【Ideal for Anoxic Material Deposition!!!】 Vacuum Deposition Device HEX-GB Compatible with Glove Boxes 【For Lithium-Ion Batteries and More】

A versatile vacuum deposition device that allows for flexible configuration changes like assembling blocks | Sputtering, resistance heating deposition, electron beam deposition, organic deposition.

The HEX system features a unique "modular structure." By exchanging the panels that make up each face of the hexagonal prism-shaped chamber, you can freely change the number and arrangement of ports. As a result, you can easily modify the configuration and expand functionality, much like assembling blocks, in response to changes in research direction. The HEX system is a compact and highly expandable vacuum deposition device that fills the gap between benchtop systems and UHV systems, based on a new concept. ◆ The "modular structure" allows for flexible changes to the system configuration ◆ Supports sputtering, resistance heating deposition, electron beam deposition, and organic deposition ◆ Supports simultaneous film formation from multiple sources ◆ Compatible with sample rotation, heating, and water cooling ◆ Can be equipped with a film thickness monitor ◆ Compact design with a footprint of 60cm x 60cm ◆ Excellent expandability and maintainability ◆ Compatible with glove boxes (for lithium-ion batteries, etc.) For more details, please refer to the catalog available for download as a PDF. If you have any questions, please feel free to contact us.

• Sputtering Equipment

Multi-purpose vacuum deposition device HEX system RF & DC sputtering source

This is a sputtering source for the multi-purpose vacuum deposition device HEX/HEX-L. It can be used in DC mode when the target is a conductor and in RF mode when the target is an insulator. With a gas hood as standard equipment, it is possible to increase the pressure near the target surface while keeping the chamber pressure low during film formation. Quick-release connectors are used for the connections of cooling water piping and gas piping, allowing for easy installation and removal of the piping without the need for tools. The Fission source can be fixed to the chamber with four butterfly nuts, eliminating the need for tools during installation and removal. It also supports reactive sputtering, enabling the deposition of oxides and nitrides. Up to three deposition sources can be installed on the HEX and up to six on the HEX-L, allowing for the deposition of multilayer films and compound films.

• Sputtering Equipment

Resistance heating evaporation source for the multi-purpose vacuum deposition device HEX system.

This is a resistance heating evaporation source for the multi-purpose vacuum deposition device HEX/HEX-L. The resistance heating evaporation method is the most common vacuum deposition process. Materials are placed in a boat-type or crucible-type heating container, and by passing current through the heating container, resistance heat is generated to heat the materials. Once the temperature of the heating container rises sufficiently, the materials inside begin to evaporate. The deposition rate can be controlled by the current. The advantage of the resistance heating evaporation device is that it does not use process gases. Therefore, it operates at high vacuum levels, resulting in deposited films containing very few impurities. The TES source is fixed to the chamber with four butterfly nuts. Additionally, the cooling water piping is connected via quick-release connectors, allowing for quick replenishment of materials or replacement of boats/filaments. Up to five TES sources can be installed on the HEX, and up to six on the HEX-L. They can also be used in combination with the sputter source Fission, the electron beam evaporation source TAU, and the organic evaporation source ORCA.

• Sputtering Equipment

Multi-purpose vacuum deposition device for HEX system with 1-source and 4-source electron beam deposition sources.

This is an electron beam evaporation source for the multi-purpose vacuum deposition device HEX/HEX-L. The TAU series is a "mini" electron beam evaporation source. By using TAU, the HEX system can be utilized as an electron beam evaporation device (EB evaporation device). The material is heated by applying high voltage to it and accelerating thermal electrons emitted from a filament located right next to it to collide with the material. Unlike large electron beam evaporation sources, it does not use electron beam deflection magnets. Each pocket of the TAU source is equipped with a "flux monitoring plate" as standard, which detects the slight ions contained in the vapor. The ion current value detected here is proportional to the deposition rate and is sensitive enough to precisely grow sub-monolayer films. The TAU-4, which is a simultaneous deposition model with four sources, has independent flux monitoring plates in each of the four pockets, allowing for monitoring of the deposition rate in each pocket during simultaneous deposition. The TAU source can deposit from either a rod or a crucible, depending on the material. We can suggest the optimal deposition method, so please feel free to contact us.

• Sputtering Equipment

Organic deposition source for the multipurpose vacuum deposition device HEX system.

