Reliability evaluation and failure analysis of solder joints in electronic components and mounted circuit boards.
[4/5 Seminar] Learning from the Basics of Reliability and Actual Failure Analysis Examples
A seminar to meet the increasingly stringent "demands for reliability" as miniaturization and high performance progress! 【Target audience → Individuals involved in quality assurance, quality control, analysis, failure analysis, design technology, and research and development in companies related to electronic devices, components, electronic materials, and solder mounting.】
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【Date】 April 5, 2011 (Tuesday) 10:30 AM - 5:30 PM 【Venue】 Japan Techno Center Training Room 22nd Floor, Odakyu Dai-ichi Seimei Building, 2-7-1 Nishi-Shinjuku, Shinjuku-ku, Tokyo 【Acquired Knowledge】 Evaluation methods for solder joints, concepts for defect analysis 【Program】 I) Reliability testing methods for electronic components II) Key technologies for environmental resistance/high-density mounting III) Evaluation techniques for lead-free solder mounting IV) Evaluation techniques for electronic components and materials V) Summary VI) Q&A ■□■ For details, please request materials or contact us ■□■
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We are committed to conveying the specialized technical information and skills that our customers require through seminars, publications, and media such as software, and by providing timely services, we aim to ensure that our customers feel the necessity of our company. Furthermore, our corporate vision is to network the valuable knowledge and know-how of engineers and researchers, what is known as humanware and technology, to build an advanced society.
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