We will be exhibiting at the M-tech Mechanical Components Technology Exhibition from March 16 to 18, 2022.

Rich experience in joining dissimilar metals such as aluminum and stainless steel, copper and stainless steel! Numerous achievements in heat sinks for heat dissipation and cooling applications!

Yamatech's diffusion bonding (thermal pressing) technology can react and bond a variety of materials, including similar metals and dissimilar metals, at the atomic level using heat. The compatible materials include a wide range, starting with "stainless steel (SUS)", as well as "nickel-based (Ni)", "copper-based (Cu)", "aluminum (Al)", "titanium (Ti)", and many others. Additionally, there are many achievements in bonding dissimilar metals, but there are certain conditions that apply, so please feel free to contact us. This technology is suitable for applications such as heat sinks. ■ Dissimilar metals that can be bonded - A5000 series + SUS304, C1020 - A6000 series + SUS304, C1020 - SKD61 + C1020, beryllium copper and others * For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing

Diffusion bonding for joining metals! There are also examples of its application in fuel cell separators with complex flow path patterns and filters for food manufacturing, which cannot be achieved through cutting processes!

Layered diffusion bonding is a method of joining layered materials by applying pressure and heat in a vacuum furnace. Due to the small deformation on the order of micrometers, it is suitable for machining parts with fine flow paths and complex shapes. ■ Application examples for fuel cell separators - Capable of accommodating complex flow path patterns that cannot be achieved through cutting processes - Stable quality due to the simultaneous bonding of multiple products - Complex part shapes can be created through layering - Strong against changes and deformation of parts as no adhesives are used - Simplification of the manufacturing line and reduction of time - Achieves flow paths without gaps at the bonding surfaces, resulting in no losses ■ Application examples for filters used in food manufacturing - Material: SUS316 - Dimensions: φ25×t1.5 - Layer composition: 50μm×30 layers - Mesh dimensions: φ75μm (inner) to φ100μm (outer) taper * For more details, please refer to the PDF document or feel free to contact us.

• Mold Design
• Other molds
• Contract manufacturing

Design complex curved flow paths (cooling circuits) within molds using diffusion bonding technology. This enables reduced molding time and cost savings through high-cycle molding!

Conventional molds can only process linear flow paths, making it difficult to arrange the flow paths evenly on the molding surface. By using Yamatec's diffusion bonding technology, it has become possible to process molds in a sliced plate form, allowing for the design of curved flow paths that can be evenly arranged on the molding surface by stacking the processed components from each plate and diffusion bonding them together. The creation of molds with internal cooling channels, which was difficult with traditional mold manufacturing methods like "cutting" or "casting," can now be achieved using diffusion bonding! It is also possible to manufacture "sprue bushes" that realize "high-cycle molding" with diffusion bonding technology! **Features** - Rapid cooling without unevenness in the product - Significant reduction in cooling time - Improved quality in product appearance, precision, strength, etc. - Increased production efficiency and reduced production costs *For more details, please refer to the PDF document or feel free to contact us.*

• Mold Design
• Other molds
• Contract manufacturing

In this seminar, we will briefly explain various methods and technologies for creating plastic molds using metal 3D printers, key points and considerations in manufacturing, and examples of fabrication. Following that, we will hear from leading users utilizing metal 3D printers from EOS, 3D Systems, Sodick, and Matsuura Machinery on advanced mold manufacturing technologies and examples, as well as factors for failure and secrets to success. First, we will discuss case studies that have achieved low-cost, high-quality manufacturing techniques and shortened lead times through complex shapes and integrated structures, hybrid manufacturing, and 3D cooling water pipe fabrication using EOS metal 3D printers at J-3D. Next, we will explain how ODEC has achieved overwhelming reductions in delivery times and cost savings in mold updates by manufacturing complex molds for resin molding with metal 3D printers, along with the latest fabrication examples and technologies for designing internal structures (3D water pipes), flow, and temperature simulations. Finally, we will provide specific explanations of how Sanko Gosei, a top player in the industry with its metal 3D printing capabilities for plastic mold manufacturing, has drastically reduced mold cooling times through 3D cooling water pipe fabrication, and how porous structures have effectively mitigated issues such as short shots and gas burn, as well as examples of reduced injection times.

In recent years, the costs of DX (digital transformation) have significantly decreased, and various examples of improving operational efficiency and automation in small and medium-sized manufacturing industries have emerged. One of the key points where DX has not yet progressed, but can achieve high efficiency at low cost, is the DX of the entire process from information collection and management on-site to application. In this seminar, we will introduce practical methods for promoting DX using two tools that can be actually utilized in the field of small and medium-sized manufacturing: the workflow system "AppRemo" that streamlines application approval processes, and the no-code tool "Platio" that allows for the creation of mobile apps to manage on-site operations. There is no need for complex system development or high investments. We will discuss specific plans for gradually advancing automation in an environment that can be easily operated by everyone on-site, along with case studies.

We will be exhibiting at FOOD Exhibition 2025, which will be held at Tokyo Big Sight from October 15 to 17, 2025. *The exhibition will take place within the booth of our partner company, Anritsu Corporation. We plan to showcase the taste recognition device TS-6000A on that day. Details are as follows: ◆ Event Details ・Date: October 15 (Wednesday) to 17 (Friday), 2025, 10:00 AM to 5:00 PM ・Venue: Tokyo Big Sight, East Hall ・Booth Number: To be determined (exhibiting at Anritsu Corporation's booth) ・Exhibition Content: Display and demonstration of the TS-6000A ・Official Website: https://www.food-exhibition.info/

This is a seminar hosted by our company that takes place every October. This year, three speakers will give presentations on the use of taste sensors and measurement examples. It has been decided to hold it on October 3rd. This year, it will also be held online (Zoom webinar). As soon as the details are finalized (around mid-September), we will announce the overview and open registration on our company website.

In the manufacturing and infrastructure industries, many on-site tasks such as maintenance, inspection, and testing still rely heavily on paper forms and manual data entry, with many sites not progressing in the digitalization and centralization of information. As a result, challenges such as "inability to grasp the on-site situation in real-time," "data being dispersed and not usable for analysis," and "input errors and omissions in forms" have become apparent. This webinar will introduce how to achieve digital transformation (DX) of on-site operations by rapidly building smartphone business applications using Asteria's no-code tool "Platio," and combining it with Morpho AI Solutions' AI-OCR, image analysis, and LLM technologies for the digitalization and automatic analysis of inspection sheets, photos, and reports. It is tailored for representatives of manufacturing and infrastructure-related companies who want to fundamentally change their on-site operations, escape from an analog culture, but find large-scale system implementation challenging.