This is an organic deposition source for the multi-purpose vacuum deposition device HEX/HEX-L. By installing ORCA, the HEX system can be used as an organic material deposition device. The ORCA source actively cools the crucible. The balance between heating and cooling achieves excellent temperature stability and control. The crucible is made of a material with high thermal conductivity, preventing the occurrence of hotspots that could adversely affect the deposition rate. Alumina and graphite liners are also available. The temperature of the crucible is measured by a K-type thermocouple, allowing for more accurate temperature measurements than conventional contact thermocouples. ORCA comes with a power supply unit and a PID controller optimized for low-temperature operation. The ORCA source can be used in combination with sputter sources, electron beam deposition sources, and resistance heating deposition sources. The area around the crucible is covered with a cooled protective cap, minimizing thermal interference from adjacent sources.

• Sputtering Equipment

Multipurpose Vacuum Deposition Device HEX System Sample Stage | Fixed, Rotating, Rotating Heating, Rotating Water Cooling

This is a sample stage for the multi-purpose vacuum deposition device HEX/HEX-L. Choosing the correct sample stage is as important as selecting the right film formation method. The characteristics of the sample stage affect uniformity, morphology, and film composition. It accommodates samples with a maximum diameter of 4 inches for HEX and 6 inches for HEX-L. In addition to the standard fixed sample stage, rotating, rotating heated, and rotating water-cooled sample stages are available.

• Sputtering Equipment

Finally, the long-awaited JBC brand soldering equipment direct sales online store has been launched. Free shipping nationwide in Japan, and all products of the JBC brand are available for purchase. More than 10 types of soldering tips, with quantity discounts for over 50. From the latest model compact stations to consumables, please be sure to visit our website.

The time for celebration has come! The new production hall has started operations! While finishing work continues in other parts of the building, metal shavings are already being produced in the first machining center. Last Friday afternoon, employees and their families, along with companies involved in the construction, gathered to celebrate the achievements so far. Cold drinks, hot barbecue, and an ice cream stand were provided. During the celebration, many employees had the opportunity to tour the entire new building for the first time. Visitors were introduced to the new machines and improved logistics through guided tours of the production area. The new training room, the training center on the upper floor, and the latest conference room for customers were also unveiled. With this new building, Volkmann GmbH has secured an additional 4,500 square meters of production space. This expansion was very important, as the existing hall had already reached its limits due to the company's ongoing growth and increased production volume.

▶Issue: Before further processing the powder in the next stage (such as packaging machines), it is necessary to inspect for the presence of metal foreign objects using a metal detector. To achieve high sensitivity, the powder needs to be inspected through free fall, but due to low ceiling height and operational inconvenience, it is not possible to install the metal detector in the next stage. ▶Solution: The CEIA metal detector will be installed under a Volkmann vacuum conveyor and on a Volkmann mobile lift. The height-adjustable lift will allow the product discharge outlet of the metal detector to be adjusted to the appropriate height for the mobile container. Additionally, the vacuum conveyor can be lowered to a height that allows the mobile lift to pass through doors. The powder will be transported, for example, from an IBC container to the mobile lift and then to the metal detector via vacuum transfer. Metal foreign objects will be sorted and collected in a separate bottle. The inspected powder will be collected in a mobile container. Another vacuum conveyor is installed for the next stage, such as the packaging machine, from which the powder will be drawn from this container. Inspection and separation of metal parts can be conducted very close to the next stage, and it is also possible in more distant production areas.

The video shows that there is a tank at the bottom of the vacuum conveyor, and steam is constantly being released (in a simulated manner). If no measures are taken, the steam will enter the inside of the vacuum conveyor, condense into water droplets, and cause powder adhesion. Both our company and our customers have been troubled by such installations. This time, with the special module jointly developed with Minato Engineering Co., Ltd., we have succeeded in blocking the rising steam. From around the middle of the video, you can see that this function is turned on. You should be able to understand that the steam that was previously rising has disappeared. As a result, it has become possible to install equipment in a steam atmosphere, which was previously difficult to do, with peace of mind.

【Period: Ongoing until October 31, 2025】 For orders of 10 pieces or more: Dry T-shirt 1 piece @1,800 yen (tax included) Dry Polo Shirt 1 piece @2,300 yen (tax included) (Includes garment and one print location) For sizes 3L and above, an additional 550 yen An additional 550 yen for each additional print location Design and data production fees are required separately. (No fee if submitting complete data) We accept orders for various purposes such as events, teams, goods, souvenirs, and gifts, from one piece to mass production. We also have many other garments not listed. Please feel free to inquire.