Metal composite material grinding pad "IRINO": Enhancing the performance of existing grinding machines.
IRINO-PRO-SiC
Achieves high polishing rates and excellent surface finish on materials such as SiC and sapphire!
At Pureon, we propose a rapid thinning process that combines IRINO-PROSiC and diamond slurry PURE-DS-RT for high-speed grinding of SiC wafers, achieving significant cost reductions compared to conventional processing methods. This innovative combination not only ensures excellent surface quality but also guarantees a high processing rate, making it suitable for applications that require a smooth transition to the CMP process. The back side features a self-adhesive tape, allowing IRINO-PROSiC to be easily attached to existing metal plates, enhancing the usability and efficiency of SiC grinding tools. Whether you seek superior surface quality or high processing rates, IRINO-PROSiC is the ideal product for advanced SiC processing. 【Features】 ■ Innovative grinding pad suitable for the Rapid Thinning process ■ Optimal for grinding SiC ■ Surface finish at Ra 1 nm level ■ Highly competitive compared to conventional grinding processes ■ Flat finish that does not cause edge surface degradation ■ Usable on single-sided/double-sided polishing machines with flat plates (dressing required)
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basic information
【Product Specifications】 - Thickness: 1mm - Bonding Material: Resin Bond - Carrier Material: Polycarbonate - Diameter: 200 to 1,200 mm *Sizes larger than this will be provided in multiple pieces that are bonded together. - Back Processing: Self-adhesive tape
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■Main Uses SiC Wafer
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Microdiamant, which has contributed to customers through precision classification, has acquired the American CMP-related company Eminess Technology and has become Pureon. In addition to our high-quality diamond-related products, we will also accumulate in-house know-how regarding final finishing CMP. What is important for our customers is the final finish. Even now, we receive inquiries about our diamond polishing because customers want to shorten the CMP process time. In the future, we will comprehensively handle consultations from grinding and polishing to CMP.