Advanced implementation evaluation TEG (test) chip
Providing mounting solutions from bump-equipped chips compatible with all types of bonding methods to advanced mounting assembly and reliability evaluation.
Inquire About This Product
basic information
Advanced implementation evaluation TEG (test) chip & evaluation board (FR4, COF, COG boards, etc.)
Price information
-
Delivery Time
Applications/Examples of results
- Implementation process development - Material evaluation - Joint reliability evaluation - Implementation equipment performance evaluation 【Contact Information】 Phone: 03-5715-3501 E-Mail: info@welljp.co.jp Product Information http://well-teg.jp/ Company Information http://www.welljp.co.jp/
catalog（1）
Download All Catalogs
Company information
Well develops and implements a packaging solution business centered on test chips for advanced implementation evaluation, covering everything from bare chip packaging equipment development and contract implementation to reliability evaluation. ~ Corporate Philosophy ~ ■ With "Profitable Relationship" as the core of our management philosophy, we aim to be a company that contributes to the prosperity of our customers and the development of the globally expanding electronics components industry. ■ Through the provision of products that support next-generation semiconductor packaging development, we contribute to the promotion of our customers' development and the enhancement of their profits. ■ We aim to create valuable markets by providing "innovative products" and "cutting-edge services."