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  6. High-Density Substrate Mounting - Assembly and Inspection

High-Density Substrate Mounting - Assembly and Inspection

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last updated:Aug 04, 2020

小橋電機 磯部工場
小橋電機 磯部工場
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We respond flexibly to the quality demanded by our customers and the changing delivery requirements, achieving a 100% compliance rate for requested delivery dates.

Our strength lies in our integrated production system, which encompasses everything from the assembly of fine chips (0603) to large QFP, BGA, and CSP, as well as board assembly and unit assembly. Additionally, we have inline automated optical inspection equipment to work on stabilizing and improving assembly quality. SMT assembly: 3 lines with a monthly capacity of 40 million shots (24-hour operation). We can flexibly accommodate everything from prototypes to mass production. We can also propose cost reduction and quality improvement suggestions.

    Other electronic partsEMSProcessing Contract
名称未設定

High-Density Substrate Mounting - Assembly and Inspection

名称未設定 2.jpg
名称未設定 2.jpg
  • Related Link - http://www.kobashi.co.jp/

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basic information

【Features】 ○ Connection line of high-speed chip mounters and multifunctional odd-form mounters ○ Proven track record ○ Inline integration of PCB appearance inspection machines. ● For other functions and details, please contact us.

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Please feel free to contact us.

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※Please feel free to contact us.

Applications/Examples of results

【Usage】 ○ Circuit board assembly ● For other functions and details, please contact us.

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小橋電機

小橋電機 磯部工場

Manufacturing and processing contract

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We are primarily engaged in contract manufacturing services (EMS) for electrical machinery and electronic devices through domestic production. We are a contract manufacturer capable of consistent production from high-density substrate mounting to finished product assembly for various industries, including industrial equipment, information and communication devices, and amusement machines. Additionally, our solder printing inspection machines and appearance inspection machines in the mounting process have been integrated inline in a 3D type, achieving high quality. Furthermore, we can accommodate reflow atmospheres in a nitrogen environment.

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