We will be exhibiting at INCHEM TOKYO 2021 with our 3D printer!

PEEK compatible, large-scale 3D printer with chamber for various materials, with a total shipment of over 2000 units in the series. Suitable for jigs and small lot production.

HT's high-end model 410 (2 heads, larger size) - 2 heads for smooth removal of support materials Various support materials are also available Super engineering plastic support material "SP5000" (manufactured by INTAMSYS) For ABS and PC, "Hips" - Large-scale printing with stable formation using a chamber heater Print area 305*305*406mm, compatible with PEEK - Multi-material compatible Super engineering plastics PEEK, PEEK-CF, PEEK-GF, PEKK PEI (ULTEM9085, ULTEM1010), PPSU, PPS General-purpose engineering plastics PLA, ABS, ASA, PETG, PC (PC, PC-ABS) PA (CoPA, PA6-CF, PA6-GF, PA12-CF) PP (PP, PPGF30) Main body size: 728*684*1480mm Weight: 222Kg High-temperature nozzle: Max 500°C High-temperature chamber: Max 90°C

• Other machine tools

Compatible with difficult-to-shape materials such as ABS, PC, nylon, PEEK, ULTEM, and PPSU!

The "FUNMAT Series" is a 3D printer that enables stable molding of super engineering plastics thanks to its internal temperature heating function. Equipped with a high-temperature nozzle. It can stably mold large engineering plastics such as ABS, PC, nylon, PEEK, ULTEM, and PPSU, which have been difficult to mold due to thermal shrinkage and distortion. 【Features】 ■ High-temperature nozzle with a maximum temperature of 500℃ ■ Chamber heater that maintains an internal temperature of 300℃ ■ Dual-head design allows for easy removal of "support materials." ■ Water-soluble support materials are available ■ Minimum layer pitch of 0.1mm ■ Oven filament system *For more details, please refer to the PDF document or feel free to contact us.

• Other machine tools
• Other processing machines

Equipped with a chamber heater that maintains a constant temperature! Stable molding of super engineering plastics is possible.

The "FUNMAT series" is a 3D printer that enables stable printing of super engineering plastics thanks to its internal temperature heating function. Equipped with a high-temperature nozzle, it can stably print large engineering plastics that were previously difficult to print due to thermal shrinkage and warping. Three products are available in the lineup depending on the application. 【Features】 ■ High-temp nozzle with a maximum temperature of 450℃ ■ Chamber heater that maintains a constant internal temperature ■ Hotbed maximum temperature of 160℃ ■ Minimum layer pitch of 0.05mm ■ Easy-to-maintain unit parts *For more details, please refer to the PDF document or feel free to contact us.

• Other machine tools
• 3D Printer

A small desktop model that can also 3D print PEEK.

< Entry model compatible with PEEK > - Large-scale printing with stable formation using a chamber heater Print area: 260*260*260mm - Multi-material compatibility Super engineering plastics PEEK, PEEK-CF, PEEK-GF, PEKK PEI (ULTEM9085, ULTEM1010), PPSU, PPS General-purpose engineering plastics PLA, ABS, ASA, PETG, PC (PC, PC-ABS) PA (CoPA, PA6-CF, PA6-GF, PA12-CF) PP (PP, PPGF30)

• Other machine tools

PEEK, PEI, PPSU, PPS, PEKK lineup

Various Super Engineering Plastics Filaments: PEEK, PEI, PPSU, PEKK, PPS 〇INTAM Performance (Filament Base Material) - PEEK PEEK, PEEK-CF, PEEK-GF - PEI ULTEM9085, ULTEM1010 - PPSU - PPS - PEKK 〇INTAM Support (Support Material) - SP5000: Support material for PEEK-related applications Soaked in a dedicated solvent, it becomes brittle and can be peeled off. - SP5030: Support material for ULTEM 9085 No solvent required, can be easily peeled off by hand. - SP5080: Support material for ULTEM 1010 and PPSU No solvent required, can be easily peeled off by hand.

