Prevention of powder adhesion and improvement of sieving efficiency: Ultrasonic sieving and ultrasonic hopper.
If you are troubled by powder clogging or adhesion issues, this is a must-see! For powder screening processes, reduce clogging and shorten classification time! *Demo units are available for free rental.
An ultrasonic unit that adds special ultrasonic sweep vibrations to each stainless steel mesh wire, effectively improving issues (such as clogging, adhesion, agglomeration, segregation, bridging, etc.) in various environments handling powders! It contributes to resolving troubles like clogging, adhesion, and agglomeration in the powder sieving process, as well as improving yield and reducing time during classification. It achieves dry sieving with high mesh openings such as 20µm and can be installed on large mass production machines like Φ1200. 【Features】 ■ Innovative ultrasonic oscillation 'sweep vibration (30kHz to 38kHz)' ■ Compatible with various applications from lab scale to mass production machines ■ Doubles processing capacity by eliminating clogging (over 10 times capacity increase possible) ■ Significantly improves classification efficiency with fine meshes such as SUS mesh openings of 20μm ■ Excellent maintainability, preventing damage, opening, and collapse of screens due to long-term vibrations ■ Dustproof and waterproof (CE certified, IP65 structure) *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
Related Videos
basic information
【Ultrasonic Oscillator (DGS Model / PNS Model)】 ■Operating Frequency Range: 30kHz to 38kHz ■Maximum Output: 50W, 100W, 200W ■Power Supply: Single-phase 100V, 200V, 230V ±10% (50Hz/60Hz) multi-power supply built-in ■Weight: DGS Model 3.4kg, PNS Model 3.2kg ■Dimensions: 170mm (H) x 280mm (W) x 124mm (D) (*PNS height is 91mm) ■Ambient Temperature: 0℃ to 45℃ (Humidity below 80% at 30℃) ■Safety Standards: CE, IP65 structure 【Ultrasonic Converter (C35-SD8 / C32-HP1 Model / C35-LP1 Model)】 ■Maximum Output: 120W (C35-SD8), 120W (C32-HP1), 60W (C35-LP1) ■Material: Titanium alloy body (C35-SD8, C32-HP1), Aluminum alloy body (C35-LP1) ■Weight: 270g, 510g, 250g ■Dimensions: Φ42mm x 133mm, Φ55mm x 128mm, Φ42mm x 130mm ■Ambient Temperature: 0℃ to 45℃ ■Safety Standards: CE, IP65 structure *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Applications】 ■Coatings ■Battery materials ■Metal materials ■Resin materials ■Pharmaceutical materials/Food materials ■Toners ■Chemical products etc. *For more details, please refer to the PDF document or feel free to contact us.
catalog(5)
Download All CatalogsNews about this product(1)
Company information
UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.