or feel free to contact us.

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  • 3D Printer

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HT.png

FUNMAT HT Enhanced

A small desktop model that can also 3D print PEEK.

< Entry model compatible with PEEK > - Large-scale printing with stable formation using a chamber heater Print area: 260*260*260mm - Multi-material compatibility Super engineering plastics PEEK, PEEK-CF, PEEK-GF, PEKK PEI (ULTEM9085, ULTEM1010), PPSU, PPS General-purpose engineering plastics PLA, ABS, ASA, PETG, PC (PC, PC-ABS) PA (CoPA, PA6-CF, PA6-GF, PA12-CF) PP (PP, PPGF30)

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IMTAM  filament  .png

IMTAM Performance High-Performance Material Filament

PEEK, PEI, PPSU, PPS, PEKK lineup

Various Super Engineering Plastics Filaments: PEEK, PEI, PPSU, PEKK, PPS 〇INTAM Performance (Filament Base Material) - PEEK PEEK, PEEK-CF, PEEK-GF - PEI ULTEM9085, ULTEM1010 - PPSU - PPS - PEKK 〇INTAM Support (Support Material) - SP5000: Support material for PEEK-related applications Soaked in a dedicated solvent, it becomes brittle and can be peeled off. - SP5030: Support material for ULTEM 9085 No solvent required, can be easily peeled off by hand. - SP5080: Support material for ULTEM 1010 and PPSU No solvent required, can be easily peeled off by hand.

  • Printing Machinery

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PolyLiteABS01-white-1.jpg

Polymaker 3D Printer Filament Series

We continue to provide high-quality filaments to the world through our unique quality control process.

< Wide Range of Lineup > PLA ABS ASA PETG PC PC, PC-FR, PC-ABS, PC-PBT PA CoPA, PA6-CF, PA6-GF TPU

  • Engineering Plastics

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キャプチャ.JPG

3D printer "L-DEVO"

Large, high-precision, low-cost touch panel series!

The "L-DEVO" is a 3D printer that solves the common modeling quality issues found in conventional FDM (Fused Deposition Modeling) 3D printers with significantly improved modeling accuracy. It features an impressive print area of "400mm square." Additionally, it adopts a data transfer method using a USB memory stick (included), freeing users from the stress of being tied to a PC for long periods. We also provide comprehensive after-sales support, so please feel free to consult us if you have any requests. 【Features】 ■ Simplified basic operations through a touch panel for ease of use by anyone ■ USB cable connection printing with security considerations ■ Improved pause and resume printing functionality ■ Added backup function for prints in progress *For more details, please download the PDF or feel free to contact us.

  • Commercial printers
  • 3D Printer
  • Printer

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FUNMAT PRO (2).png

FUNMAT PRO Large Industrial Printer

Large print size 450*450*600mm. Large prints without warping even with ABS.

Large-Scale Forming - Large-scale forming with stable shaping using chamber heater Print area: 450*450*600mm - Multi-material compatible General-purpose engineering plastics: PLA, ABS, ASA, PETG, PC (PC, PC-ABS) PA (CoPA, PA6-CF, PA6-GF) PP (PP, PPGF30)

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EinScan Pro HD.png

3D Scanner EinScan Series

A wide range of options including high precision, high speed, handheld type, and desktop type.

The lineup is as follows. We would appreciate it if you could consult us with the following information: - Purpose (measurement, reverse engineering, modeling, etc.) - Scanning subject <Handheld Type> Main Models - EinScan Pro HD: A model with high versatility and quality. - EinScan HX: The first industrial 3D scanner in the series. - EinScan H: A high-speed model that supports full color. <Desktop Type> With a fixed turntable, easy to use, bringing 3D scanning closer to you. <Desktop High-Precision Model for Inspection>

  • 3D measuring device

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2021-06-28_09h53_16.png

Handheld Desktop 3D Scanner "EinScan Series"

We offer free demonstrations anywhere in the country! Our four scanning modes cater to a wide range of needs.

The "EinScan series" is a handheld desktop 3D scanner that can be used both as a handheld device and in a fixed position, catering to a wide range of needs. We offer hybrid handheld scanners like the "EinScan H/HX," which has two light sources, and the "EinScan Pro HD," which can scan in both fixed and handheld modes. Additionally, there is a package called the "Reverse Engineering Pack," which includes the EinScan Pro HD main unit, a tripod, and a turntable, along with "Geomagic Essentials." 【Features】 ■ Usable as both a handheld device and in a fixed position ■ Four scanning modes to meet a wide range of needs ■ Improved scanning speed ■ Capable of converting to CAD format ■ Enhanced scanning accuracy *For more details, please refer to the PDF materials or feel free to contact us.

  • Scanner

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news

[Co-sponsorship/Exhibition] 2/11~2/13 JANOG57 Meeting in Osaka | ★★★ Experience the latest infrastructure technologies! Check out the trending storage products at JANOG57.