• Printing Machinery

We continue to provide high-quality filaments to the world through our unique quality control process.

< Wide Range of Lineup > PLA ABS ASA PETG PC PC, PC-FR, PC-ABS, PC-PBT PA CoPA, PA6-CF, PA6-GF TPU

• Engineering Plastics

Large, high-precision, low-cost touch panel series!

The "L-DEVO" is a 3D printer that solves the common modeling quality issues found in conventional FDM (Fused Deposition Modeling) 3D printers with significantly improved modeling accuracy. It features an impressive print area of "400mm square." Additionally, it adopts a data transfer method using a USB memory stick (included), freeing users from the stress of being tied to a PC for long periods. We also provide comprehensive after-sales support, so please feel free to consult us if you have any requests. 【Features】 ■ Simplified basic operations through a touch panel for ease of use by anyone ■ USB cable connection printing with security considerations ■ Improved pause and resume printing functionality ■ Added backup function for prints in progress *For more details, please download the PDF or feel free to contact us.

• Commercial printers
• 3D Printer
• Printer

Large print size 450*450*600mm. Large prints without warping even with ABS.

Large-Scale Forming - Large-scale forming with stable shaping using chamber heater Print area: 450*450*600mm - Multi-material compatible General-purpose engineering plastics: PLA, ABS, ASA, PETG, PC (PC, PC-ABS) PA (CoPA, PA6-CF, PA6-GF) PP (PP, PPGF30)

• Other processing machines

A wide range of options including high precision, high speed, handheld type, and desktop type.

The lineup is as follows. We would appreciate it if you could consult us with the following information: - Purpose (measurement, reverse engineering, modeling, etc.) - Scanning subject <Handheld Type> Main Models - EinScan Pro HD: A model with high versatility and quality. - EinScan HX: The first industrial 3D scanner in the series. - EinScan H: A high-speed model that supports full color. <Desktop Type> With a fixed turntable, easy to use, bringing 3D scanning closer to you. <Desktop High-Precision Model for Inspection>

• 3D measuring device

We offer free demonstrations anywhere in the country! Our four scanning modes cater to a wide range of needs.

The "EinScan series" is a handheld desktop 3D scanner that can be used both as a handheld device and in a fixed position, catering to a wide range of needs. We offer hybrid handheld scanners like the "EinScan H/HX," which has two light sources, and the "EinScan Pro HD," which can scan in both fixed and handheld modes. Additionally, there is a package called the "Reverse Engineering Pack," which includes the EinScan Pro HD main unit, a tripod, and a turntable, along with "Geomagic Essentials." 【Features】 ■ Usable as both a handheld device and in a fixed position ■ Four scanning modes to meet a wide range of needs ■ Improved scanning speed ■ Capable of converting to CAD format ■ Enhanced scanning accuracy *For more details, please refer to the PDF materials or feel free to contact us.

• Scanner

About ROAD: The "Roundtable on the Purpose of Autonomous Driving (ROAD)" conference series has evolved into a unique platform for interdis-ciplinary dialogue and international collaboration in the field of autonomous driving and autonomous mobility. Established in 2016, ROAD has brought together researchers, industry leaders, and public sector stakeholders from six countries across three continents. Based on this background, the upcoming ROAD 2026 will focus on "safety” and "driving AI”—the final pieces of the autonomous driving puzzle—to advance discussions on establishing the foundational framework for ensuring safety quality and obtaining regular-tory approval for autonomous driving. We also intend to discuss the international commonalities and differences regarding the social value brought about by ADS vehicles in terms of automation, intelligent driving, and mobility. We have established a total of five compelling themes for the Round Workshops, consisting of two topics related to “The Last Piece” and three topics related to the social value of ADS, as shown below. 1) Round Workshop 1 - Horizons of E2E Driving AI → Can AI Understand the Driving Environment Like Humans? 2) Round Workshop 2 - Beyond the Unknown: Safety Cases for ADS → Can Safety Ever Be Proven? 3) Round Workshop 3 - Envisioning Smart City Mobility → Can Smart City Mobility Bridge the Mobility Divide? 4) Round Workshop 4 - Logistics Enhancement Through Autonomous Tracking → Will Logistics Become Human-Free? 5) Round Workshop 5 - The Evolution of CASE: SDV/AIDV → Will Automakers Become AI Companies? We hope you’ll all join us!

