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  1. Home
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  3. ピュアオンジャパン
  4. Our products for SiC have been featured in the magazine "Compound Semiconductor"!
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  • Jun 17, 2022
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Jun 17, 2022

Our products for SiC have been featured in the magazine "Compound Semiconductor"!

ピュアオンジャパン ピュアオンジャパン
Our products have been featured on the cover of the globally acclaimed magazine "Compound Semiconductor," which is widely read in the semiconductor industry. The article introduces products for the next-generation semiconductor "SiC (Silicon Carbide)," which is gaining attention for its high power and miniaturization in electronics, starting with electric vehicles. Although it's in English, please feel free to take a look: https://compoundsemiconductor.net/article/114825/The_Secret_Sauce_Of_Silicon_Carbide We also welcome inquiries regarding our products for SiC. Please feel free to contact us.
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IRINO-PROSiC.jpg

Metal composite material grinding pad "IRINO": Enhancing the performance of existing grinding machines.

Achieves high polishing rates and excellent surface finish on materials such as SiC and sapphire!

At Pureon, we propose a rapid thinning process that combines IRINO-PROSiC and diamond slurry PURE-DS-RT for high-speed grinding of SiC wafers, achieving significant cost reductions compared to conventional processing methods. This innovative combination not only ensures excellent surface quality but also guarantees a high processing rate, making it suitable for applications that require a smooth transition to the CMP process. The back side features a self-adhesive tape, allowing IRINO-PROSiC to be easily attached to existing metal plates, enhancing the usability and efficiency of SiC grinding tools. Whether you seek superior surface quality or high processing rates, IRINO-PROSiC is the ideal product for advanced SiC processing. 【Features】 ■ Innovative grinding pad suitable for the Rapid Thinning process ■ Optimal for grinding SiC ■ Surface finish at Ra 1 nm level ■ Highly competitive compared to conventional grinding processes ■ Flat finish that does not cause edge surface degradation ■ Usable on single-sided/double-sided polishing machines with flat plates (dressing required)

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WSG ロゴ入り.JPG

Diamond slurry for wire saw "WSG": Glycol-based

Glycol-based diamond slurry that improves cutting speed and achieves high reproducibility for multi-wire saws. Water-soluble, easy to clean, and environmentally friendly!

WSG is a glycol-based diamond slurry suitable for high-performance multi-wire saws. It can be used immediately upon arrival. Our unique additives promote adhesion between the slurry and the wire, enhancing cutting speed. 【Features】 ■ Tailor-made specifications You can freely choose the type of diamond, particle size, and concentration. ■ High polishing rate It has optimal adhesion to the wire, maintaining a high polishing rate. ■ High reproducibility Thanks to our unique formulation, no dispersion processing is required. ■ Water-soluble, environmentally friendly, and easy to maintain *For more details, please feel free to contact us.

  • Wafer processing/polishing equipment
  • Other semiconductor manufacturing equipment
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OPW ロゴ入り.JPG

Water-based diamond suspension "OPW": Slurry for optical materials

Slurry formulated with a formula that achieves excellent polishing results for various optical materials such as fluorite!

OPW is a water-soluble diamond suspension designed for final polishing of optical components, ceramics, metals, and more. It can be used immediately upon arrival. The OPW suspension delivers optimal performance in finishing processes from 3 microns to 0.1 microns. We offer products suitable for polishing on pads and pitch plates/PU foils. 【Features】 ■ Tailor-made specifications You can freely choose the type of diamond, grain size, and concentration. ■ Aggregate-free processing Excellent usability due to reliable dispersion. ■ Maintains a high polishing rate through cooling and lubrication. ■ Environmentally friendly and easy to maintain. *For more details, please feel free to contact us.

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Related catalog(4)

【WSG】Diamond Slurry_Glycol-based_Multi-wire Saw Use

【WSG】Diamond Slurry_Glycol-based_Multi-wire Saw Use

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Pure On Japan Co., Ltd. Company Profile

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IRINO Metal Composite Material Grinding Pad

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[OPW] Diamond Slurry_Water-based_For Optical Components

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Fukuda's leak test, leak inspection, leak detection, leak test, integrity test.

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Fukuda Co., Ltd. has been pursuing leak detection for 60 years and is committed to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing properties. We will propose the appropriate testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

Dec 22, 2025

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Notice of Winter Break

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Dear Sir/Madam, I would like to express my congratulations on the continued prosperity of your company. Thank you very much for your exceptional support. We would like to inform you that our company will be closed for winter holidays during the following period. We apologize for any inconvenience this may cause and kindly ask for your understanding. 1. Winter Holiday Period From Thursday, December 28, 2023, to Thursday, January 4, 2024. 2. Business Operations After the Winter Holiday Period We will resume normal operations from Friday, January 5, 2024.

Dec 22, 2025

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PFAS Regulation Countermeasures! ■■ Leak Test Equipment for Small Electronic Components|MSA-0101 series ■■ Does not use fluorinated inert fluids. PFAS-free. Offers accuracy equal to or better than liquid immersion testing.

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  • PRODUCT

● This is a leak testing device for small electronic components that does not use fluorinated inert liquids (PFAS-free). ● There is no longer a need for unstable visual confirmation through liquid immersion testing. It adopts a quantitative testing method that allows for stable pressure leak testing. ● It is a tabletop leak testing device specifically for gross leaks, with accuracy equal to or greater than that of liquid immersion testing. ● The detectable range is approximately 1×10⁻² Pa·m³/s to 1×10⁻⁶ Pa·m³/s (varies depending on the target product). ● It is suitable for sealed structures ranging from a few millimeters to a maximum of 80 × 70 mm. Please feel free to contact us for more information!

Dec 22, 2025

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Aluminum prototype: Lost wax casting sand mold layered 3D printer prototype.

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  • COMPANY

● The production time for casting prototypes can be shortened! Since model production is not required, the time needed to create prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly producing sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! With one molding process, different products with similar shapes or varying dimensions can be molded at the same time. This allows for the verification of multiple types in a short period.

Dec 22, 2025

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"Prototype casting, mass production, crack repair" We repair cracks in metal products without applying heat.

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  • CATALOG

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If you require a detailed technical explanation, please contact us.

Dec 22, 2025

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