Semiconductor Encapsulation Resin Mold Dedicated "Mold Laser Cleaner"
Dedicated Semiconductor Encapsulation Resin "Mold Laser Cleaner IMT1200M" <<< Features >>> ■ No need to remove the mold (Insert the laser head into the mold) □ Removal of mold EMC contamination using laser ■ No need for melamine resin or rubber sheets □ High-speed mold cleaning (4 mold sets in under 30 minutes) ■ Reduction of downtime for mold equipment □ Low maintenance costs ■ No waste or odor after cleaning □ No danger to operators ■ Fully automated process □ No damage to the mold
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Dedicated Semiconductor Encapsulation Resin "Mold Laser Cleaner IMT1200M" <<< Features >>> ■ No need to remove the mold (Insert the laser head into the mold) □ Removal of mold EMC contamination using laser ■ No need for melamine resin or rubber sheets □ High-speed mold cleaning (4 mold sets in under 30 minutes) ■ Reduction of mold equipment downtime □ Low maintenance costs ■ No waste or odor after cleaning □ No danger to operators ■ Fully automated process □ No damage to the mold
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Our company provides technical solutions to customers by offering the latest manufacturing and processing technologies and equipment from Europe and the United States to various domestic sectors, including the food and confectionery market, as well as the automotive and aerospace markets. The technologies and equipment we handle are unique and provide high added value through innovative ideas that have no similar products. We have built long-term cooperative relationships with each partner and strive to stay at the forefront of the market by sharing a wide range of information.
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