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  6. Deprotection Reaction Analysis Device PAGA Series

Deprotection Reaction Analysis Device PAGA Series

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last updated:Aug 31, 2022

リソテックジャパン
リソテックジャパン
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We provide various devices for advanced evaluation of photoresists.

The Deprotection Reaction Analysis Device PAGA series features in-situ reaction analysis using PEB and 248mm exposure, as well as the capability to calculate deprotection reaction parameters. A bake plate is placed in the FT-IR chamber, allowing for the observation of functional group changes while heating. Additionally, it is equipped with a UV (248nm) irradiation device, which can also be used to analyze mechanisms of acid generation during exposure. For more details, please contact us or refer to the catalog.

    Spectroscopic Analysis EquipmentOther process controls
PAGA-100.jpg

Deprotection Reaction Analysis Device PAGA Series

PAGA-100.jpg
PAGA-100.jpg
  • Related Link - https://www.ltj.co.jp/resist.php?eid=00003#product…

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**Main Features** - In-situ reaction analysis using PEB and 248mm exposure - Function for calculating deprotection reaction parameters **Other Features** - A bake plate is placed in the FT-IR chamber, allowing observation of functional group changes while heating. - It is equipped with a UV (248nm) irradiation device, which can also be used to analyze mechanisms of acid generation during exposure. - Measurement is possible with a resist film thickness of 75nm. - Ideal for analyzing ultra-thin resist processes like EUV lithography. For more details, please contact us or refer to the catalog.

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リソテックジャパン

リソテックジャパン

Electronic Components and Semiconductors

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Riso Tech Japan, since its establishment, has been a specialist in lithography, providing not only resist exposure/development analysis equipment, resist coaters/developers, and lithography simulators, but also evaluation of exposure/development materials for cutting-edge lithography processes. In particular, for resist processing equipment, we propose optimal specifications tailored to customer needs, adapting spin coaters, developers, bake (PEB) equipment, and film thickness measurement to various fields, ranging from development experimental equipment to fully automated production systems. For example, we offer coating equipment for various substrates such as ultra-thin silicon wafers, various compound semiconductors, quartz, sapphire, and piezoelectric substrates (SAW), including ArF resist, EB resist, high-viscosity thick-film resist, polyimide, insulating films, and wax, as well as development equipment for alkaline, inorganic, and organic materials. Additionally, we provide various process units such as HMDS treatment, vacuum bake, UV irradiation, and high-temperature bake processing.

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