We will be exhibiting at INCHEM TOKYO 2021 with our 3D printer!

PEEK compatible, large-scale 3D printer with chamber for various materials, with a total shipment of over 2000 units in the series. Suitable for jigs and small lot production.

HT's high-end model 410 (2 heads, larger size) - 2 heads for smooth removal of support materials Various support materials are also available Super engineering plastic support material "SP5000" (manufactured by INTAMSYS) For ABS and PC, "Hips" - Large-scale printing with stable formation using a chamber heater Print area 305*305*406mm, compatible with PEEK - Multi-material compatible Super engineering plastics PEEK, PEEK-CF, PEEK-GF, PEKK PEI (ULTEM9085, ULTEM1010), PPSU, PPS General-purpose engineering plastics PLA, ABS, ASA, PETG, PC (PC, PC-ABS) PA (CoPA, PA6-CF, PA6-GF, PA12-CF) PP (PP, PPGF30) Main body size: 728*684*1480mm Weight: 222Kg High-temperature nozzle: Max 500°C High-temperature chamber: Max 90°C

• Other machine tools

Compatible with difficult-to-shape materials such as ABS, PC, nylon, PEEK, ULTEM, and PPSU!

The "FUNMAT Series" is a 3D printer that enables stable molding of super engineering plastics thanks to its internal temperature heating function. Equipped with a high-temperature nozzle. It can stably mold large engineering plastics such as ABS, PC, nylon, PEEK, ULTEM, and PPSU, which have been difficult to mold due to thermal shrinkage and distortion. 【Features】 ■ High-temperature nozzle with a maximum temperature of 500℃ ■ Chamber heater that maintains an internal temperature of 300℃ ■ Dual-head design allows for easy removal of "support materials." ■ Water-soluble support materials are available ■ Minimum layer pitch of 0.1mm ■ Oven filament system *For more details, please refer to the PDF document or feel free to contact us.

• Other machine tools
• Other processing machines

Equipped with a chamber heater that maintains a constant temperature! Stable molding of super engineering plastics is possible.

The "FUNMAT series" is a 3D printer that enables stable printing of super engineering plastics thanks to its internal temperature heating function. Equipped with a high-temperature nozzle, it can stably print large engineering plastics that were previously difficult to print due to thermal shrinkage and warping. Three products are available in the lineup depending on the application. 【Features】 ■ High-temp nozzle with a maximum temperature of 450℃ ■ Chamber heater that maintains a constant internal temperature ■ Hotbed maximum temperature of 160℃ ■ Minimum layer pitch of 0.05mm ■ Easy-to-maintain unit parts *For more details, please refer to the PDF document or feel free to contact us.

• Other machine tools
• 3D Printer

A small desktop model that can also 3D print PEEK.

< Entry model compatible with PEEK > - Large-scale printing with stable formation using a chamber heater Print area: 260*260*260mm - Multi-material compatibility Super engineering plastics PEEK, PEEK-CF, PEEK-GF, PEKK PEI (ULTEM9085, ULTEM1010), PPSU, PPS General-purpose engineering plastics PLA, ABS, ASA, PETG, PC (PC, PC-ABS) PA (CoPA, PA6-CF, PA6-GF, PA12-CF) PP (PP, PPGF30)

• Other machine tools

PEEK, PEI, PPSU, PPS, PEKK lineup

Various Super Engineering Plastics Filaments: PEEK, PEI, PPSU, PEKK, PPS 〇INTAM Performance (Filament Base Material) - PEEK PEEK, PEEK-CF, PEEK-GF - PEI ULTEM9085, ULTEM1010 - PPSU - PPS - PEKK 〇INTAM Support (Support Material) - SP5000: Support material for PEEK-related applications Soaked in a dedicated solvent, it becomes brittle and can be peeled off. - SP5030: Support material for ULTEM 9085 No solvent required, can be easily peeled off by hand. - SP5080: Support material for ULTEM 1010 and PPSU No solvent required, can be easily peeled off by hand.

• Printing Machinery

We continue to provide high-quality filaments to the world through our unique quality control process.

< Wide Range of Lineup > PLA ABS ASA PETG PC PC, PC-FR, PC-ABS, PC-PBT PA CoPA, PA6-CF, PA6-GF TPU

• Engineering Plastics

Large, high-precision, low-cost touch panel series!

The "L-DEVO" is a 3D printer that solves the common modeling quality issues found in conventional FDM (Fused Deposition Modeling) 3D printers with significantly improved modeling accuracy. It features an impressive print area of "400mm square." Additionally, it adopts a data transfer method using a USB memory stick (included), freeing users from the stress of being tied to a PC for long periods. We also provide comprehensive after-sales support, so please feel free to consult us if you have any requests. 【Features】 ■ Simplified basic operations through a touch panel for ease of use by anyone ■ USB cable connection printing with security considerations ■ Improved pause and resume printing functionality ■ Added backup function for prints in progress *For more details, please download the PDF or feel free to contact us.

• Commercial printers
• 3D Printer
• Printer

Large print size 450*450*600mm. Large prints without warping even with ABS.

