The bonding process can be performed with a single machine, enabling stable bonding!
In addition to various sizes (φ2 inches, φ3 inches, φ4 inches, φ6 inches), we can also manufacture multiple wafer bonding, such as one, three, or five pieces, according to customer requests. The bonding process is performed with a single machine, which includes (1) heating the carrier plate, (2) applying wax, (3) positioning the workpiece, (4) applying pressure, and (5) cooling, enabling stable bonding.
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basic information
【Features】 ○ Uses solid wax to reduce running costs ○ Enables simple and precise bonding ○ Performs the main pressing process in a vacuum chamber to minimize air remaining in the wafer ○ Cooling is standardly equipped with a chiller unit ● For other functions and details, please contact us.
Price information
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Delivery Time
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Applications/Examples of results
【Purpose】 ○ A device that performs the processes of heating the carrier plate, applying wax, positioning the workpiece, applying pressure, and cooling, all in one unit. ● For other functions and details, please contact us.
Company information
As a manufacturer of horizontal surface grinding machines, high-speed precision grinding machines, diamond slurry, and bonding machines, we provide not only the technology to make various substrate materials required by customers in advanced technologies such as semiconductors and optical communications "thinner," but also processing know-how to solve our customers' problems.
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