A new type of ultrasonic sieve machine that maximally utilizes the features of Artec.
Ultrasonic Powder Sifter: Clogging Prevention, Standard JIS Sifting, Mesh Cleaning ◆Features - The ultrasonic transducer converter is positioned outside the contact powder area - Approximately 1.5 times the processing capacity with the same mesh area as conventional machines - Easy to attach and detach - No tapping balls required - Available in sizes φ500, φ700, and φ1000 For more details, please download the catalog.
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Download All Catalogs![Ultrasonic sieve machine [suitable for transportation, supply, cleaning, and molds!]](https://image.mono.ipros.com/public/catalog/image/01/0e3/33836/IPROS17583223056302832027.PNG?w=120&h=170)
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UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.