[Speaker] Masashi Sugita, President and CEO of LEX Style Co., Ltd. [Key Lecture Content] The power consumption of AI servers used in data centers has significantly increased, making traditional air cooling insufficient for operation. This lecture will organize the requirements for introducing a liquid cooling system into air-cooled data centers and explain the implementation method using free cooling with specific design details. When handling high-density AI servers, energy efficiency is required, and the widely used energy efficiency indicator, as well as the Ministry of Economy, Trade and Industry's Resource and Energy Agency's PUE regulation of "1.3 or below," will be explained along with practical operational insights. [Lecture Items] 1. Heat dissipation methods for high-density, high-heat AI servers 2. Basics and importance of PUE/pPUE 3. PUE regulation of "1.3 or below" by the Ministry of Economy, Trade and Industry's Resource and Energy Agency 4. AI server implementation and requirements for new data centers 5. Summary and future outlook 6. Q&A / Business card exchange

[Key Lecture Content] 1. Promotion of SAF Introduction Yasushi Yamashita, Director, Carbon Neutral Promotion Office, Aviation Bureau, Ministry of Land, Infrastructure, Transport and Tourism 1. Importance of SAF in the decarbonization of the aviation sector 2. Initiatives to promote the introduction of SAF 3. Q&A / Business card exchange 2. Japan Airlines' Challenge Towards Net Zero CO2 Emissions by 2050 Kazuki Hirotani, Group Leader, GX Planning Group, Sustainability Promotion Department, Japan Airlines Co., Ltd. 1. Introduction of our five initiatives for CO2 emission reduction 2. Initiatives for reducing fuel consumption (introduction of fuel-efficient aircraft, operational improvements) 3. Initiatives for fuel transition (sustainable aviation fuel SAF) 4. Initiatives for reductions outside the value chain (carbon credits, new removal technologies) 5. Initiatives to deepen collaboration with society 6. Q&A / Business card exchange

[Instructor] Yuichiro Kabushiki, Partner Lawyer at TMI Comprehensive Law Office [Key Lecture Content] With the spread of AI, there is growing attention on the civil liability of developers, providers, and users of AI. The Ministry of Economy, Trade and Industry will publish "Guidelines on the Interpretation and Application of Civil Liability in AI Utilization" in April 2026, and the Ministry of Justice will also establish an expert meeting to examine civil liability related to unauthorized use of images and voices generated by AI in the same month. As the full enforcement of the AI Promotion Act and the revision of AI guidelines are underway, it is necessary to design and operate governance based on the potential responsibilities that may arise retrospectively. In this seminar, based on the guidelines from the Ministry of Economy, Trade and Industry and drawing on litigation practice experience as a judge and lawyer, we will organize the basic framework for assessing civil liability and explain fundamental methods for designing and operating governance based on risk analysis. Furthermore, we will examine the framework for civil liability and the design and operation of governance using hypothetical cases that are likely to pose practical issues.

In this seminar, we will welcome Mr. Satoru Hayami from Waseda University, who will explain the latest trends in AI utilization in manufacturing, as well as the evolution of technologies such as agent-based AI and physical AI, and the opportunities and key points for practical application in the manufacturing industry. Furthermore, Mr. Tsubasa Shibata, representative of Next Opt, will introduce processes aimed at practical implementation, incorporating actual case studies from manufacturing sites. We hope you will envision the "potential for AI utilization in your company" and take home hints that will lead to improvements in your operations starting tomorrow. We look forward to your participation.