We will be exhibiting at INCHEM TOKYO 2021 with our 3D printer!

PEEK compatible, large-scale 3D printer with chamber for various materials, with a total shipment of over 2000 units in the series. Suitable for jigs and small lot production.

HT's high-end model 410 (2 heads, larger size) - 2 heads for smooth removal of support materials Various support materials are also available Super engineering plastic support material "SP5000" (manufactured by INTAMSYS) For ABS and PC, "Hips" - Large-scale printing with stable formation using a chamber heater Print area 305*305*406mm, compatible with PEEK - Multi-material compatible Super engineering plastics PEEK, PEEK-CF, PEEK-GF, PEKK PEI (ULTEM9085, ULTEM1010), PPSU, PPS General-purpose engineering plastics PLA, ABS, ASA, PETG, PC (PC, PC-ABS) PA (CoPA, PA6-CF, PA6-GF, PA12-CF) PP (PP, PPGF30) Main body size: 728*684*1480mm Weight: 222Kg High-temperature nozzle: Max 500°C High-temperature chamber: Max 90°C

• Other machine tools

Compatible with difficult-to-shape materials such as ABS, PC, nylon, PEEK, ULTEM, and PPSU!

The "FUNMAT Series" is a 3D printer that enables stable molding of super engineering plastics thanks to its internal temperature heating function. Equipped with a high-temperature nozzle. It can stably mold large engineering plastics such as ABS, PC, nylon, PEEK, ULTEM, and PPSU, which have been difficult to mold due to thermal shrinkage and distortion. 【Features】 ■ High-temperature nozzle with a maximum temperature of 500℃ ■ Chamber heater that maintains an internal temperature of 300℃ ■ Dual-head design allows for easy removal of "support materials." ■ Water-soluble support materials are available ■ Minimum layer pitch of 0.1mm ■ Oven filament system *For more details, please refer to the PDF document or feel free to contact us.

• Other machine tools
• Other processing machines

Equipped with a chamber heater that maintains a constant temperature! Stable molding of super engineering plastics is possible.

The "FUNMAT series" is a 3D printer that enables stable printing of super engineering plastics thanks to its internal temperature heating function. Equipped with a high-temperature nozzle, it can stably print large engineering plastics that were previously difficult to print due to thermal shrinkage and warping. Three products are available in the lineup depending on the application. 【Features】 ■ High-temp nozzle with a maximum temperature of 450℃ ■ Chamber heater that maintains a constant internal temperature ■ Hotbed maximum temperature of 160℃ ■ Minimum layer pitch of 0.05mm ■ Easy-to-maintain unit parts *For more details, please refer to the PDF document or feel free to contact us.

• Other machine tools
• 3D Printer

A small desktop model that can also 3D print PEEK.

< Entry model compatible with PEEK > - Large-scale printing with stable formation using a chamber heater Print area: 260*260*260mm - Multi-material compatibility Super engineering plastics PEEK, PEEK-CF, PEEK-GF, PEKK PEI (ULTEM9085, ULTEM1010), PPSU, PPS General-purpose engineering plastics PLA, ABS, ASA, PETG, PC (PC, PC-ABS) PA (CoPA, PA6-CF, PA6-GF, PA12-CF) PP (PP, PPGF30)

• Other machine tools

PEEK, PEI, PPSU, PPS, PEKK lineup

Various Super Engineering Plastics Filaments: PEEK, PEI, PPSU, PEKK, PPS 〇INTAM Performance (Filament Base Material) - PEEK PEEK, PEEK-CF, PEEK-GF - PEI ULTEM9085, ULTEM1010 - PPSU - PPS - PEKK 〇INTAM Support (Support Material) - SP5000: Support material for PEEK-related applications Soaked in a dedicated solvent, it becomes brittle and can be peeled off. - SP5030: Support material for ULTEM 9085 No solvent required, can be easily peeled off by hand. - SP5080: Support material for ULTEM 1010 and PPSU No solvent required, can be easily peeled off by hand.

• Printing Machinery

We continue to provide high-quality filaments to the world through our unique quality control process.

< Wide Range of Lineup > PLA ABS ASA PETG PC PC, PC-FR, PC-ABS, PC-PBT PA CoPA, PA6-CF, PA6-GF TPU

• Engineering Plastics

Large, high-precision, low-cost touch panel series!

The "L-DEVO" is a 3D printer that solves the common modeling quality issues found in conventional FDM (Fused Deposition Modeling) 3D printers with significantly improved modeling accuracy. It features an impressive print area of "400mm square." Additionally, it adopts a data transfer method using a USB memory stick (included), freeing users from the stress of being tied to a PC for long periods. We also provide comprehensive after-sales support, so please feel free to consult us if you have any requests. 【Features】 ■ Simplified basic operations through a touch panel for ease of use by anyone ■ USB cable connection printing with security considerations ■ Improved pause and resume printing functionality ■ Added backup function for prints in progress *For more details, please download the PDF or feel free to contact us.

