Test Chip 【Multi-Type】
Test chip used for wire bonding, gold-plated bumps, gold stud bumps, and multi-purpose applications. ■Wafer size: 6-inch wafer ■Base chip size: 2.13×2.1mm ■Pad pitch: 130μm ■Number of pads: 108 bumps (48 bumps on the inner circumference, 60 bumps on the outer circumference) ■Compatible bump processes: Gold-plated bumps / Gold stud bumps ■Compatible substrate: JKIT Type2 (SIDE A) ■Options: Bump mounting / Dicing processing / Back grinding processing / Surface polyimide film formation (excluding gold-plated bump products) / Can be changed to gallium arsenide wafer (only for gold-plated bump products) ■Main applications: Material development, equipment development, substrate development, package development, process startup/development, promotional data acquisition, etc.
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basic information
The JTEG and JKIT from Hitachi Ultra LSI Systems, which we are introducing here, ceased production of all products as of December 2009. The latest information on Well's original open TEG chip "JCHIP" can be found here: http://well-teg.jp/
Price information
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Applications/Examples of results
Our test chips are standard TEG chips developed to support various methods for SIP development, PKG development, implementation process development, PCB substrate development, implementation and inspection equipment development, and material development applications. They are already being used by over 200 customers both domestically and internationally. We also accept requests for the creation of custom chips with special specifications.
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Company information
Well develops and implements a packaging solution business centered on test chips for advanced implementation evaluation, covering everything from bare chip packaging equipment development and contract implementation to reliability evaluation. ~ Corporate Philosophy ~ ■ With "Profitable Relationship" as the core of our management philosophy, we aim to be a company that contributes to the prosperity of our customers and the development of the globally expanding electronics components industry. ■ Through the provision of products that support next-generation semiconductor packaging development, we contribute to the promotion of our customers' development and the enhancement of their profits. ■ We aim to create valuable markets by providing "innovative products" and "cutting-edge services."
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