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  4. We will be exhibiting at the M-tech Mechanical Components Technology Exhibition from March 16 to 18, 2022.
SEMINAR_EVENT
  • Mar 03, 2022
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Mar 03, 2022

We will be exhibiting at the M-tech Mechanical Components Technology Exhibition from March 16 to 18, 2022.

ヤマテック ヤマテック
Yamatec Co., Ltd. will be exhibiting at the "M-tech Mechanical Elements Technology Exhibition" held at Tokyo Big Sight from March 16 to 18, 2022. This time, our exhibition theme is "The Possibilities of Diffusion Bonding." We will showcase data from joining tests of dissimilar materials and bonded products after microfabrication. Please feel free to stop by our booth. We look forward to seeing you.
Date and time Wednesday, Mar 16, 2022 ~ Friday, Mar 18, 2022
10:00 AM ~ 06:00 PM
Only on the final day, it will end at 17:00.
Capital ■Venue: Tokyo Big Sight ■Address: 3-11-1 Ariake, Koto-ku, Tokyo ■Access  ・About a 7-minute walk from "Kokusai Tenjijo Station" on the Rinkai Line  ・About a 3-minute walk from "Tokyo Big Sight" on the Yurikamome Line ■Booth Number: B1-80 ■Invitation tickets can be obtained from the following URL. https://www.japan-mfg.jp/ja-jp/visit/e-ticket-ex/mtech.html?co=ml_mtechh-h-96ykpr
Entry fee Free One invitation ticket is required for each person for entry. If you do not have an invitation ticket, the admission fee is 5,000 yen per person.
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Joining of dissimilar metals by diffusion bonding [for heat sink applications such as heat dissipation]

Rich experience in joining dissimilar metals such as aluminum and stainless steel, copper and stainless steel! Numerous achievements in heat sinks for heat dissipation and cooling applications!

Yamatech's diffusion bonding (thermal pressing) technology can react and bond a variety of materials, including similar metals and dissimilar metals, at the atomic level using heat. The compatible materials include a wide range, starting with "stainless steel (SUS)", as well as "nickel-based (Ni)", "copper-based (Cu)", "aluminum (Al)", "titanium (Ti)", and many others. Additionally, there are many achievements in bonding dissimilar metals, but there are certain conditions that apply, so please feel free to contact us. This technology is suitable for applications such as heat sinks. ■ Dissimilar metals that can be bonded - A5000 series + SUS304, C1020 - A6000 series + SUS304, C1020 - SKD61 + C1020, beryllium copper and others * For more details, please refer to the PDF document or feel free to contact us.

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Examples of applications for diffusion bonding: fuel cell separators, filters for food manufacturing, etc.

Diffusion bonding for joining metals! There are also examples of its application in fuel cell separators with complex flow path patterns and filters for food manufacturing, which cannot be achieved through cutting processes!

Layered diffusion bonding is a method of joining layered materials by applying pressure and heat in a vacuum furnace. Due to the small deformation on the order of micrometers, it is suitable for machining parts with fine flow paths and complex shapes. ■ Application examples for fuel cell separators - Capable of accommodating complex flow path patterns that cannot be achieved through cutting processes - Stable quality due to the simultaneous bonding of multiple products - Complex part shapes can be created through layering - Strong against changes and deformation of parts as no adhesives are used - Simplification of the manufacturing line and reduction of time - Achieves flow paths without gaps at the bonding surfaces, resulting in no losses ■ Application examples for filters used in food manufacturing - Material: SUS316 - Dimensions: φ25×t1.5 - Layer composition: 50μm×30 layers - Mesh dimensions: φ75μm (inner) to φ100μm (outer) taper * For more details, please refer to the PDF document or feel free to contact us.

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"Sprue Bush" achieved "high-cycle molding" with diffusion bonding technology.

Design complex curved flow paths (cooling circuits) within molds using diffusion bonding technology. This enables reduced molding time and cost savings through high-cycle molding!

Conventional molds can only process linear flow paths, making it difficult to arrange the flow paths evenly on the molding surface. By using Yamatec's diffusion bonding technology, it has become possible to process molds in a sliced plate form, allowing for the design of curved flow paths that can be evenly arranged on the molding surface by stacking the processed components from each plate and diffusion bonding them together. The creation of molds with internal cooling channels, which was difficult with traditional mold manufacturing methods like "cutting" or "casting," can now be achieved using diffusion bonding! It is also possible to manufacture "sprue bushes" that realize "high-cycle molding" with diffusion bonding technology! **Features** - Rapid cooling without unevenness in the product - Significant reduction in cooling time - Improved quality in product appearance, precision, strength, etc. - Increased production efficiency and reduced production costs *For more details, please refer to the PDF document or feel free to contact us.*

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[Production Example] Yamatec Co., Ltd. Diffusion Bonding

[Production Example] Yamatec Co., Ltd. Diffusion Bonding

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[Notice] For the grain and feed industry, as well as public research institutions: Open house and various seminars for the industry (6/18 in Kobe)