  • NEW
  • SEMINAR_EVENT

From February 11 (Wednesday) to February 13 (Friday), Mikasa Trading Co., Ltd. will sponsor the technology conference "JANOG57 Meeting in Osaka" held at the Congre Convention Center. This event provides an open platform for field engineers to freely discuss and share the latest network technologies, practical operational know-how, and case studies of failures. This time, we will be exhibiting a booth in collaboration with Western Digital Marketing LLC, showcasing innovative storage solutions such as the "Ultrastar Data60" and HDDs with a maximum capacity of 30TB. The Ultrastar Data60 is recognized for its ability to efficiently accommodate up to 60 high-quality HDDs while achieving large capacity, low cost, and space-saving design. Additionally, we will display mobile label printers made by Brady Japan at our booth. You will have the opportunity to see products that are actively used in infrastructure development and data management up close. Don't miss this chance to experience the technologies that support the future! We look forward to seeing you at the venue.

Feb 06, 2026

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Images obtained with the Invitrogen EVOS S1000 Spatial Imaging System.

Introducing a highly reproducible biomarker analysis method utilizing spatial information with the EVOS S1000 Spatial Imaging System "Cancer Biomarker Discovery 2026."

  • NEW
  • SEMINAR_EVENT

Cancer Biomarker Discovery 2026 is an online seminar focused on the latest biomarker discovery and analysis technologies in the field of cancer research. Advanced technologies that support the understanding, diagnosis, and treatment research of cancer, such as liquid biopsy, proteomics, and spatial omics analysis, will be introduced. This seminar primarily targets basic and clinical researchers involved in cancer research, as well as those interested in biomarker discovery and analysis. In our section, we will introduce the latest techniques in fluorescent imaging for spatial biology and spatial proteomics research, centered around the Invitrogen EVOS S1000 Spatial Imaging System. Unlike traditional microscopy, which is limited in multiplex immunostaining, our spectral unmixing technology enables simultaneous imaging of up to 9 colors, allowing for rapid data acquisition with minimized sample damage. Additionally, we will explain a practical workflow using direct conjugate antibodies and TSA-based Invitrogen Aluora amplification reagents, proposing high-reproducibility analysis methods that leverage spatial information. For research use only. Not for diagnostic use.

Feb 05, 2026

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Examples of images obtained with the Invitrogen EVOS S1000 Spatial Imaging System.

Free Online Seminar "Spatial Biological Analysis Realized with EVOS S1000 and HALO"

  • NEW
  • SEMINAR_EVENT

In spatial biology/spatial proteomics research, the coexistence of "high-quality multiplex fluorescence image acquisition" and "reliable quantitative analysis" is becoming increasingly important. This webinar, co-hosted by Thermo Fisher Scientific and Indica Labs, will introduce a practical workflow that allows for a comprehensive understanding from imaging to analysis. Recommended for: - Those interested in spatial biology/spatial proteomics research who want to systematically understand the entire process from imaging to analysis. - Those who are already conducting or considering the implementation of multiplex imaging (multiplex immunostaining). - Those who feel limited by traditional four-color fluorescence observation and wish to engage in higher-dimensional spatial information analysis. This is a free seminar, so please join us. *For research use only. Not for diagnostic use.

Feb 05, 2026

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[Seminar] Legal Aspects of Systematic Storage Batteries × Corporate PPA

  • NEW
  • SEMINAR_EVENT

[Speaker] Naoki Eguchi, Attorney at Baker McKenzie [Lecture Topics] 1. Utilization of Storage Batteries (1) Storage Batteries for Renewable Energy Integration (2) Grid-Side Storage Batteries (3) Hybrid Power Generation with Solar, Wind, and Storage Batteries 2. Positioning of Grid-Side Storage Batteries 3. Subsidies for Grid-Side Storage Batteries / Long-Term Decarbonization Power Source Auctions 4. Practical Aspects and Contracts for Grid-Side Storage Batteries - Offtake Model, Merchant Model 5. Current Status of Corporate PPAs (Overseas and Japan) 6. Types of Corporate PPAs (Physical and Virtual) 7. Contracts for Corporate PPAs 8. Corporate PPAs and Project Finance 9. Q&A / Business Card Exchange

Feb 05, 2026

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[Seminar] GX-ETS Overview and Outlook in Preparation for Full-scale Implementation

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  • SEMINAR_EVENT

[Instructor] Professor at Waseda University Graduate School of Political Science and Economics / Director of the Institute for Environmental Economic Management Visiting Researcher at Sciences Po Paris Faculty Fellow at the National Institute of Economic and Industrial Research Mr. Toshihide Arimura [Key Lecture Content] Starting in the fiscal year 2026, participation in the GX-ETS will become mandatory for some companies in Japan. Carbon costs will become an increasingly important factor in considering long-term value creation for businesses. This seminar will explain the impacts of the full-scale implementation of the GX-ETS on Japanese companies and the economy. Additionally, we will introduce the future outlook for the GX-ETS and the paths that should be taken, from the perspectives of comparison with overseas emissions trading systems and its economic significance.

Feb 05, 2026

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