In water, ultrasonic cavitation occurs, allowing for more efficient and easier removal of dirt while maintaining the quality of the screen.
Using the ultrasonic oscillator AGS and converter D35SP1, a dedicated cleaning plate is attached. The cleaning is performed by lightly contacting the surface of the screen submerged in water with this cleaning plate and moving it left and right. 【Features】 ○ Direct application of ultrasonic vibrations to the supply section of powder and granules, an effective measure against clogging and adhesion. ○ Ultrasonic vibration sieves can be supplied by simply bolting onto metal bodies (M8), regardless of size or shape. ○ Continuous oscillation with periodic strong and weak sweep vibrations or pulse impacts further enhances fluidity. ○ Multiple converters can be connected to a single oscillator. ● For more details, please contact us.
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UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.