【High Scalability & High Maintainability】Compact Electron Beam Evaporation System / EB Device HEX-TAU【Ideal for R&D!】

A versatile vacuum deposition device that allows for flexible configuration changes like assembling blocks | Sputtering, resistance heating deposition, electron beam deposition, organic deposition.

The HEX system features a unique "modular structure." By exchanging the panels that make up each face of the hexagonal prism-shaped chamber, you can freely change the number and arrangement of ports. As a result, you can easily modify the configuration and expand functionality, much like assembling blocks, in response to changes in research direction. The HEX system is a compact and highly expandable vacuum deposition device that fills the gap between benchtop systems and UHV systems, based on a new concept. ◆ The "modular structure" allows for flexible changes to the system configuration ◆ Supports sputtering, resistance heating deposition, electron beam deposition, and organic deposition ◆ Supports simultaneous film formation from multiple sources ◆ Compatible with sample rotation, heating, and water cooling ◆ Can be equipped with a film thickness monitor ◆ Compact design with a footprint of 60cm x 60cm ◆ Excellent expandability and maintainability ◆ Compatible with glove boxes (for lithium-ion batteries, etc.) For more details, please refer to the catalog available for download as a PDF. If you have any questions, please feel free to contact us.

• Sputtering Equipment

Multi-purpose vacuum deposition device HEX system RF & DC sputtering source

This is a sputtering source for the multi-purpose vacuum deposition device HEX/HEX-L. It can be used in DC mode when the target is a conductor and in RF mode when the target is an insulator. With a gas hood as standard equipment, it is possible to increase the pressure near the target surface while keeping the chamber pressure low during film formation. Quick-release connectors are used for the connections of cooling water piping and gas piping, allowing for easy installation and removal of the piping without the need for tools. The Fission source can be fixed to the chamber with four butterfly nuts, eliminating the need for tools during installation and removal. It also supports reactive sputtering, enabling the deposition of oxides and nitrides. Up to three deposition sources can be installed on the HEX and up to six on the HEX-L, allowing for the deposition of multilayer films and compound films.

• Sputtering Equipment

Resistance heating evaporation source for the multi-purpose vacuum deposition device HEX system.

This is a resistance heating evaporation source for the multi-purpose vacuum deposition device HEX/HEX-L. The resistance heating evaporation method is the most common vacuum deposition process. Materials are placed in a boat-type or crucible-type heating container, and by passing current through the heating container, resistance heat is generated to heat the materials. Once the temperature of the heating container rises sufficiently, the materials inside begin to evaporate. The deposition rate can be controlled by the current. The advantage of the resistance heating evaporation device is that it does not use process gases. Therefore, it operates at high vacuum levels, resulting in deposited films containing very few impurities. The TES source is fixed to the chamber with four butterfly nuts. Additionally, the cooling water piping is connected via quick-release connectors, allowing for quick replenishment of materials or replacement of boats/filaments. Up to five TES sources can be installed on the HEX, and up to six on the HEX-L. They can also be used in combination with the sputter source Fission, the electron beam evaporation source TAU, and the organic evaporation source ORCA.

• Sputtering Equipment

Multi-purpose vacuum deposition device for HEX system with 1-source and 4-source electron beam deposition sources.

This is an electron beam evaporation source for the multi-purpose vacuum deposition device HEX/HEX-L. The TAU series is a "mini" electron beam evaporation source. By using TAU, the HEX system can be utilized as an electron beam evaporation device (EB evaporation device). The material is heated by applying high voltage to it and accelerating thermal electrons emitted from a filament located right next to it to collide with the material. Unlike large electron beam evaporation sources, it does not use electron beam deflection magnets. Each pocket of the TAU source is equipped with a "flux monitoring plate" as standard, which detects the slight ions contained in the vapor. The ion current value detected here is proportional to the deposition rate and is sensitive enough to precisely grow sub-monolayer films. The TAU-4, which is a simultaneous deposition model with four sources, has independent flux monitoring plates in each of the four pockets, allowing for monitoring of the deposition rate in each pocket during simultaneous deposition. The TAU source can deposit from either a rod or a crucible, depending on the material. We can suggest the optimal deposition method, so please feel free to contact us.

