Surfactant activation bonding device
It can apply a maximum pressure of 1500 kg to an 8-inch wafer and heat it up to a maximum of 1100°C. It is also compatible with ultra-high vacuum.
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basic information
This is a device for joining materials by applying pressure after activating the joining surfaces. The device uses a cluster system and consists of a load lock chamber, activation chamber, alignment chamber, joining chamber (1), joining chamber (2), and transfer chamber.
Price information
-
Delivery Time
P4
Applications/Examples of results
Sensors, micro-machines, SOI devices, for material development.
Company information
The roots of our technology lie in vacuum. In particular, vacuum sealing technology is a crucial final process that affects the quality of LSI and electronic components. Our vacuum sealing equipment has achieved this with high precision, low cost, and high yield, leading to its adoption by major semiconductor manufacturers and marking the beginning of high recognition for our technology.
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