Compound semiconductor wafer polishing device, tape-type polishing device for small wafers.
SYO-125
[Made in Japan] Precision Grinding Tape Used
This is a space-saving, low-cost tape-type precision grinding device specialized for bevel grinding and oil-free grinding.
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basic information
【Features】 ● Achieves stable surface roughness with a consistently fresh abrasive surface ● Compatible with outer circumference and orifice ● Ideal for forming compound semiconductor end faces *For more details, please contact us.
Price information
Please feel free to contact us.
Delivery Time
※Please feel free to contact us.
Applications/Examples of results
Polishing of compounds and semiconductor wafers - Compatible with silicon carbide, silicon wafers, sapphire, glass, etc.
Company information
Since our establishment, we have accumulated technology and know-how as a precision polishing manufacturer in the semiconductor and liquid crystal industries. Leveraging that know-how, we supply precision polishing equipment not only for metal precision polishing but also for semiconductor wafer polishing, compound semiconductor polishing, semiconductor and liquid crystal panel polishing, shaft polishing, sample polishing, and other industries. Being a Japanese product, and specifically made in Wakayama Prefecture, we offer specifications that cater to specific needs. Because we handle design, electrical, materials, manufacturing, and sales all in-house, we can flexibly accommodate custom specifications. In addition, in our control division, we provide maintenance and equipment modifications for existing customer equipment, as well as PLC replacements, utilizing the technology developed through our equipment development. We are dedicated to a customer-first philosophy, striving to improve without being confined to our own designed equipment or specific fields. If you have any polishing concerns, please reach out to IMT first.