Large-Scale Forming - Large-scale forming with stable shaping using chamber heater Print area: 450*450*600mm - Multi-material compatible General-purpose engineering plastics: PLA, ABS, ASA, PETG, PC (PC, PC-ABS) PA (CoPA, PA6-CF, PA6-GF) PP (PP, PPGF30)

• Other processing machines

A wide range of options including high precision, high speed, handheld type, and desktop type.

The lineup is as follows. We would appreciate it if you could consult us with the following information: - Purpose (measurement, reverse engineering, modeling, etc.) - Scanning subject <Handheld Type> Main Models - EinScan Pro HD: A model with high versatility and quality. - EinScan HX: The first industrial 3D scanner in the series. - EinScan H: A high-speed model that supports full color. <Desktop Type> With a fixed turntable, easy to use, bringing 3D scanning closer to you. <Desktop High-Precision Model for Inspection>

• 3D measuring device

We offer free demonstrations anywhere in the country! Our four scanning modes cater to a wide range of needs.

The "EinScan series" is a handheld desktop 3D scanner that can be used both as a handheld device and in a fixed position, catering to a wide range of needs. We offer hybrid handheld scanners like the "EinScan H/HX," which has two light sources, and the "EinScan Pro HD," which can scan in both fixed and handheld modes. Additionally, there is a package called the "Reverse Engineering Pack," which includes the EinScan Pro HD main unit, a tripod, and a turntable, along with "Geomagic Essentials." 【Features】 ■ Usable as both a handheld device and in a fixed position ■ Four scanning modes to meet a wide range of needs ■ Improved scanning speed ■ Capable of converting to CAD format ■ Enhanced scanning accuracy *For more details, please refer to the PDF materials or feel free to contact us.

• Scanner

Nitto Kohki will be exhibiting at the "Data Center EXPO" held at Makuhari Messe Hall 1 from Wednesday, October 23 to Friday, October 25. [Booth Number: A6-23] At this exhibition, we will showcase the "Compact Zero Spill Coupler," which is specifically designed for data centers, including supercomputers. We will also present the "Blind Mate Type," a fitting exclusively for server cooling piping, as a reference exhibit.

In this seminar, we will clearly introduce "how to organize a complicated IT infrastructure and envision the future" by incorporating specific processes and examples of IT infrastructure planning. It is designed for IT department heads who feel challenges with the current state of their IT infrastructure, allowing them to envision it in the context of their own environment. <Program> - Opening - What is the upstream process of IT infrastructure? - Thinking together about the future of IT infrastructure - Upstream process of IT infrastructure - Q&A <Recommended for> - IT department heads who make decisions on the implementation of IT infrastructure *Applications from competing companies may be declined.

[Speaker] Kenji Kikuchi, Executive Fellow, MDB Business Division, Japan Management Association Research Institute [Lecture Topics] 1. Important latest research trends to consider for the future 2. Latest business information gathering methods for future insights 3. Case studies on information gathering - perspectives on information collection and utilization 4. "Future insights" perspectives that leaders and personnel responsible for expanding existing businesses, new businesses, new product development, and exploring new applications should know 5. Introduction of the latest business information sources to pay attention to in the AI era for "future insights" 6. Q&A / Business card exchange

[Speaker] NTT ME Corporation Director of Social Infrastructure Design Department, Mr. Osamu Sasaki [Key Lecture Content] Starting from the challenges faced through the maintenance and operation of the vast communication infrastructure owned by NTT East Japan, such as aging equipment, a shortage of workforce, and the intensification of disasters, we will organize the structural issues that the entire social infrastructure sector, including roads and water supply and sewage systems, faces. Based on this, we will present ideas for realizing sustainable social infrastructure, including the transition to smart maintenance and preventive maintenance utilizing accumulated data. Furthermore, we will introduce the direction of initiatives considered by NTT East Japan, future prospects, and remaining challenges. [Lecture Items] 1. Past initiatives and challenges at NTT East Japan 2. Challenges faced by the social infrastructure sector 3. Towards the realization of sustainable social infrastructure 4. Direction of initiatives considered by NTT East Japan 5. Future initiatives and challenges 6. Q&A / Business card exchange

This is a seminar to support obtaining the qualification of Mechanical Condition Monitoring and Diagnostic Technician (Vibration), a specialist in monitoring and diagnosing the vibration state of machinery and equipment. By attending this seminar and passing the certification exam, you will receive certification as a Category 2 Mechanical Condition Monitoring and Diagnostic Technician (Vibration) in accordance with ISO 18436-2. In this seminar, you will thoroughly learn about vibration analysis diagnosis and condition monitoring technology for rotating machinery over five days. It is an ideal seminar for those who want to improve their vibration measurement and analysis diagnostic skills, those who are struggling with vibration issues in machinery and want to incorporate vibration condition monitoring and diagnosis, and those who wish to obtain qualifications to enhance their credentials. We will provide clear lectures on vibration analysis diagnostic techniques cultivated through rotating machinery maintenance. A new factory will be opened in 2026, and the seminar room has also been newly renovated, significantly increasing the capacity! We encourage you to take this opportunity to attend.