Notice of participation in "INTERMOLD Nagoya / Mold Exhibition Nagoya" from July 6 (Wednesday) to July 9 (Saturday), 2022.

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The protective coating agent for electronic substrates, "FloroSurf FG-3650 Series," is suitable for waterproofing and insulation protection of electronic components, as well as for moisture-proof and waterproof coating (conformal coating) of mounted substrates. ▼ Excellent performance of FloroSurf FG-3650 Series High moisture and waterproof properties / Resistance to lithium battery electrolyte / Acid resistance and resistance to oxidizing gases High insulation resistance and low dielectric constant / Non-flammable and non-hazardous ~ We are offering free samples exclusively for corporate clients! ~ Please select "Request Sample" from the [Contact Button] below.

• Coating Agent

High release properties, compatible with nano-level surface shapes and nano-imprinting "FloroSurf" - Easy application with brushes or sprays.

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• Other molds

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely invite you to visit us during this busy time. 【 Exhibition Name 】 Automotive Technology Exhibition 2025 YOKOHAMA https://aee.expo-info.jsae.or.jp/ja/yokohama/ (An "online exhibition" will also be held during and around the event period) 【 Dates 】 May 21 (Wednesday) - 23 (Friday), 2024 10:00 AM - 6:00 PM *On the final day, 9:00 AM - 4:00 PM (Online exhibition: May 14 (Wednesday) - June 4 (Wednesday)) 【 Venue 】 Pacifico Yokohama (1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa Prefecture) Our booth number: "Concourse 505"

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to attend this event. 【 Exhibition Name 】 27th INTERPHEX Week Tokyo https://www.interphex.jp/tokyo/ja-jp.html 【 Dates 】 July 9 (Wednesday) - 11 (Friday), 2025 10:00 AM - 5:00 PM 【 Venue 】 Tokyo Big Sight (3-11-1 Ariake, Koto-ku, Tokyo 135-0063)

[Lecturer] Taku Ito, Partner, Mori Hamada & Matsumoto Foreign Law Joint Enterprise Yoshifumi Nagakubo, Senior Associate [Key Lecture Content] As we move towards a carbon-neutral society, the large-scale introduction of renewable energy sources is progressing, making the enhancement of market design that balances stable electricity supply and economic efficiency an urgent issue. In this context, the "simultaneous market," which integrates the trading of electricity (kWh) and adjustment capacity (ΔkW), is being discussed as a core component of future electricity systems, and serious considerations for its implementation are underway. In this lecture, a lawyer who has led discussions at the forefront of national system design will explain in an easy-to-understand manner the background and necessity of the simultaneous market, as well as the overall picture of its complex mechanisms, based on practical experience. Furthermore, the lecture will clearly outline the latest developments in current discussions, realistic challenges for implementation, and prospects for future electricity business in Japan, incorporating perspectives and insights as a system designer and practitioner.

[Instructor] Hirokazu Shibata, President and CEO of ZAZU Design Co., Ltd. [Key Lecture Content] As the importance of heat dissipation design increases in daily operations, it is necessary to study a range of books on thermal engineering to learn the overall picture of heat dissipation design. However, books on thermal engineering typically start with the basics of heat transfer and cover topics such as temperature boundary layers and dimensionless numbers related to heat transfer, making it quite difficult for beginners to grasp the overall picture in a short period. This seminar is aimed at engineers who will begin thermal design in the future, focusing on various heat dissipation devices as specific subjects. The goal is to understand the basics of thermal design while learning about the characteristics and usage of these heat dissipation devices. After attending this seminar, participants are expected to acquire knowledge equivalent to that gained from studying a range of thermal engineering books. [Lecture Topics] 1. Current Status and Challenges of Thermal Design 2. How "Thermal Resistance" Determines Heat Dissipation Pathways 3. Fundamental Laws Governing Heat Transfer 4. Air Cooling through Heat Transfer 5. Heat Diffusion through Thermal Conduction 6. Heat Transfer via Two-Phase Flow of Gas and Liquid 7. Q&A Session

[Lecturers] Accenture Ltd. Business Consulting Division Strategy Group, Technology Strategy Senior Manager Mamoru Yoneshige Accenture Ltd. Technology Consulting Division CDAI Consulting Principal Director Hiromichi Sugiyama [Key Lecture Content] While system development using AI agents is gaining attention, the challenges of AI-driven development in brownfield projects for enterprises with existing assets and technical debt are significantly greater. The introduction of coding support tools alone does not lead to company-wide transformation, and there exists a structural gap between the success of Proof of Concept (PoC) and the success of company-wide deployment. In this lecture, based on practical insights from Accenture's comprehensive support from strategy formulation to implementation, we will systematically explain the essentials for successful company-wide deployment, including the six principles of AI-driven development, categorization of brownfield types and deployment strategies, context engineering, the systematization of methodologies such as harness engineering and specification-driven approaches, promotion systems and in-house production strategies, and KPI design as a management agenda.