A new method that achieves fine pitch bumps with a 50μm pitch.
Unlike the conventional paste method, it achieves cost reduction due to being maskless.
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basic information
【Features】 ○ Unlike the ball method, dedicated mounting jigs for each substrate are not required. ○ In addition to SnAgCu alloys, low-temperature solder bumps can also be produced. ○ Achieves 50μm pitch bumps that were impossible with the paste method. ○ Compared to the paste method, there is less variation in film thickness and solder volume. ○ No masks or dedicated mounting jigs are needed, and alignment is also unnecessary. ● For more details, please refer to the catalog or contact us.
Price information
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Company information
**Environmental Philosophy** Our company recognizes that the preservation of the global environment is a crucial mission shared by all humanity. Under this mission, we will do our utmost to contribute to the formation of a circular society by harmonizing nature with our business activities and leaving a rich Earth for future generations. **Environmental Policy** 1. We will comply with environmental-related laws and regulations and strive to achieve self-imposed management standards as necessary. We will also adhere to commitments made in environmental agreements with local communities. 2. We will establish the following key themes, which have a significant impact on the environment, as priorities in our business activities: 1) Promotion of energy conservation and resource saving 2) Reduction of waste emissions 3) Reduction of the use of specified chemical substances 3. We will promote environmental management activities based on ISO 14001, focusing on continuous improvement and pollution prevention. 4. We will communicate with the local community and cooperate in creating towns that are friendly to both people and nature. 5. We will set environmental objectives and targets and review them as necessary.
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