• Commercial printers
• 3D Printer
• Printer

Large print size 450*450*600mm. Large prints without warping even with ABS.

Large-Scale Forming - Large-scale forming with stable shaping using chamber heater Print area: 450*450*600mm - Multi-material compatible General-purpose engineering plastics: PLA, ABS, ASA, PETG, PC (PC, PC-ABS) PA (CoPA, PA6-CF, PA6-GF) PP (PP, PPGF30)

• Other processing machines

A wide range of options including high precision, high speed, handheld type, and desktop type.

The lineup is as follows. We would appreciate it if you could consult us with the following information: - Purpose (measurement, reverse engineering, modeling, etc.) - Scanning subject <Handheld Type> Main Models - EinScan Pro HD: A model with high versatility and quality. - EinScan HX: The first industrial 3D scanner in the series. - EinScan H: A high-speed model that supports full color. <Desktop Type> With a fixed turntable, easy to use, bringing 3D scanning closer to you. <Desktop High-Precision Model for Inspection>

• 3D measuring device

We offer free demonstrations anywhere in the country! Our four scanning modes cater to a wide range of needs.

The "EinScan series" is a handheld desktop 3D scanner that can be used both as a handheld device and in a fixed position, catering to a wide range of needs. We offer hybrid handheld scanners like the "EinScan H/HX," which has two light sources, and the "EinScan Pro HD," which can scan in both fixed and handheld modes. Additionally, there is a package called the "Reverse Engineering Pack," which includes the EinScan Pro HD main unit, a tripod, and a turntable, along with "Geomagic Essentials." 【Features】 ■ Usable as both a handheld device and in a fixed position ■ Four scanning modes to meet a wide range of needs ■ Improved scanning speed ■ Capable of converting to CAD format ■ Enhanced scanning accuracy *For more details, please refer to the PDF materials or feel free to contact us.

• Scanner

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

Yazaki Energy System will be exhibiting at the "14th Agricultural WEEK (commonly known as J-AGRI)" held at Makuhari Messe. In response to challenges surrounding agriculture, such as record heat and soaring energy prices, our company proposes an agricultural system that utilizes surplus solar heat and waste heat from factories during the summer to support stable cultivation throughout the year, from winter heating to summer cooling. ■ Exhibition Details (Booth Number: 25-47) <Closed-type Agricultural House> Results from the second season and initiatives for the third season <Localized Cooling in Solar-Powered Agricultural Houses> Mechanism of substrate cooling, comparison of energy consumption with spatial cooling, growth conditions this summer <Cooling and Heating with Solar Heat> Examples of crown heating and house cooling, utilization of surplus heat in summer <Cooling of Crops and Workers with Well Water> Exhibition of a prototype well water cooler and proposals for the use of cooling jackets When you visit, please be sure to stop by our booth.

We would like to inform you about the autumn and winter internship opportunities for the 2028 graduates. 1. Open Company Dates: October 23, 2026 (Friday), November 11, 2026 (Wednesday), December 10, 2026 (Thursday), January 21, 2027 (Thursday) Time: 13:30 - 15:30 Location: Online (Microsoft Teams) 2. 1-Day Job Experience Dates: November 17, 2026 (Tuesday), December 16, 2026 (Wednesday) January 15, 2027 (Friday), January 27, 2027 (Wednesday), February 4, 2027 (Thursday), February 10, 2027 (Wednesday), February 18, 2027 (Thursday) Time: 10:00 - 17:30 (tentative) Location: Takaya Corporation Headquarters (661-1 Ibara-cho, Ibara City, Okayama Prefecture)

Notice of participation in the "FOOD Expo 2026." 【Date and Time】 　November 11 (Wednesday) - 13 (Friday), 2026 　Opening hours: 10:00 AM - 5:00 PM 【Venue】 　Tokyo Big Sight 　East Hall 2, Booth Number B-36 【Exhibits】 　Cardboard insulated boxes 　Craft cooler cubes 　Vacuum insulated panel 　Pallet cubes

[Lecture Topics] 1. Co-creation Strategy to Deliver AI to the Field - Business Development and Joint Ventures in the Era of Generative AI and Physical AI Mr. Haruto Suzuki, Industrial and Regional Research Department, Development Bank of Japan 1. The Mechanism of Generative AI and Its Current Utilization by Companies 2. Expansion of the Generative AI Market and AI Infrastructure 3. Transition from Generative AI to Physical AI 4. Bottlenecks in Social Implementation and Solutions through Joint Ventures 5. Formation of an Implementation Ecosystem through Policy and Finance 6. Q&A / Business Card Exchange 2. Needs, Development Trends, Future Possibilities, and Challenges of Physical AI Mr. Kazushi Asama, Senior Researcher, Next-Generation Robot Research Organization, Waseda University / Emeritus Professor, University of Tokyo 1. What Physical AI Means 2. Needs for Physical AI and the Technological Trends of Generative AI Behind It 3. Development Trends of Physical AI 4. Future Possibilities and Challenges of Physical AI 5. Q&A / Business Card Exchange