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We are pleased to offer everyone the opportunity to view Foss analysis equipment at Foss Japan. In this open house, we aim to provide information to a wide audience, including tips for selecting analysis equipment and ways to further utilize the equipment you are currently using. We have planned a comprehensive seminar for those who wish to deepen their knowledge about future analysis, as well as for those seeking information on selecting analysis equipment. Additionally, we will have various NIR devices on display, and it will be possible to measure samples you bring with you. Of course, we also welcome visitors who only wish to tour the equipment! We sincerely look forward to your participation. ■ Date: June 18, 2026 (Thursday) 11:00 AM – 4:30 PM (Reception starts at 10:45 AM) ■ Venue: Kobe International Conference Center, Seminar House Room 702 / Some online participation available ■ Overview: - Greetings and introduction of Foss product lineup *Online participation available - Basics of NIR and selecting the optimal model *Online participation available - Demonstration of calibration software FossCalibrator: Let's create a calibration curve *On-site only - Sample measurement and open house *On-site only For more details, please check the PDF.

Apr 16, 2026

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Notice of Participation in the 27th Interphex Week Tokyo from July 9 (Wednesday) to July 11 (Friday), 2025

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Central Science Co., Ltd. will be exhibiting in the Process Inspection and Measurement Zone at the "27th Interphex Week Tokyo" held at Tokyo Big Sight. At our booth, we will focus on products under the Sievers brand, showcasing measuring instruments used for pharmaceutical water management. - Products to be displayed: "Online TOC Analyzer Sievers M500" "Laboratory TOC Analyzer Sievers M9" "Endotoxin Analyzer Sievers Eclipse" "Bio-Burden Rapid Analysis Device Sievers Soleil," among others. Additionally, we plan to hold a seminar at the exhibitor seminar venue on the theme "How to streamline manufacturing processes while ensuring the quality of pharmaceutical water?" We sincerely look forward to your visit.

Apr 16, 2026

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April 21 - Otsuka Corporation presents Canon Selection 2026

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On Tuesday, April 21, at Iidabashi, paperlogic will have a booth at "Canon Selection 2026." The theme of this event is "Paper Output × Data Utilization." It is a comprehensive exhibition filled with hints to promote DX in the office and achieve operational efficiency. At the venue, there will be the latest "Security Measures Seminar" to protect companies from supply chain attacks, as well as programs like creating promotional flyers that anyone can make, "Super Easy! PDF Utilization Techniques" to alleviate daily frustrations, and "Paperless Fax Experience" to support remote work, all aimed at solving on-site challenges. From paperlogic, we will introduce the 【paperlogic Electronic Contract】 as a solution for "Document Management and Back Office Digitization." We will have actual operation demonstrations at our booth and will directly address your concerns regarding document management. We also have special plans exclusively for Otsuka Corporation, so please come and visit us.

Apr 15, 2026

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[Seminar] Optical-Electronic Fusion Supporting Next-Generation Communication Infrastructure in the AI Era

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[Speaker] Mr. Yoshihiro Mori, Consultant, Communication Media and High-Tech Strategy Group, Research and Consulting Division, Japan Research Institute, Ltd. [Key Lecture Content] Against the backdrop of the proliferation of generative AI, securing power and communication performance has become a critical management issue in data centers. This lecture will explain the trends of IOWN/APN, which is gaining attention as a concept to overcome these constraints, as well as CPO (Co-Packaged Optics), the core technology supporting its implementation. Furthermore, after organizing the differences in player structures between overseas and Japan, we will consider strategies for Japan to secure leadership based on its position in specification formation and standardization. [Lecture Items] 1. Data Center Market Structure in the AI Era 2. Overview of IOWN/APN and Its Impact on Data Centers 3. Overview of Co-Packaged Optics (CPO) 4. Domestic and International Player Structures Surrounding Co-Packaged Optics 5. Trends in the Standardization of Co-Packaged Optics 6. Consideration of Japan's Co-Packaged Optics Strategy 7. Q&A / Business Card Exchange

Apr 15, 2026

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[Seminar] Prospects for the Japan-U.S. Autonomous Driving Business

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[Key Lecture Content] 1. Trends in Autonomous Driving Centered on the United States and Strategic Insights President and CEO of Venture Client Co., Ltd. Masayuki Kimura, Executive Officer and Senior Managing Director of SOMPO Holdings, Inc. 1. Overview of the Autonomous Driving Market 2. Trends in Robo-Taxis 3. Trends in Autonomous Driving Trucks (Logistics) 4. Trends in Autonomous Driving for Private Cars and ADAS 5. Impact of Open Models 6. Strategic Considerations 7. Q&A 2. Recent Trends in Autonomous Driving in Our Country - From Demonstration to Implementation - Masahiro Hayashi, Department Manager of Consulting Planning at Daiwa Institute of Research, Ltd. 1. Introduction 2. Evolution of Regulations and Systems 3. Technology Trends 4. Case Studies and New Business Models in Private Enterprises 5. Real Economic Effects and Regional Revitalization 6. Future Outlook - Towards 2030 7. Q&A

Apr 15, 2026

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