This vacuum laminator uses vacuum to bond films without bubbles on build-up substrates with uneven surfaces, wafer bonding, COF/FPC substrates, and more.
This vacuum laminator is a device that adheres films without bubbles under vacuum to build-up substrates with uneven surfaces, wafer bonding, COF/FPC substrates, and more.
Inquire About This Product
basic information
This vacuum laminator is a device that adheres films without bubbles under vacuum to build-up substrates with uneven surfaces, wafer bonding, COF/FPC substrates, etc. It can laminate either in single sheets or continuously. Additionally, by adding a winding and unwinding device, continuous roll-to-roll lamination is possible even in a batch process. For other functions and details, please contact us or refer to the catalog. (Contact: Kawaguchi)
Price information
-
Delivery Time
P4
Applications/Examples of results
For more details, please contact us.
catalog（3）
Download All Catalogs
Company information
The next generation concept, the originality of technological development, the provision of new values... MCK, equipped with a high-level development base, has the know-how to materialize and create all of these. MCK's lamination thrives in various scenes. It constantly senses the forefront of the times and contributes to the development of industrial society.
![[VOC Exhaust Gas Treatment Device] Catalytic Combustion Type Deodorization Device [CT Series]](https://image.mono.ipros.com/public/product/image/854/2001482680/IPROS61321671107423185282.jpeg?w=280&h=280)
