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  6. Prevention of powder adhesion and improvement of sieving efficiency: Ultrasonic sieving and ultrasonic hopper.

Prevention of powder adhesion and improvement of sieving efficiency: Ultrasonic sieving and ultrasonic hopper.

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last updated:Jan 10, 2024

ユーシー・ジャパン
ユーシー・ジャパン
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If you are troubled by powder clogging or adhesion issues, this is a must-see! For powder screening processes, reduce clogging and shorten classification time! *Demo units are available for free rental.

An ultrasonic unit that adds special ultrasonic sweep vibrations to each stainless steel mesh wire, effectively improving issues (such as clogging, adhesion, agglomeration, segregation, bridging, etc.) in various environments handling powders! It contributes to resolving troubles like clogging, adhesion, and agglomeration in the powder sieving process, as well as improving yield and reducing time during classification. It achieves dry sieving with high mesh openings such as 20µm and can be installed on large mass production machines like Φ1200. 【Features】 ■ Innovative ultrasonic oscillation 'sweep vibration (30kHz to 38kHz)' ■ Compatible with various applications from lab scale to mass production machines ■ Doubles processing capacity by eliminating clogging (over 10 times capacity increase possible) ■ Significantly improves classification efficiency with fine meshes such as SUS mesh openings of 20μm ■ Excellent maintainability, preventing damage, opening, and collapse of screens due to long-term vibrations ■ Dustproof and waterproof (CE certified, IP65 structure) *For more details, please refer to the PDF document or feel free to contact us.

    Sieve/Shaker
1810_138283_ユーシー・ジャパン_2_b.jpg

Prevention of powder adhesion and improvement of sieving efficiency: Ultrasonic sieving and ultrasonic hopper.

1810_138283_ユーシー・ジャパン_2_b.jpg
1810_138283_ユーシー・ジャパン_2_b.jpg
  • Related Link - https://www.uthe.co.jp/
  • Special site - Product/service details - https://pr.mono.ipros.com/uthe/product/

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【Ultrasonic Oscillator (DGS Model / PNS Model)】 ■Operating Frequency Range: 30kHz to 38kHz ■Maximum Output: 50W, 100W, 200W ■Power Supply: Single-phase 100V, 200V, 230V ±10% (50Hz/60Hz) multi-power supply built-in ■Weight: DGS Model 3.4kg, PNS Model 3.2kg ■Dimensions: 170mm (H) x 280mm (W) x 124mm (D) (*PNS height is 91mm) ■Ambient Temperature: 0℃ to 45℃ (Humidity below 80% at 30℃) ■Safety Standards: CE, IP65 structure 【Ultrasonic Converter (C35-SD8 / C32-HP1 Model / C35-LP1 Model)】 ■Maximum Output: 120W (C35-SD8), 120W (C32-HP1), 60W (C35-LP1) ■Material: Titanium alloy body (C35-SD8, C32-HP1), Aluminum alloy body (C35-LP1) ■Weight: 270g, 510g, 250g ■Dimensions: Φ42mm x 133mm, Φ55mm x 128mm, Φ42mm x 130mm ■Ambient Temperature: 0℃ to 45℃ ■Safety Standards: CE, IP65 structure *For more details, please refer to the PDF document or feel free to contact us.

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【Applications】 ■Coatings ■Battery materials ■Metal materials ■Resin materials ■Pharmaceutical materials/Food materials ■Toners ■Chemical products          etc. *For more details, please refer to the PDF document or feel free to contact us.

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Artec ultrasonic vibration sieve

Artec ultrasonic vibration sieve

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Ultrasonic sieve machine [suitable for transportation, supply, cleaning, and molds!]

Ultrasonic sieve machine [suitable for transportation, supply, cleaning, and molds!]

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Ultrasonic sieve machine Ultrasonic oscillator PNS model

Ultrasonic sieve machine Ultrasonic oscillator PNS model

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Ultrasonic Powder Sifter - Ultrasonic Oscillator Series

Ultrasonic Powder Sifter - Ultrasonic Oscillator Series

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[Latest Edition] Free Comprehensive Catalog from UC Japan Co., Ltd.

[Latest Edition] Free Comprehensive Catalog from UC Japan Co., Ltd.

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We will be exhibiting at the International Powder Technology Exhibition Tokyo 2018!

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Exhibition Details ◆ Duration: November 28, 2018 (Wednesday) - November 30 (Friday) 10:00 AM - 5:00 PM ◆ Venue: Tokyo Big Sight, East Halls 1, 2, and 3 ◆ Booth: East Hall 2, J-04 For more details, please contact us.

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ユーシー・ジャパン

ユーシー・ジャパン

Testing, Analysis and Measurement

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UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.

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