• Sputtering Equipment

Organic deposition source for the multipurpose vacuum deposition device HEX system.

This is an organic deposition source for the multi-purpose vacuum deposition device HEX/HEX-L. By installing ORCA, the HEX system can be used as an organic material deposition device. The ORCA source actively cools the crucible. The balance between heating and cooling achieves excellent temperature stability and control. The crucible is made of a material with high thermal conductivity, preventing the occurrence of hotspots that could adversely affect the deposition rate. Alumina and graphite liners are also available. The temperature of the crucible is measured by a K-type thermocouple, allowing for more accurate temperature measurements than conventional contact thermocouples. ORCA comes with a power supply unit and a PID controller optimized for low-temperature operation. The ORCA source can be used in combination with sputter sources, electron beam deposition sources, and resistance heating deposition sources. The area around the crucible is covered with a cooled protective cap, minimizing thermal interference from adjacent sources.

• Sputtering Equipment

Multipurpose Vacuum Deposition Device HEX System Sample Stage | Fixed, Rotating, Rotating Heating, Rotating Water Cooling

This is a sample stage for the multi-purpose vacuum deposition device HEX/HEX-L. Choosing the correct sample stage is as important as selecting the right film formation method. The characteristics of the sample stage affect uniformity, morphology, and film composition. It accommodates samples with a maximum diameter of 4 inches for HEX and 6 inches for HEX-L. In addition to the standard fixed sample stage, rotating, rotating heated, and rotating water-cooled sample stages are available.

• Sputtering Equipment

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is kept to a minimum. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

＼ Logistics Solutions Featured in "Logistics Special" ／ Starting today, our logistics solutions are featured in the "Logistics Special" section of Ipros Monozukuri. In this feature, we introduce challenges and considerations related to packaging and packing processes, as well as tips for on-site improvements. This content is useful for a wide range of individuals, from those in the information-gathering stage to those actively considering implementation. If you are considering a review or improvement of your packaging and packing processes, please take this opportunity to check it out. Furthermore! ＼ Significant Expansion of Product Pages ／ In conjunction with the feature in the Logistics Special, we have expanded the content of our product pages. To make it easier for customers to consider solutions tailored to their challenges and processes, we have organized the solution structures and related products and options. We encourage you to utilize this as concrete material for improving your packaging and packing processes. If you have any questions, please feel free to contact us. Thank you very much for your continued support.

The non-contact beam touch sensor "HA-T401/HA-T520" has a compact detection range, making it an ideal automatic door sensor for installation on automatic doors facing narrow corridors or busy streets. Depending on the application and installation location, you can choose between "non-vision mounting type" and "non-vision built-in type." 【Features】 ● With the beam touch sensor, you can open and close the automatic door simply by bringing your hand close without touching it, ensuring hygiene. ● Depending on the installation environment, such as single sliding or bi-parting doors, the detection range can be set in four ways: left, center, right, with 4 spots and 12 spots settings. ● Two types of activation row settings are available to reduce unnecessary opening and closing of the automatic door due to cross traffic, contributing to energy-saving effects. ● The touch switch and infrared sensor are integrated, allowing for a switch between beam touch and infrared sensor modes with a single model. 【Recommended for such places!】 ☑ Entrances facing busy corridors ☑ Counters or signs near the door ☑ Buildings facing narrow corridors ☑ Buildings that prioritize aesthetics ☑ Hospitals and facilities that consider hygiene ☑ Large facilities with many doors ◎ For more details, please download the materials or contact us.

Membrane-Solutions LLC will be conducting a limited-time campaign for its filter products. Campaign Period: December 2, 2024 (Monday) to March 31, 2025 (Monday) During the campaign, the following products will be sold at special prices: - Membrane filters - Filter vials * Syringe filters and custom products are not included in the campaign. Samples of the eligible products are also available. For more details, please check the special page on our website. Special page URL: https://www.daichem.co.jp/products/hplc_accessory/ms_filter_campaign.html/