Glycol-based diamond slurry that improves cutting speed and achieves high reproducibility for multi-wire saws. Water-soluble, easy to clean, and environmentally friendly!
WSG is a glycol-based diamond slurry suitable for high-performance multi-wire saws. It can be used immediately upon arrival. Our unique additives promote adhesion between the slurry and the wire, enhancing cutting speed. 【Features】 ■ Tailor-made specifications You can freely choose the type of diamond, particle size, and concentration. ■ High polishing rate It has optimal adhesion to the wire, maintaining a high polishing rate. ■ High reproducibility Thanks to our unique formulation, no dispersion processing is required. ■ Water-soluble, environmentally friendly, and easy to maintain *For more details, please feel free to contact us.
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basic information
【Product Characteristics】 - Carrier liquid: Glycol - Typical application: Multi-wire saw - Density: 1.05 g/cm³ - Typical diamond type/abrasive size: MONO-ECO 3 – 6 micron - Typical diamond concentration: 250 cts/l
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Multi-wire saw for slicing SiC ingots
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![Processing example [WSG] Shortening the processing time of SiC wafers and reducing defects!](https://image.mono.ipros.com/public/catalog/image/01/602/646885/IPROS14266027650519435638.png?w=120&h=170)
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Microdiamant, which has contributed to customers through precision classification, has acquired the American CMP-related company Eminess Technology and has become Pureon. In addition to our high-quality diamond-related products, we will also accumulate in-house know-how regarding final finishing CMP. What is important for our customers is the final finish. Even now, we receive inquiries about our diamond polishing because customers want to shorten the CMP process time. In the future, we will comprehensively handle consultations from grinding and polishing to CMP.
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