Rinco's new top-of-the-line ultrasonic plastic welding machine.
Introducing the ultrasonic plastic welder, horn, cutter, sealer, and hand unit. Equipped with a high-performance oscillator that allows for a variety of parameter settings in different plastic welding modes, it features graphic displays of welding time, melt amount, and energy, as well as data statistical functions through dedicated PC software, enabling comprehensive database management. With a highly rigid welding stand and a pneumatic high-leg actuator, it boasts a welding finish accuracy within ±10μm at a pressure increment of 1N. For more details, please download the catalog.
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UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.