Advanced implementation evaluation TEG (test) chip
Providing mounting solutions from bump-equipped chips compatible with all types of bonding methods to advanced mounting assembly and reliability evaluation.
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basic information
Advanced implementation evaluation TEG (test) chip & evaluation board (FR4, COF, COG boards, etc.)
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Applications/Examples of results
- Implementation process development - Material evaluation - Joint reliability evaluation - Implementation equipment performance evaluation 【Contact Information】 Phone: 03-5715-3501 E-Mail: info@welljp.co.jp Product Information http://well-teg.jp/ Company Information http://www.welljp.co.jp/
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Company information
Well develops and implements a packaging solution business centered on test chips for advanced implementation evaluation, covering everything from bare chip packaging equipment development and contract implementation to reliability evaluation. ~ Corporate Philosophy ~ ■ With "Profitable Relationship" as the core of our management philosophy, we aim to be a company that contributes to the prosperity of our customers and the development of the globally expanding electronics components industry. ■ Through the provision of products that support next-generation semiconductor packaging development, we contribute to the promotion of our customers' development and the enhancement of their profits. ■ We aim to create valuable markets by providing "innovative products" and "cutting-edge services."
![Test chip [for ultra fine pitch WB/FC mounting evaluation]](https://image.mono.ipros.com/public/product/image/54b/135151029/IPROS_15090265310453498000.gif?w=280&h=280)
![Test chip [for ultra fine pitch WB/FC mounting evaluation]](https://image.mono.ipros.com/public/product/image/e58/135151030/IPROS_16186590904543728000.gif?w=280&h=280)
