Uncompromising quality and cost performance.
Ars Electronics provides semiconductor assembly solutions that achieve uncompromising quality and high cost performance at a high level. We manufacture advanced processes such as dicing, die attach, wire bonding, mold encapsulation, and final testing for semiconductors (IC/LSI) using state-of-the-art equipment. Within a consistent production system, we respond flexibly and optimally to our customers' diverse needs.
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basic information
【Features】 ◯ Flexible semiconductor package assembly that responds to a wide range of variable small lots to mass production. ◯ We collaborate with customers from design development to prototyping and mass production. ◯ We offer new proposals for existing packages and support for new development products. ● For more details, please contact us.
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Applications/Examples of results
Semiconductor assembly
Company information
"ARS" is a Latin word that serves as the origin for "ART = art, skill." The company name "Ars" embodies our aspiration to be a group that pursues creative technology that radiates artistic brilliance. Ars Corporation is a subcontractor in the electronic device industry, specializing in semiconductor assembly, wafer reliability evaluation, and SMT implementation of electronic devices. The company was founded in 1972 as "Ars Precision Co., Ltd." focusing on the assembly of camera shutters. In 1979, we expanded into semiconductor packaging, in 1985 into SMT implementation of electronic devices, and further into wafer reliability evaluation in 1989. Manufacturing requires low cost, high quality, and the ability to respond to evolving technologies and diverse needs. This begins with a thorough commitment to every aspect, from manufacturing lead times to quality. We also consider the entire process from semiconductor back-end processes to electronic device assembly, and strive to provide technology and support systems that ensure our customers' peace of mind.